Mohd Arif Anuar Mohd Salleh
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Preferred name
Mohd Arif Anuar Mohd Salleh
Official Name
Mohd Arif Anuar, Mohd Salleh
Alternative Name
Mohd Salleh, Mohd Arif Anuar
Salleh, Mohd A.A.
Salleh, M. A.A.Mohd
Mohd Salleh, M. A.A.
Salleh, M. A.A.M.
Mohd Salleh, M. M.A.
Main Affiliation
Scopus Author ID
55543476900
Researcher ID
C-3386-2018

Research Output

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  • Publication
    Influence of squeegee impact on stencil printing process: CFD approach
    (IOP Publishing Ltd., 2020)
    M.H.H. Ishak
    ;
    M.S. Abdul Aziz
    ;
    M.H.S. Abdul Samad
    ;
    Farzad Ismail
    ;
    Mohd Arif Anuar Mohd Salleh
    This work has been conducted to predict the real time observation of solder paste Sn96.5Ag3.0Cu0.5 (SAC305) filling process into stencil apertures as well as print quality in stencil printing by using Computational Fluid Dynamics (CFD) approach. A 3-Dimensional stencil printing model was developed and simulated in FLUENT by using different squeegee parameters which are the angle and printing speed. An experimental work was performed to be compared with part of the simulation results in term of print quality for validation purpose. It is found that squeegee angle 60° to 80° has potential to obtain good print quality of solder paste. In addition, print speed range between 35 mm/s to 95 mm/s also can be the good print speed option to achieve good print quality in stencil printing process. Finally, the maximum pressure distribution of solder paste also changes substantially as the squeegee travel further with respect to different values of tested parameters.
  • Publication
    Multiscale Analysis of the Mechanical Properties of the Crack Tip Region
    (Institute of Physics, Polish Academy of Sciences, 2023)
    Sun Zhufeng
    ;
    Mohd Arif Anuar Mohd Salleh
    ;
    Bartlomiej Jeż
    ;
    Norwahida Yusoff
    This paper attempts to find the possibility of describing the supplementary parameters of the macroscopic crack strength field based on the variation at the microscopic level. The analysis focuses on the development of cracks in the vicinity of the crack tip of a central crack panel made from iron material with a cubic crystal structure under tensile loading. We use the combination of finite element and molecular dynamics simulation methods. Molecular dynamics simulation analysis shows that the motion velocity of molecules near the crack tip region is less than the Rayleigh wave velocity, VR, which is about 0.22 VR. The average velocity is smaller in other directions that are not parallel to the crack. The velocity of the molecular near the crack tip indicates the ductile phenomenon of the crack tip region because it comes from the potential energy, which means that on the crack extension line, the kinetic energy of the molecular motion is greater than that in the other directions but is close to that in the 45â—¦ direction. It shows that the crack expansion direction is still mainly along the crack extension line under the load.
  • Publication
    Study on the addition of nanoparticles in the lead-free solder during reflow soldering via numerical simulation - a review
    (Penerbit Akademia Baru, 2020-12)
    Intan Norshalina Sahrudin
    ;
    Mohd Sharizal Abdul Aziz
    ;
    Mohd. Zulkifly Abdullah
    ;
    Mohd Arif Anuar Mohd Salleh
    Surface mount technology (SMT) is a method of electronic components mounting or placed directly on the surface of the circuit board. The solder will be printed onto the substrate on the printed circuit board (PCB) and then undergoes reflow soldering process. As the used of lead (Pb) is restricted by the restriction of hazardous substances (RoHS) directive in 2006 and Waste Electrical and Electronic Equipment (WEE), the study on the addition of nanoparticles into the lead-free solder has increased as to increase the reliability and quality of the lead-free solder. Researchers have added Cobalt, Silver, Molybdenum, Diamond, Silicon, Zinc, Zinc oxide and many more to increase few solder criteria such as the wetting properties, mechanical properties and the intermetallic compound (IMC) layers. Many numerical simulation methods such as finite element (FEM), finite volume (FVM), Lattice Boltzmann method (LBM), discrete phase method (DPM), and molecular dynamic (MD) simulation have been used to clearly show the reflow soldering process and to cut the cost of experimental work.
  • Publication
    The effect of the epoxy curing method on the encapsulation of led
    (Springer, 2023)
    Kaalidass Muniary
    ;
    Mohd Syakirin Rusdi
    ;
    Mohd Sharizal Abdul Aziz
    ;
    Roslan Kamaruddin
    ;
    Muhammad Hafifi Hafiz Ishak
    ;
    Md. Abdul Alim
    ;
    Mohd Arif Anuar Mohd Salleh
    The electronic sector is developing novel products that are smaller and faster, with better performance, lighter containers, and are more cost effective. An integrated circuit can be used to link several LEDs with different functions to electronic devices packaged. The space between the cover lens and the LED chip is filled with a non-conductive polymeric substance, like epoxy or transparent silicone encapsulant. The goal of encapsulation is to protect the device from physical forces that could weaken the connection between the chip and the substrate. The research is focusing on the experimental investigation of the effect of epoxy on the encapsulation process in LED. The different parameters that affect the encapsulation process, such as needle size, type of epoxy resin, and method of curing, have been studied. The contact angle and contact surface area of each type of epoxy were measured after the curing process. Using a syringe and five different needle sizes, the three types of epoxy resin and hardener are manually injected onto the wafer substrate. ImageJ was used to measure the contact angle and contact area. The results of the experiment demonstrated that the 1:1 self-curing epoxy resin is the most effective type of epoxy resin, as its contact angle and surface area of contact have optimal values. The 21G needle size produces acceptable results in the encapsulation procedure. The contact angle and surface area of contact measurements for this project will determine the appropriate epoxy to use.
  • Publication
    Investigation of thermal reflow profile for copper pillar technology
    (Springer, 2023-07)
    Jing Rou Lee
    ;
    Mohd Sharizal Abdul Aziz
    ;
    Muhammad Faiz Ridhwan Rosli
    ;
    Mohd Syakirin Rusdi
    ;
    Roslan Kamaruddin
    ;
    Muhammad Hafifi Hafiz Ishak
    ;
    Mohd Arif Anuar Mohd Salleh
    The reflow soldering process is crucial in flip chip applications for forming a high-quality interconnection joint. This paper aims to investigate the effect of bump diameters of solder bump and copper pillar bump on the reflow temperature distribution during the reflow soldering process. A simplified reflow oven is developed and the virtual reflow process is established using computational fluid dynamics (CFD) software. The simulation study is validated with the experiment result. The numerical findings show that the temperature distribution is uniform in the copper pillar bumps with different diameters but uneven for the solder bumps. This study provides a foundation and insights into the effects of copper pillar bump structure on the reflow temperature profile during the reflow soldering process.
  • Publication
    Effect of epoxy material viscosity and gold wire configuration on light-emitting diode encapsulation process
    (Springer, 2025)
    Khor Chu Yee
    ;
    Mohd Sharizal Abdul Aziz
    ;
    Chooi Jing Qi
    ;
    Xing Qi Lim
    ;
    M. H. H. Ishak
    ;
    Mohd Arif Anuar Mohd Salleh
    This paper investigates the impacts of epoxy material viscosity and different gold wire configurations on the total maximum deformation, maximum von Mises stress, and maximum equivalent elastic strain on the light-emitting diode (LED) encapsulation process. The simulation of the LED encapsulation process employed the Volume of Fluid (VOF), Fluid–Structure Interaction (FSI), and System Coupling methods within ANSYS software. The simulation results for an epoxy molding compound (EMC) with viscosity of 0.448 kg/m·s were validated by an experiment. A grid independence test was run to determine the minimum mesh refinement required for the simulation. The results revealed that the final fluid profile of the EMC at 0.448 kg/m·s conformed more closely to the experimental results than the other epoxies. The overall best performance of the wire configuration to the EMC on the LED encapsulation process, in descending order, was the square-loop, triangle-loop, S-loop, Q-loop, and M-loop. This study contributes to understanding the effects of epoxy materials and various gold wire configurations on key mechanical parameters in the LED encapsulation process, hence guiding LED manufacturers in selecting optimal epoxy materials and wire configurations to improve process reliability and performance.
  • Publication
    Investigation of nano-reinforced lead-free solder during reflow soldering-a molecular dynamic approach
    (Akademia Baru Publishing (M) Sdn Bhd, 2020)
    Intan Norshalina Sahrudin
    ;
    Mohd Zulkifly Abdullah
    ;
    Mohd Sharizal Abdul Aziz
    ;
    Mohd Syakirin Rusdi
    ;
    Mohd Arif Anuar Mohd Salleh
    The reinforcement of nanoparticles into the lead-free solder is proved to give good increment in the result of the importance solder properties which includes wetting properties and mechanical properties. This study proposed the new simulation method for the nano-reinforced solder to investigate the complexity and atomic behaviour briefly. The objective of this study is to clearly show the movement of the reinforced nanoparticles in the solder during the reflow soldering process via molecular dynamics (MD) simulation. In this work, Nickel (Ni) nanoparticles will be added into the pure Tin (Sn) lead-free solder. The MD simulation of Ni-reinforced solder at the temperature of 250 OC (reflow phase) was conducted via Large-scale Atomic/Molecular Massively Parallel Simulator (LAMMPS) software. This simulation model able to track the nanoparticles movement in the solder during the reflow soldering process. The experimental procedure of 0.01 wt.% Ni nanoparticle reinforcement in Sn100C was also carried out to validate the simulation result. The synchrotron micro-XRF mapping showed the Ni element was agglomerated and thus validated the simulation result. The measured area of agglomerated Ni A in the simulation and experimental results are 1.1708 Ã…2 and 0.9996 Ã…2, respectively. Meanwhile, the result obtained for area B is 0.7696 Ã…2 and 0.6796 Ã…2, respectively. Therefore, the percentage error of simulation and experimental results for both areas of A and B is 10.82% and 13.24%, respectively.
      9  15
  • Publication
    The Influence of Compounding Parameters on the Electrical Conductivity of LDPE/Cu Conductive Polymer Composites (CPCs)
    ( 2021-11-12)
    Farah Badrul
    ;
    Khairul Anwar Abdul Halim
    ;
    Mohd Arif Anuar Mohd Salleh
    ;
    Azlin Fazlina Osman
    ;
    Nor Asiah Muhamad
    ;
    Muhammad Salihin Zakaria
    ;
    Nurul Afiqah Saad
    ;
    Syatirah Mohd Noor
    Low-linear density (LDPE) and copper (Cu) were used as main polymer matrix and conductive filler in order to produce electrically conductive polymer composites (CPC). The selection of the matrix and conductive filler were based on their due to its excellence properties, resistance to corrosion, low cost and electrically conductive. This research works is aimed to establish the effect of compounding parameter on the electrical conductivity of LDPE/Cu composites utilising the design of experiments (DOE). The CPCs was compounded using an internal mixer where all formulations were designed by statistical software. The scanning electron micrograph (SEM) revealed that the Cu conductive filler had a flake-like shape, and the electrical conductivity was found to be increased with increasing filler loading as measured using the four-point probe technique. The conductivity data obtained were then analysed by using the statistical software to establish the relationship between the compounding parameters and electrical conductivity where it was found based that the compounding parameters have had an effect on the conductivity of the CPC.
      1  27
  • Publication
    Investigations of infrared desktop reflow oven with FPCB Substrate during reflow soldering process
    ( 2021)
    Muhammad Iqbal Ahmad
    ;
    Mohd Sharizal Abdul Aziz
    ;
    Mohd Zulkifly Abdullah
    ;
    Mohd Arif Anuar Mohd Salleh
    ;
    Mohammad Hafifi Hafiz Ishak
    ;
    Wan Rahiman
    ;
    Marcin Nabiałek
    This paper presents the study of infrared (IR) reflow oven characteristics for suitable operating conditions of the flexible printed circuit board (FPCB) in the reflow soldering process. A computer-based model that imitates a real-time oven was developed with practical boundary conditions. Since the radiation effect is dominant in the reflow process, a discrete ordinate (DO) model was selected to simulate the effect. The experimental work acts as a benchmark and the reflow profile was set to follow the standards of JSTD-020E. The simulation of the model has a great consensus between the experimental data. It was found that the temperature distribution was inhomogeneous along with the phases. The FPCB surface also has a higher surface temperature than oven air during the operating reflow profile. An in-depth study using the simulation approach reveals that the temperature distribution of the desktop reflow oven is dependent on several factors, namely fan speed, FPCB position, and FPCB thickness. The rotational fan generates an unsteady flow that induces inhomogeneous temperature at different positions in the reflow oven cavity. The results are useful for studying further improvements to achieve temperature uniformity within the oven chamber.
      1  12
  • Publication
    Effects of multiple reflow on the formation of primary crystals in Sn-3.5Ag and solder joint strength: experimental and finite element analysis
    ( 2023)
    Siti Farahnabilah Muhd Amli
    ;
    Mohd Arif Anuar Mohd Salleh
    ;
    Mohd Sharizal Abdul Aziz
    ;
    Hideyuki Yasuda
    ;
    Kazuhiro Nogita
    ;
    Mohd. Mustafa Al Bakri Abdullah
    ;
    Ovidiu Nemes
    ;
    Andrei Victor Sandu
    ;
    Petrica Vizureanu
    The growth and formation of primary intermetallics formed in Sn-3.5Ag soldered on copper organic solderability preservative (Cu-OSP) and electroless nickel immersion gold (ENIG) surface finish after multiple reflows were systematically investigated. Real-time synchrotron imaging was used to investigate the microstructure, focusing on the in situ growth behavior of primary intermetallics during the solid–liquid–solid interactions. The high-speed shear test was conducted to observe the correlation of microstructure formation to the solder joint strength. Subsequently, the experimental results were correlated with the numerical Finite Element (FE) modeling using ANSYS software to investigate the effects of primary intermetallics on the reliability of solder joints. In the Sn-3.5Ag/Cu-OSP solder joint, the well-known Cu6Sn5 interfacial intermetallic compounds (IMCs) layer was observed in each reflow, where the thickness of the IMC layer increases with an increasing number of reflows due to the Cu diffusion from the substrate. Meanwhile, for the Sn-3.5Ag/ENIG solder joints, the Ni3Sn4 interfacial IMC layer was formed first, followed by the (Cu, Ni)6Sn5 IMC layer, where the formation was detected after five cycles of reflow. The results obtained from real-time imaging prove that the Ni layer from the ENIG surface finish possessed an effective barrier to suppress and control the Cu dissolution from the substrates, as there is no sizeable primary phase observed up to four cycles of reflow. Thus, this resulted in a thinner IMC layer and smaller primary intermetallics, producing a stronger solder joint for Sn-3.5Ag/ENIG even after the repeated reflow process relative to the Sn-3.5Ag/Cu-OSP joints.
      14  37