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Nur Izzati Muhammad Nadzri
Preferred name
Nur Izzati Muhammad Nadzri
Official Name
Nur Izzati, Muhammad Nadzri
Alternative Name
Nadzri, Nur Izzati Muhammad
Muhammad Nadzri, Nur Izzati M
Muhd Nadzri, Nur Izzati
Muhammad Nadzri, Nur Izzati
Nadzri, Nur Izzati Muhd
Nadzri, Nur Izzati Muhammad
Main Affiliation
Scopus Author ID
57220777511
57192744206
Now showing
1 - 6 of 6
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PublicationThermal performance optimization for a tapered heat sink of bus bar conductor using definitive screening design(Elsevier, 2025-02)
;Mark Selvan ;Mohd Sharizal Abdul Aziz ; ;H.P. Ong ;Mohd Remy Rozaini Mohd Arif ZainolThis study examines and optimizes four design parameters of a bus duct conductor's heat sink: fin pitch, fin height, fin thickness, and the number of fin valleys. Average surface temperature and Nusselt number are chosen as the thermal performance criterion of the heat sink. A Definitive Screening Design is employed as a statistical method to reduce the number of optimization runs required while minimizing the aliasing. The regression analysis, analysis of variance, main effect analysis and optimization are conducted to optimize the heat sink design parameter and its thermal performance. The current results provide an ideal heat sink design for the casing of bus duct conductors. A fin pitch of 4 mm, fin height of 6.5 mm, fin thickness of 1 mm, and six fin valleys are determined to be the most optimal combination of design parameters. The optimized responses' average surface temperature and Nusselt numbers are 72.05 °C and 21.59, respectively, with 2.97 % and 6.25 % deviation from the predicted values of the empirical equation. The experimental results are benchmarked against the IEC 60439-1 and IEC 60439-2 standards. The current analysis is expected to provide more insight into the impact of design factors on the thermal performance of a bus duct conductor. -
PublicationEffect of temperature and amount of Ag on TiO₂ thin film synthesised via sol–gel method(Springer, 2025-02)
; ; ;Dharshini Karikalan ;Lukasz Kaczmarek ;Sebastian Miszczak ; ; ; ;TiO₂ sol was produced via the sol–gel method with different amounts of AgNO₃ as the source of Ag. The Ag/TiO₂ thin film was obtained by spin coating and was annealed at various annealing temperatures (300°C, 400°C and 500°C) for 1 h. The effect of different amounts of AgNO₃ and different annealing temperatures on the TiO₂ thin films was studied by characterising the phase composition, surface morphology and water contact angle. Results from the x-ray diffraction (XRD) pattern show that with the addition of AgNO₃, Ag/TiO₂ can be formed at low annealing temperatures (300°C). At increased annealing temperatures (400°C and 500°C) and amounts of AgNO₃ (1.0 ml and 1.5 ml), Ag₂O and Ag₃O4 phases were observed. Flakes or flaky islands were formed on the thin film due to thermal expansion mismatch between the film and substrate, residual stress within the film or the release of volatile species when annealed at a low temperature of ⁓300°C. Increasing the temperature to 500°C resulted in the growth and coalescence of the flaky islands by the surface diffusion of adsorbed atoms (adatoms) and their annexation to the surface of existing nuclei. The water contact angle provides valuable insight into the surface interactions between water droplets and the surface of Ag/TiO₂ thin films. It was found that at 1.5 ml AgNO₃, the increased annealing temperature from 300°C to 500°C decreased the water contact angle of Ag/TiO₂ thin films from 83.86° to 34.62°, forming superhydrophilic properties, which indicated its excellent potential as a photocatalyst. -
PublicationDevelopment of coconut fiber reinforced cement composites with the addition of fly ashThis research was conducted to study the coconut fiber reinforced cement composites with the addition of fly ash in cement panel. Ordinary Portland cement, coconut fiber, fly ash, sand and water were the main raw materials used in this project. The development of coconut fiber reinforced cement composites was carried out by substituting fly ash to portion of sand based on its ratio. in this study, the ratio used to the mixture were 1 : 0.2 : 0.8: 0.03, 1 : 0.2: 0.8 : 0.06, 1: 0.2 : 0.8: 0.09, 1 : 0.2 : 0.8 : 0.12, 1 : 0. 2 : 0. 8 : 0.15 (cement : fly ash : sand : coconut fiber) . The water to cement ratio were varied regarding to the fiber content. The sizes of the sample tested were, 160 mm x 40 mm x 40 mm for compression test while 100 mm x 100 mm x -10 mm for density, moisture content and water absorption tests. The samples were cured for 7 days, 14 days and 28 days respectively in water. The result indicates that the cement composites with 9 wt. % of coconut .fiber gives the high value of compressive strength and modulus ofrupture while 20 wt. %of fly ash and 80 wt. %sand was found to be a suitable ratio for this cement composites. It was observed that, increasing fiber content will decrease the density while moisture content and water absorption percentages were increased.
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PublicationEffect of kaolin geopolymer ceramics addition on the microstructure and shear strength of Sn-3.0Ag-0.5Cu solder joints during multiple reflow( 2022)
;Nur Syahirah Mohamad Zaimi ; ; ; ;Andrei Victor Sandu ;Petrica Vizureanu ;Mohd Izrul Izwan Ramli ;Kazuhiro Nogita ;Hideyuki YasudaIoan Gabriel SanduSolder interconnection in three-dimensional (3D) electronic packaging is required to undergo multiple reflow cycles of the soldering process. This paper elucidates the effects of multiple reflow cycles on the solder joints of Sn-3.0Ag-0.5Cu (SAC305) lead (Pb)-free solder with the addition of 1.0 wt.% kaolin geopolymer ceramics (KGC). The samples were fabricated using powder metallurgy with the hybrid microwave sintering method. Apart from using conventional cross-sectioned microstructure imaging, advanced synchrotron real-time in situ imaging was used to observe primary IMC formation in SAC305-KGC solder joints subjected to multiple reflow soldering. The addition of KGC particles in SAC305 suppressed the Cu6Sn5 IMC’s growth as primary and interfacial layers, improving the shear strength after multiple reflow soldering. The growth rate constant for the interfacial Cu6Sn5 IMC was also calculated in this study. The average growth rate of the primary Cu6Sn5 IMCs decreased from 49 µm/s in SAC305 to 38 µm/s with the addition of KGC particles. As a result, the average solidified length in the SAC305-KGC is shorter than SAC305 for multiple reflow soldering. It was also observed that with KGC additions, the growth direction of the primary Cu6Sn5 IMC in SAC305 changed from one growth to two growth directions. The observed results can be attributed to the presence of KGC particles both at grains of interfacial Cu6Sn5 IMCs and at the surface of primary Cu6Sn5 IMC.1 14 -
PublicationEffect of Sn Doping on the Curie Temperature, Structural, Dielectric and Piezoelectric Properties of Ba0.8Sr0.2Ti1−xSnxO3 Ceramics( 2023-11-01)
;Nasir N.N. ; ; ;Muhsen K.N.D.K. ; ; ;Jumali M.H.H.Jamil N.H.B.Ba0.8Sr0.2Ti1−xSnxO3 material with varying Sn concentrations (x = 0, 0.02, 0.04, 0.06, 0.08, and 0.10) was synthesized using the conventional solid-state reaction method. X-ray diffraction (XRD) analysis reveals that as the Sn concentration increases from x = 0 to x = 0.10, the Ba0.8Sr0.2Ti1−xSnxO3 undergoes a structural phase change from tetragonal to cubic. Dielectric analysis of Ba0.8Sr0.2Ti1−xSnxO3 shows a significant drop in Tc, from 65 to 5°C, caused by the replacement of Sn4+ ions with larger ionic radii compared to Ti4+ ions at the B-sites. The composition with x = 0 exhibits the largest dielectric constant due to its enormous spontaneous dipole moments. Conversely, the substitution of Sn in Ba0.8Sr0.2Ti1−xSnxO3 reveals a decrease in the dielectric constant at the B-site structure of perovskite, resulting in a reduced tolerance factor and a decrease in the tetragonality of the sample. However, the pinching effect significantly enhances the dielectric constant of the sample with x = 0.10. Grain size measurements for x = 0 demonstrate a well-distributed grain structure. Additionally, the undoped sample exhibits a higher piezoelectric constant than the Ba0.8Sr0.2Ti1−xSnxO3 samples. According to the piezoelectric constant data, the composition with a tetragonal structure appears to have a greater piezoelectric constant than the cubic structure.1 39 -
PublicationInvestigation of corrosion behaviour of mild steel embedded in geopolymer paste with curing and non-curing process(Polish Academy of Sciences, 2023)
;Fatin Shahira Shaharudin ; ; ; ; ;Sri HastutyAndri KusbiantoroThis research was conducted to examine the corrosion behaviour of mild steel bar embedded in geopolymer paste based fly ash Class F during curing and non-curing process. The geopolymer paste was fabricated by blending in the fly ash with alkaline activators (NaOH solution with molarity of 12 M, 2.5 ratio of solution Na2SiO3/NaOH). The paste was produced in 50 mm × 50 mm × 50 mm mould where the mild steel bar of 100 mm (length) × 12 mm (diameter) was embedded at the center of geopolymer paste. This is to comprehend the corrosion behaviour of mild steel embedded in geopolymer paste with and without curing process. Process of curing is carried out for 24 hours at a temperature of 60°C in oven. While on the contrary, the non-curing process will only be leave at room temperature. Both samples were tested after 28 days of curing to determine the corrosion behaviour, phase analysis and morphology analysis. In accordance with the morphology analysis, it shows that the fly ash was totally reacted with alkaline solutions in curing geopolymer paste sample while the non-curing geopolymer paste has shown the unreacted fly ash with high number of pores. The phase analysis of mild steel embedded in this geopolymer paste during curing and without curing process has proven that the presence of new crystallographic peak which also known as passive layer occurred. The potential values result by OCP testing shows the curing sample has highest potential values as compared to the non-curing sample ones.14 1