Mohd Arif Anuar Mohd Salleh
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Preferred name
Mohd Arif Anuar Mohd Salleh
Official Name
Mohd Arif Anuar, Mohd Salleh
Alternative Name
Mohd Salleh, Mohd Arif Anuar
Salleh, Mohd A.A.
Salleh, M. A.A.Mohd
Mohd Salleh, M. A.A.
Salleh, M. A.A.M.
Mohd Salleh, M. M.A.
Main Affiliation
Scopus Author ID
55543476900
Researcher ID
C-3386-2018

Research Output
Now showing 1 - 10 of 23
  • Publication
    Performance of Sn-3.0Ag-0.5Cu composite solder with kaolin geopolymer ceramic reinforcement on microstructure and mechanical properties under isothermal ageing
    ( 2021)
    Nur Syahirah Mohamad Zaimi
    ;
    Mohd Arif Anuar Mohd Salleh
    ;
    Andrei Victor Sandu
    ;
    Mohd Mustafa Al Bakri Abdullah
    ;
    Norainiza Saud
    ;
    Shayfull Zamree Abd Rahim
    ;
    Petrica Vizureanu
    ;
    Rita Mohd Said
    ;
    Mohd Izrul Izwan Ramli
    This paper elucidates the effect of isothermal ageing at temperature of 85 °C, 125 °C and 150 °C for 100, 500 and 1000 h on Sn-3.0Ag-0.5Cu (SAC305) lead-free solder with the addition of 1 wt% kaolin geopolymer ceramic (KGC) reinforcement particles. SAC305-KGC composite solders were fabricated through powder metallurgy using a hybrid microwave sintering method and reflowed on copper substrate printed circuit board with an organic solderability preservative surface finish. The results revealed that, the addition of KGC was beneficial in improving the total thickness of interfacial intermetallic compound (IMC) layer. At higher isothermal ageing of 150 °C and 1000 h, the IMC layer in SAC305-KGC composite solder was towards a planar-type morphology. Moreover, the growth of total interfacial IMC layer and Cu3Sn layer during isothermal ageing was found to be controlled by bulk diffusion and grain-boundary process, respectively. The activation energy possessed by SAC305-KGC composite solder for total interfacial IMC layer and Cu3Sn IMC was 74 kJ/mol and 104 kJ/mol, respectively. Based on a lap shear test, the shear strength of SAC305-KGC composite solder exhibited higher shear strength than non-reinforced SAC305 solder. Meanwhile, the solder joints failure mode after shear testing was a combination of brittle and ductile modes at higher ageing temperature and time for SAC305-KGC composite solder.
  • Publication
    Strength development and elemental distribution of Dolomite/Fly Ash geopolymer composite under elevated temperature
    ( 2020)
    Emy Aizat Azimi
    ;
    Mohd. Mustafa Al Bakri Abdullah
    ;
    Petrica Vizureanu
    ;
    Mohd Arif Anuar Mohd Salleh
    ;
    Andrei Victor Sandu
    ;
    Jitrin Chaiprapa
    ;
    Sorachon Yoriya
    ;
    Kamarudin Hussin
    ;
    Ikmal Hakem Aziz
    A geopolymer has been reckoned as a rising technology with huge potential for application across the globe. Dolomite refers to a material that can be used raw in producing geopolymers. Nevertheless, dolomite has slow strength development due to its low reactivity as a geopolymer. In this study, dolomite/fly ash (DFA) geopolymer composites were produced with dolomite, fly ash, sodium hydroxide, and liquid sodium silicate. A compression test was carried out on DFA geopolymers to determine the strength of the composite, while a synchrotron Micro-Xray Fluorescence (Micro-XRF) test was performed to assess the elemental distribution in the geopolymer composite. The temperature applied in this study generated promising properties of DFA geopolymers, especially in strength, which displayed increments up to 74.48 MPa as the optimum value. Heat seemed to enhance the strength development of DFA geopolymer composites. The elemental distribution analysis revealed exceptional outcomes for the composites, particularly exposure up to 400 °C, which signified the homogeneity of the DFA composites. Temperatures exceeding 400 °C accelerated the strength development, thus increasing the strength of the DFA composites. This appears to be unique because the strength of ordinary Portland Cement (OPC) and other geopolymers composed of other raw materials is typically either maintained or decreases due to increased heat.
  • Publication
    Strength development and elemental distribution of Dolomite/Fly Ash geopolymer composite under elevated temperature
    ( 2020)
    Emy Aizat Azimi
    ;
    Mohd. Mustafa Al Bakri Abdullah
    ;
    Petrica Vizureanu
    ;
    Mohd Arif Anuar Mohd Salleh
    ;
    Jitrin Chaiprapa
    ;
    Sorachon Yoriya
    ;
    Andrei Victor Sandu
    ;
    Kamarudin Hussin
    ;
    Ikmal Hakem Aziz
    A geopolymer has been reckoned as a rising technology with huge potential for application across the globe. Dolomite refers to a material that can be used raw in producing geopolymers. Nevertheless, dolomite has slow strength development due to its low reactivity as a geopolymer. In this study, dolomite/fly ash (DFA) geopolymer composites were produced with dolomite, fly ash, sodium hydroxide, and liquid sodium silicate. A compression test was carried out on DFA geopolymers to determine the strength of the composite, while a synchrotron Micro-Xray Fluorescence (Micro-XRF) test was performed to assess the elemental distribution in the geopolymer composite. The temperature applied in this study generated promising properties of DFA geopolymers, especially in strength, which displayed increments up to 74.48 MPa as the optimum value. Heat seemed to enhance the strength development of DFA geopolymer composites. The elemental distribution analysis revealed exceptional outcomes for the composites, particularly exposure up to 400 °C, which signified the homogeneity of the DFA composites. Temperatures exceeding 400 °C accelerated the strength development, thus increasing the strength of the DFA composites. This appears to be unique because the strength of ordinary Portland Cement (OPC) and other geopolymers composed of other raw materials is typically either maintained or decreases due to increased heat.
  • Publication
    Performance of Sn-3.0Ag-0.5Cu composite solder with Kaolin geopolymer ceramic reinforcement on microstructure and mechanical properties under isothermal ageing
    ( 2021)
    Nur Syahirah Mohamad Zaimi
    ;
    Mohd Arif Anuar Mohd Salleh
    ;
    Andrei Victor Sandu
    ;
    Mohd. Mustafa Al Bakri Abdullah
    ;
    Norainiza Saud
    ;
    Shayfull Zamree Abd. Rahim
    ;
    Petrica Vizureanu
    ;
    Rita Mohd Said
    ;
    Mohd Izrul Izwan Ramli
    This paper elucidates the effect of isothermal ageing at temperature of 85 °C, 125 °C and 150 °C for 100, 500 and 1000 h on Sn-3.0Ag-0.5Cu (SAC305) lead-free solder with the addition of 1 wt% kaolin geopolymer ceramic (KGC) reinforcement particles. SAC305-KGC composite solders were fabricated through powder metallurgy using a hybrid microwave sintering method and reflowed on copper substrate printed circuit board with an organic solderability preservative surface finish. The results revealed that, the addition of KGC was beneficial in improving the total thickness of interfacial intermetallic compound (IMC) layer. At higher isothermal ageing of 150 °C and 1000 h, the IMC layer in SAC305-KGC composite solder was towards a planar-type morphology. Moreover, the growth of total interfacial IMC layer and Cu3Sn layer during isothermal ageing was found to be controlled by bulk diffusion and grain-boundary process, respectively. The activation energy possessed by SAC305-KGC composite solder for total interfacial IMC layer and Cu3Sn IMC was 74 kJ/mol and 104 kJ/mol, respectively. Based on a lap shear test, the shear strength of SAC305-KGC composite solder exhibited higher shear strength than non-reinforced SAC305 solder. Meanwhile, the solder joints failure mode after shear testing was a combination of brittle and ductile modes at higher ageing temperature and time for SAC305-KGC composite solder.
  • Publication
    Effect of Ni on the suppression of sn whisker formation in Sn-0.7Cu solder joint
    ( 2021)
    Aimi Noorliyana Hashim
    ;
    Mohd Arif Anuar Mohd Salleh
    ;
    Andrei Victor Sandu
    ;
    Muhammad Mahyiddin Ramli
    ;
    Khor Chu Yee
    ;
    Noor Zaimah Mohd Mokhtar
    ;
    Jitrin Chaiprapa
    The evolution of internal compressive stress from the intermetallic compound (IMC) Cu6Sn5 growth is commonly acknowledged as the key inducement initiating the nucleation and growth of tin (Sn) whisker. This study investigates the effect of Sn-0.7Cu-0.05Ni on the nucleation and growth of Sn whisker under continuous mechanical stress induced. The Sn-0.7Cu-0.05Ni solder joint has a noticeable effect of suppression by diminishing the susceptibility of nucleation and growth of Sn whisker. By using a synchrotron micro X-ray fluorescence (µ-XRF) spectroscopy, it was found that a small amount of Ni alters the microstructure of Cu6Sn5 to form a (Cu,Ni)6Sn5 intermetallic layer. The morphology structure of the (Cu,Ni)6Sn5 interfacial intermetallic layer and Sn whisker growth were investigated by scanning electron microscope (SEM) in secondary and backscattered electron imaging mode, which showed that there is a strong correlation between the formation of Sn whisker and the composition of solder alloy. The thickness of the (Cu,Ni)6Sn5 IMC interfacial layer was relatively thinner and more refined, with a continuous fine scallop-shaped IMC interfacial layer, and consequently enhanced a greater incubation period for the nucleation and growth of the Sn whisker. These verification outcomes proposes a scientifically foundation to mitigate Sn whisker growth in lead-free solder joint.
  • Publication
    Performance of Sn-3.0Ag-0.5Cu somposite solder with kaolin geopolymer ceramic reinforcement on microstructure and mechanical properties under isothermal ageing
    ( 2021)
    Nur Syahirah Mohamad Zaimi
    ;
    Mohd Arif Anuar Mohd Salleh
    ;
    Andrei Victor Sandu
    ;
    Mohd. Mustafa Al Bakri Abdullah
    ;
    Norainiza Saud
    ;
    Shayfull Zamree Abd. Rahim
    ;
    Petrica Vizureanu
    ;
    Mohd Izrul Izwan Ramli
    ;
    Rita Mohd Said
    This paper elucidates the effect of isothermal ageing at temperature of 85 °C, 125 °C and 150 °C for 100, 500 and 1000 h on Sn-3.0Ag-0.5Cu (SAC305) lead-free solder with the addition of 1 wt% kaolin geopolymer ceramic (KGC) reinforcement particles. SAC305-KGC composite solders were fabricated through powder metallurgy using a hybrid microwave sintering method and reflowed on copper substrate printed circuit board with an organic solderability preservative surface finish. The results revealed that, the addition of KGC was beneficial in improving the total thickness of interfacial intermetallic compound (IMC) layer. At higher isothermal ageing of 150 °C and 1000 h, the IMC layer in SAC305-KGC composite solder was towards a planar-type morphology. Moreover, the growth of total interfacial IMC layer and Cu3Sn layer during isothermal ageing was found to be controlled by bulk diffusion and grain-boundary process, respectively. The activation energy possessed by SAC305-KGC composite solder for total interfacial IMC layer and Cu3Sn IMC was 74 kJ/mol and 104 kJ/mol, respectively. Based on a lap shear test, the shear strength of SAC305-KGC composite solder exhibited higher shear strength than non-reinforced SAC305 solder. Meanwhile, the solder joints failure mode after shear testing was a combination of brittle and ductile modes at higher ageing temperature and time for SAC305-KGC composite solder.
  • Publication
    Contribution of interfacial bonding towards geopolymers properties in geopolymers reinforced fibers: a review
    ( 2022)
    Muhd Hafizuddin Yazid
    ;
    Meor Ahmad Faris bin Meor Ahmad Tajudin
    ;
    Mohd. Mustafa Al Bakri Abdullah
    ;
    Marcin Nabiałek
    ;
    Shayfull Zamree Abd. Rahim
    ;
    Mohd Arif Anuar Mohd Salleh
    ;
    Marwan Kheimi
    ;
    Andrei Victor Sandu
    ;
    Adam Rylski
    ;
    Bartłomiej Jeż
    There is a burgeoning interest in the development of geopolymers as sustainable construction materials and incombustible inorganic polymers. However, geopolymers show quasi-brittle behavior. To overcome this weakness, hundreds of researchers have focused on the development, characterization, and implementation of geopolymer-reinforced fibers for a wide range of applications for light geopolymers concrete. This paper discusses the rapidly developing geopolymer-reinforced fibers, focusing on material and geometrical properties, numerical simulation, and the effect of fibers on the geopolymers. In the section on the effect of fibers on the geopolymers, a comparison between single and hybrid fibers will show the compressive strength and toughness of each type of fiber. It is proposed that interfacial bonding between matrix and fibers is important to obtain better results, and interfacial bonding between matrix and fiber depends on the type of material surface contact area, such as being hydrophobic or hydrophilic, as well as the softness or roughness of the surface.
  • Publication
    Metakaolin/sludge based geopolymer adsorbent on high removal efficiency of Cu2+
    ( 2022)
    Pilomeena Arokiasamy
    ;
    Mohd. Mustafa Al Bakri Abdullah
    ;
    Shayfull Zamree Abd. Rahim
    ;
    Mohd Remy Rozainy Mohd Arif Zainol
    ;
    Mohd Arif Anuar Mohd Salleh
    ;
    Marwan Kheimi
    ;
    Andrei Victor Sandu
    ;
    Petrica Vizureanu
    ;
    Rafiza Abdul Razak
    ;
    Noorina Hidayu Jamil
    Activated carbon (AC) has received a lot of interest from researchers for the removal of heavy metals from wastewater due to its abundant porous structure. However, it was found unable to meet the required adsorption capacity due to its amorphous structure which restricts the fundamental studies and structural optimization for improved removal performance. In addition, AC is not applicable in large scale wastewater treatment due its expensive synthesis and difficulty in regeneration. Thus, the researchers are paying more attention in synthesis of low cost geopolymer based adsorbent for heavy metal removal due its excellent immobilization effect. However, limited studies have focused on the synthesis of geopolymer based adsorbent for heavy metal adsorption by utilizing industrial sludge. Thus, the aim of this research was to develop metakaolin (MK) based geopolymer adsorbent with incorporation of two types of industrial sludge (S1 and S3) that could be employed as an adsorbent for removing copper (Cu²⁺) from aqueous solution through the adsorption process. The effects of varied solid to liquid ratio (S/L) on the synthesis of metakaolin/sludge based geopolymer adsorbent and the removal efficiency of Cu²⁺ by the synthesis adsorbent were studied. The raw materials and synthesized geopolymer were characterized by using x-ray fluorescence (XRF), x-ray diffraction (XRD), scanning electron microscope (SEM), fourier transform infrared spectroscopy (FTIR), Brunauer-Emmett-Teller (BET) and micro XRF. The concentration of Cu²⁺ before and after adsorption was determined by atomic absorption spectroscopy (AAS) and the removal efficiency was calculated. The experimental data indicated that the synthesized geopolymer at low S/L ratio has achieved the highest removal efficiency of Cu²⁺ about 99.62% and 99.37% at 25%:75% of MK/S1 and 25%:75% of MK/S3 respectively compared to pure MK based geopolymer with 98.56%. The best S/L ratio for MK/S1 and MK/S3 is 0.6 at which the reaction between the alkaline activator and the aluminosilicate materials has improved and enhanced the geopolymerization process. Finally, this work clearly indicated that industrial sludge can be utilized in developing low-cost adsorbent with high removal efficiency
  • Publication
    Mechanical performance, microstructure, and porosity evolution of fly ash geopolymer after ten years of curing age
    ( 2023)
    Ikmal Hakem A. Aziz
    ;
    Mohd. Mustafa Al Bakri Abdullah
    ;
    Rafiza Abd Razak
    ;
    Zarina Yahya
    ;
    Mohd Arif Anuar Mohd Salleh
    ;
    Jitrin Chaiprapa
    ;
    Catleya Rojviriya
    ;
    Petrica Vizureanu
    ;
    Andrei Victor Sandu
    ;
    Muhammad Faheem Mohd. Tahir
    ;
    Alida Abdullah
    ;
    Liyana Jamaludin
    This paper elucidates the mechanical performance, microstructure, and porosity evolution of fly ash geopolymer after 10 years of curing age. Given their wide range of applications, understanding the microstructure of geopolymers is critical for their long-term use. The outcome of fly ash geopolymer on mechanical performance and microstructural characteristics was compared between 28 days of curing (FA28D) and after 10 years of curing age (FA10Y) at similar mixing designs. The results of this work reveal that the FA10Y has a beneficial effect on strength development and denser microstructure compared to FA28D. The total porosity of FA10Y was also lower than FA28D due to the anorthite formation resulting in the compacted matrix. After 10 years of curing age, the 3D pore distribution showed a considerable decrease in the range of 5–30 µm with the formation of isolated and intergranular holes.
  • Publication
    Effects of multiple reflow on the formation of primary crystals in Sn-3.5Ag and solder joint strength: Experimental and finite element analysis
    ( 2023)
    Siti Farahnabilah Muhd Amli
    ;
    Mohd Arif Anuar Mohd Salleh
    ;
    Mohd Sharizal Abdul Aziz
    ;
    Hideyuki Yasuda
    ;
    Kazuhiro Nogita
    ;
    Mohd. Mustafa Al Bakri Abdullah
    ;
    Ovidiu Nemes
    ;
    Andrei Victor Sandu
    ;
    Petrica Vizureanu
    The growth and formation of primary intermetallics formed in Sn-3.5Ag soldered on copper organic solderability preservative (Cu-OSP) and electroless nickel immersion gold (ENIG) surface finish after multiple reflows were systematically investigated. Real-time synchrotron imaging was used to investigate the microstructure, focusing on the in situ growth behavior of primary intermetallics during the solid–liquid–solid interactions. The high-speed shear test was conducted to observe the correlation of microstructure formation to the solder joint strength. Subsequently, the experimental results were correlated with the numerical Finite Element (FE) modeling using ANSYS software to investigate the effects of primary intermetallics on the reliability of solder joints. In the Sn-3.5Ag/Cu-OSP solder joint, the well-known Cu6Sn5 interfacial intermetallic compounds (IMCs) layer was observed in each reflow, where the thickness of the IMC layer increases with an increasing number of reflows due to the Cu diffusion from the substrate. Meanwhile, for the Sn-3.5Ag/ENIG solder joints, the Ni3Sn4 interfacial IMC layer was formed first, followed by the (Cu, Ni)6Sn5 IMC layer, where the formation was detected after five cycles of reflow. The results obtained from real-time imaging prove that the Ni layer from the ENIG surface finish possessed an effective barrier to suppress and control the Cu dissolution from the substrates, as there is no sizeable primary phase observed up to four cycles of reflow. Thus, this resulted in a thinner IMC layer and smaller primary intermetallics, producing a stronger solder joint for Sn-3.5Ag/ENIG even after the repeated reflow process relative to the Sn-3.5Ag/Cu-OSP joints.