Mohd Arif Anuar Mohd Salleh
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Preferred name
Mohd Arif Anuar Mohd Salleh
Official Name
Mohd Arif Anuar, Mohd Salleh
Alternative Name
Mohd Salleh, Mohd Arif Anuar
Salleh, Mohd A.A.
Salleh, M. A.A.Mohd
Mohd Salleh, M. A.A.
Salleh, M. A.A.M.
Mohd Salleh, M. M.A.
Main Affiliation
Scopus Author ID
55543476900
Researcher ID
C-3386-2018

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  • Publication
    Comparative wetting study of Sn-0.7Cu solder on dimple and pillar micro-texture fabricated by the photolithography technique
    ( 2024-12)
    Juyana A. Wahab
    ;
    Mohd Arif Anuar Mohd Salleh
    ;
    Marliza Mostapha @ Zakaria
    ;
    Muhammad Firdaus Mohd Nazeri
    ;
    Nurul Aida Husna Mohd Mahayuddin
    ;
    Siti Faqihah Roduan
    The study focused on exploring the impact of micro-textured surfaces on the wetting behaviour of Sn-0.7Cu solder. Dimple and pillar micro-textures, each with a diameter of 100 μm, were fabricated on the copper substrate using a photolithography technique. The Sn-0.7Cu solder was melted onto the micro-textured copper substrate during the soldering process. The spreading time, spreading area, and spreading rate of the solder on the copper substrate were investigated. The copper substrates with dimple textures exhibited a prolonged spreading time of 51 seconds, a smaller spreading area of 60.54 mm², and a slower spreading rate of 1.44 mm²/s than the pillar-textured copper substrates. However, the presence of micro-textures resulted in a reduced spreading area, indicative of enhanced solderability. This improvement is attributed to the textured substrate promoting higher copper diffusion during the soldering process. The controlled application of micro-textures holds promise for optimising wetting behaviour and solderability in electronic assembly processes, presenting avenues for further exploration and application in the realm of materials science and electronic manufacturing.
  • Publication
    Influence of squeegee impact on stencil printing process: CFD approach
    (IOP Publishing Ltd., 2020)
    M.H.H. Ishak
    ;
    M.S. Abdul Aziz
    ;
    M.H.S. Abdul Samad
    ;
    Farzad Ismail
    ;
    Mohd Arif Anuar Mohd Salleh
    This work has been conducted to predict the real time observation of solder paste Sn96.5Ag3.0Cu0.5 (SAC305) filling process into stencil apertures as well as print quality in stencil printing by using Computational Fluid Dynamics (CFD) approach. A 3-Dimensional stencil printing model was developed and simulated in FLUENT by using different squeegee parameters which are the angle and printing speed. An experimental work was performed to be compared with part of the simulation results in term of print quality for validation purpose. It is found that squeegee angle 60° to 80° has potential to obtain good print quality of solder paste. In addition, print speed range between 35 mm/s to 95 mm/s also can be the good print speed option to achieve good print quality in stencil printing process. Finally, the maximum pressure distribution of solder paste also changes substantially as the squeegee travel further with respect to different values of tested parameters.
  • Publication
  • Publication
    Logam Ferus
    (Penerbit UniMAP, 2011)
    Murizam Darus
    ;
    Ruhiyudin, Mohd Zaki
    ;
    Faizal, Che Pa
    ;
    Mohd Arif Anuar Mohd Salleh
    Logam ferus adalah kumpulan logam dengan komposisi utamanya terdiri daripada bahan logam besi. Pengetahuan berkaitan bahan ini dapat membantu kita menghasilkan produk yang lebih berkualiti serta mengoptimakan penggunaan bahan ferus dengan lebih cekap. Bab pertama menjelaskan berkenaan logam ferus secara umum, proses penghasilan logam ferus serta piawai yang menjadi rujukan utama industri berkaitan. Bab kedua buku ini pula memberikan fokus kepada sifat-sifat logam ferus serta peranan utama bahan karbon dalam penghasilan keluli. Jenis-jenis keluli yang utama pula dijelaskan dalam bab tiga. Manakala bahagian terakhir menjelaskan proses-proses yang berkaitan dengan penghasilan produk daripada bahan logam ferus.
  • Publication
    Void distributions in Sn-3.0Ag-0.5Cu (SAC305) composite lead free solder subjected to thermal ageing using acoustic micro imaging technique
    (IOP Publishing, 2020)
    Nur Syahirah Mohamad Zaimi
    ;
    Mohd Arif Anuar Mohd Salleh
    ;
    Mohd. Mustafa Al Bakri Abdullah
    ;
    Marliza Mostapha @ Zakaria
    ;
    M S Baltatu
    ;
    R Badlishah Ahmad
    The formations of the voids in SAC305 lead free solder and SAC305 with additions of kaolin geopolymer ceramics were studied. The composite solders were fabricated by using powder metallurgy with microwave sintering method. The samples were sandwiched between two copper substrates and reflowed in a reflow oven and aged at 125°C for 0 and 7 days. The acoustic micro imaging was used to analyse the distributions of voids in the solder joints of SAC305 and SAC305 with additions of kaolin geopolymer ceramics. Results shows that, rhe void in SAC305 are larger in size and numbers as compared to SAC305 with additions of kaolin geopolymer ceramics for both reflowed and aged conditions.
  • Publication
    Microstructure and growth kinetic study in Sn–Cu transient liquid phase sintering solder paste
    (Springer, 2020)
    Rita Mohd Said
    ;
    Mohammad Zikry Ramli
    ;
    Mohd Arif Anuar Mohd Salleh
    ;
    H. Yasuda
    ;
    Norainiza Saud
    ;
    K. Nogita
    The feasibility of the highly reliable and replicable microstructure formation of the transient liquid phase sintering (TLPS) paste during the early soldering and isothermal aging on the Cu substrate had been successfully investigated in this study. By using the Sn–0.7 wt% Cu (SC) solder paste as the base material and the Cu particles in the production of the TLPS Sn–10 wt% Cu (SC10) solder paste, the ensuing Cu6Sn5 phase from the isothermal aging process was found to have reduced the β-Sn area of the bulk SC10 solder microstructure. The growth kinetic for TLPS SC10 resulted in a 26.76 kJ/mol of activation energy level. The real-time synchrotron radiation imaging technique that was employed in studying the growth and formation of the primary intermetallic phases at the solder joints had also discovered the primary intermetallic in TLPS SC10 was not only found to have experienced an early nucleation just after the solder had melted, but its growth was also restricted prior to the solidification of the liquid solder. Therefore, the relevance of the results that were obtained from this research may offer a possible solution for aiding the future development of highly reliable solder joints in high temperature solder applications.
  • Publication
    Development of geopolymer ceramic as a potential reinforcing material in solder alloy: short review
    (IOP Publishing, 2020)
    Nadiah ‘Izzati Zulkifli
    ;
    Mohd. Mustafa Al Bakri Abdullah
    ;
    Mohd Arif Anuar Mohd Salleh
    ;
    Andrei Victor Sandu
    ;
    Romisuhani Ahmad
    ;
    Nurul Aida Mohd Mortar
    Nowadays, the consumption of lead-free solder has been widely used around the world since the utilization of SnPb solder has been banned and restricted by European Union. Variety of studies have been conducted by the researchers to find an alternative to replace the usage of SnPb such as SnCu, SAC, SnAg and etc. However, the development of plain lead-free solder was declared to provide low mechanical, thermal, and electrical properties in terms of interfacial intermetallic compound and wettability towards its solder joint compare to the traditionally monolithic SnPb solder alloy. Mostly, previous studies stated that addition of some additives such as ceramic particles (Si 3 N 4, TiO 2, SiC, NiO and etc) may improves the solder joint reliability. At the same time, no major studies were done using geopolymer ceramic as reinforcing agent in plain matrix alloy. Therefore, this paper reviews the fabrication process of multiple geopolymer-based ceramic such as fly ash, kaolin, and slag as reinforcement in solder alloy. The development process includes the processing method of geopolymer ceramic and the characterization of geopolymer ceramic as reinforcing material consist of; i) chemical composition, and ii) phase identification.
  • Publication
    Tin whiskers formation in Sn₀.₇Cu₀.₀₅Ni₁.₅Bi under electro-migration stressing
    (Institute of Physics, Polish Academy of Sciences (PAS), 2020)
    N.Z.M. Mokhtar
    ;
    Mohd Arif Anuar Mohd Salleh
    ;
    G.M. Zhang
    ;
    D.M. Harvey
    ;
    M. Nabialek
    ;
    Aimi Noorliyana Hashim
    ;
    S.F. Nazri
    Stress induced by electrical current testing indeed has caused the formation of many whiskers growth in soldering applications. The aim of this investigation is to investigate the electrical current testing to the formation of whiskers. Also the mitigation could be achieved with the additional element of Nickel-Bismuth (Ni–Bi). Characterization of whisker growths are evaluated using the Scanning Electron Microscopy (SEM) on the deposits near anode and cathode areas. Synchrotron micro-XRF were performed on Sn₀.₇Cu₀.₀₅Ni₁.₅Bi at anode and cathode to accurately observe the distributions of elements in the sample. The obtained results demonstrate that the whisker growths with the effect of current stressing is associated with the intermetallic compound (IMCs) thickness on the anode and cathode areas. Finding shows that by addition of Ni-Bi elements can help to reduce the amount of whiskers form by refining the IMCs formation.
  • Publication
    Multiscale Analysis of the Mechanical Properties of the Crack Tip Region
    (Institute of Physics, Polish Academy of Sciences, 2023)
    Sun Zhufeng
    ;
    Mohd Arif Anuar Mohd Salleh
    ;
    Bartlomiej Jeż
    ;
    Norwahida Yusoff
    This paper attempts to find the possibility of describing the supplementary parameters of the macroscopic crack strength field based on the variation at the microscopic level. The analysis focuses on the development of cracks in the vicinity of the crack tip of a central crack panel made from iron material with a cubic crystal structure under tensile loading. We use the combination of finite element and molecular dynamics simulation methods. Molecular dynamics simulation analysis shows that the motion velocity of molecules near the crack tip region is less than the Rayleigh wave velocity, VR, which is about 0.22 VR. The average velocity is smaller in other directions that are not parallel to the crack. The velocity of the molecular near the crack tip indicates the ductile phenomenon of the crack tip region because it comes from the potential energy, which means that on the crack extension line, the kinetic energy of the molecular motion is greater than that in the other directions but is close to that in the 45◦ direction. It shows that the crack expansion direction is still mainly along the crack extension line under the load.
  • Publication
    The effect of Ni and Bi additions on the solderability of Sn-0.7Cu solder coatings
    (Springer, 2019)
    Mohd Izrul Izwan Ramli
    ;
    Mohd Arif Anuar Mohd Salleh
    ;
    P. Narayanan
    ;
    Mohd. Mustafa Al Bakri Abdullah
    ;
    J. Chaiprapa
    ;
    Rita Mohd Said
    ;
    S. Yoriya
    ;
    K. Nogita
    The present investigation explores the influence of Ni and Bi on the solderability of Sn-0.7Cu solder coatings. The minor addition of 0.05 wt.% Ni into the Sn-0.7Cu solder alloy results in an improvement in the wettability based on dipping tests. The solderability investigation using a globule mode shows the influence of Ni and Bi on the interfacial intermetallic compound (IMC). The addition of Ni to a Sn-0.7Cu solder coating resulted in a (Cu,Ni)6Sn5 interfacial IMC, which enhanced the solderability performance during the globule test. With an increasing amount of Bi in the Sn-0.7Cu-0.05Ni-xBi solder ball, the surface energy of the solder alloy can be reduced, and this improves the solderability. The synchrotron micro-XRF results indicate that Ni is found in a relatively high concentration in the interfacial layer. Additionally, Bi was found to be homogenously distributed in the bulk solder, which improved solderability.