Muhammad Mahyiddin Ramli
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Preferred name
Muhammad Mahyiddin Ramli
Official Name
Muhammad Mahyiddin, Ramli
Alternative Name
Ramli, Muhammad Mahyiddin
Ramli, M. Muhammad
Ramli, M. M.
Ramli, M.
Ramli, Muhammad Mahyidin
Mahyiddin Ramli, Mohd
Ramli, Muhammad M.
Main Affiliation
Scopus Author ID
55891565000
Researcher ID
AAH-1285-2021

Research Output
Now showing 1 - 5 of 5
  • Publication
    Effect of Ni on the suppression of sn whisker formation in Sn-0.7Cu solder joint
    ( 2021)
    Aimi Noorliyana Hashim
    ;
    Mohd Arif Anuar Mohd Salleh
    ;
    Andrei Victor Sandu
    ;
    Muhammad Mahyiddin Ramli
    ;
    Khor Chu Yee
    ;
    Noor Zaimah Mohd Mokhtar
    ;
    Jitrin Chaiprapa
    The evolution of internal compressive stress from the intermetallic compound (IMC) Cu6Sn5 growth is commonly acknowledged as the key inducement initiating the nucleation and growth of tin (Sn) whisker. This study investigates the effect of Sn-0.7Cu-0.05Ni on the nucleation and growth of Sn whisker under continuous mechanical stress induced. The Sn-0.7Cu-0.05Ni solder joint has a noticeable effect of suppression by diminishing the susceptibility of nucleation and growth of Sn whisker. By using a synchrotron micro X-ray fluorescence (µ-XRF) spectroscopy, it was found that a small amount of Ni alters the microstructure of Cu6Sn5 to form a (Cu,Ni)6Sn5 intermetallic layer. The morphology structure of the (Cu,Ni)6Sn5 interfacial intermetallic layer and Sn whisker growth were investigated by scanning electron microscope (SEM) in secondary and backscattered electron imaging mode, which showed that there is a strong correlation between the formation of Sn whisker and the composition of solder alloy. The thickness of the (Cu,Ni)6Sn5 IMC interfacial layer was relatively thinner and more refined, with a continuous fine scallop-shaped IMC interfacial layer, and consequently enhanced a greater incubation period for the nucleation and growth of the Sn whisker. These verification outcomes proposes a scientifically foundation to mitigate Sn whisker growth in lead-free solder joint.
  • Publication
    The Effect of GO/TiO2 Thin Film During Photodegradation of Methylene Blue Dye
    ( 2021)
    Azliza Azani
    ;
    Dewi Suriyani Che Halin
    ;
    Mohd. Mustafa Al Bakri Abdullah
    ;
    Kamrosni Abdul Razak
    ;
    Mohd Fairul Sharin Abdul Razak
    ;
    V Chobpattana
    ;
    Mohd Arif Anuar Mohd Salleh
    ;
    Muhammad Mahyiddin Ramli
    Titanium (IV) isopropoxide (TTIP) was used to synthesize GO/TiO2 thin films using a sol-gel spin-coating method onto a glass substrate, undergoing an heat tretment at 350 °C. Several amounts of graphene oxide (GO) (0-20mg) were weighed into a sol solution of TiO2 to produce GO/TiO2 thin films. The thin film samples were characterized by X-ray diffraction (XRD) to analyze the samples’ phase and by scanning electron microscopy (SEM) to analyze the samples’ microstructure. Physical testing such as water contact angle (WCA) was analyzed using an optical microscope with J-Image software. In contrast, the optical band gap and photodegradation of methylene blue under sunlight irradiation of the thin film was analyzed using UV-VIS spectrophotometry. GO5 thin film sample showed low-intensity anatase phase formation, where the microstructure revealed a larger surface area with the addition of GO. WCA reveals that GO/TiO2 thin film exhibits super hydrophilic properties where the angle decreases from 37.83° to 4.11°. The optical result shows that GO has improved the absorption edges by expanding into visible regions. Moreover, due to the existence of GO 3.30 eV band gap energy of TiO2 decreases from to 3.18 eV obtained by GO5. The improved adsorption edge allows Ti3+, O2 and interstitial states to be formed in low valence states with energy underneath than in the TiO2 band gap. Therefore, the photodegradation of methylene blue (MB) dye increases from 48 % to 59 % in the GO/TiO2 thin film.
  • Publication
    Production of low temperature synthetic graphite
    ( 2023-04)
    Anis Syafiqa Rosman
    ;
    Ranjitha Navalan
    ;
    Muhammad Mahyiddin Ramli
    ;
    Norizah Abd Karim
    ;
    Mohd Fairus Ahmad
    ;
    Shazlina Johari
    ;
    Norshamsuri Ali @ Hasim
    ;
    Nurul Huda Osman
    Synthetic graphite is a material consisting of graphitic carbon which has been obtained by graphitizing a non-graphitic carbon. The growth in demand, particularly in customizing properties for certain usage has brought about research on viable alternative, low-cost, and environmentally pleasant synthetic graphite production. Biomass wastes are amongst appealing carbon precursors which have been broadly checked out as replacement carbon for graphite production. This research aimed to synthesize synthetic graphite from oil palm trunks at low temperatures (500 °C, 400 °C and 300 °C) under controlled conditions to determine the physical properties and properties of the graphite obtained. After the heat treatment process, the obtained samples were then characterized by using XRD, SEM and RAMAN characterizations. Based on SEM and RAMAN characterization, it can be seen that graphite that undergoes a 500 °C pyrolysis process shows the best results compare to graphite that undergoes a pyrolysis process at the temperatures of 300 °C and 400 °C. The graphite flakes and the peaks obtained for 500 °C graphite are obviously present. For XRD characterization, the best samples at 500 °C were chosen to be characterized. From the results, the sample shows slight behavior imitating the commercialized graphite. Hence, from the characterizations of the samples, it can be concluded that the best synthetic graphite produced was from the oil palm trunks heated at 500 ° C
  • Publication
    Effect of isothermal annealing on Sn whisker growth behavior of Sn0.7Cu0.05Ni solder joint
    ( 2023)
    Aimi Noorliyana Hashim
    ;
    Mohd Arif Anuar Mohd Salleh
    ;
    Muhammad Mahyiddin Ramli
    ;
    Mohd. Mustafa Al Bakri Abdullah
    ;
    Andrei Victor Sandu
    ;
    Petrica Vizureanu
    ;
    Ioan Gabriel Sandu
    This paper presents an assessment of the effect of isothermal annealing of Sn whisker growth behavior on the surface of Sn0.7Cu0.05Ni solder joints using the hot-dip soldering technique. Sn0.7Cu and Sn0.7Cu0.05Ni solder joints with a similar solder coating thickness was aged up to 600 h in room temperature and annealed under 50 °C and 105 °C conditions. Through the observations, the significant outcome was the suppressing effect of Sn0.7Cu0.05Ni on Sn whisker growth in terms of density and length reduction. The fast atomic diffusion of isothermal annealing consequently reduced the stress gradient of Sn whisker growth on the Sn0.7Cu0.05Ni solder joint. It was also established that the smaller (Cu,Ni)6Sn5 grain size and stability characteristic of hexagonal η-Cu6Sn5 considerably contribute to the residual stress diminished in the (Cu,Ni)6Sn5 IMC interfacial layer and are able to suppress the growth of Sn whiskers on the Sn0.7Cu0.05Ni solder joint. The findings of this study provide environmental acceptance with the aim of suppressing Sn whisker growth and upsurging the reliability of the Sn0.7Cu0.05Ni solder joint at the electronic-device-operation temperature.
  • Publication
    Effect of Ni on the suppression of Sn whisker formation in Sn-0.7Cu solder joint
    ( 2021)
    Aimi Noorliyana Hashim
    ;
    Mohd Arif Anuar Mohd Salleh
    ;
    Andrei Victor Sandu
    ;
    Muhammad Mahyiddin Ramli
    ;
    Khor Chu Yee
    ;
    Noor Zaimah Mohd Mokhtar
    ;
    Jitrin Chaiprapa
    The evolution of internal compressive stress from the intermetallic compound (IMC) Cu6Sn5 growth is commonly acknowledged as the key inducement initiating the nucleation and growth of tin (Sn) whisker. This study investigates the effect of Sn-0.7Cu-0.05Ni on the nucleation and growth of Sn whisker under continuous mechanical stress induced. The Sn-0.7Cu-0.05Ni solder joint has a noticeable effect of suppression by diminishing the susceptibility of nucleation and growth of Sn whisker. By using a synchrotron micro X-ray fluorescence (µ-XRF) spectroscopy, it was found that a small amount of Ni alters the microstructure of Cu6Sn5 to form a (Cu,Ni)6Sn5 intermetallic layer. The morphology structure of the (Cu,Ni)6Sn5 interfacial intermetallic layer and Sn whisker growth were investigated by scanning electron microscope (SEM) in secondary and backscattered electron imaging mode, which showed that there is a strong correlation between the formation of Sn whisker and the composition of solder alloy. The thickness of the (Cu,Ni)6Sn5 IMC interfacial layer was relatively thinner and more refined, with a continuous fine scallop-shaped IMC interfacial layer, and consequently enhanced a greater incubation period for the nucleation and growth of the Sn whisker. These verification outcomes proposes a scientifically foundation to mitigate Sn whisker growth in lead-free solder joint.