Azlin Fazlina Osman
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Preferred name
Azlin Fazlina Osman
Official Name
Azlin Fazlina, Osman
Alternative Name
Osman, Azlin Fazlina
Osman, A.
Fazlina Osman, Azlin
Main Affiliation
Scopus Author ID
54891813000
Researcher ID
K-2714-2019

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  • Publication
    Network Structure and Mechanical Properties of Flexible Electronic Interconnects based on Linear Low-Density Polyethylene (LLDPE) and Liquid Silicone Rubber (LSR) Conductive Polymer Composites
    ( 2024-03-01)
    Khairul Anwar Abdul Halim
    ;
    Mohd Arif Anuar Mohd Salleh
    ;
    Badrul F.
    ;
    Azlin Fazlina Osman
    ;
    Mohd Firdaus Omar
    ;
    Suhaimi A.S.
    ;
    Muhammad Salihin Zakaria
    Conductive polymer composites (CPCs) with the ability to maintain high conductivity whilst remaining flexible at various operating temperatures and conditions have gained interest as potential materials for electronic interconnect applications. The ability of a polymer matrix to conduct electricity is mainly dependent on the conductive filler loadings as well as the formation of network paths within the CPCs. The main aim of this research work was to establish and understand the correlation between the network structure formation and mechanical properties of linear low-density polyethylene/copper (LLDPE/Cu) and liquid silicone rubber/copper (LSR/Cu) CPCs. Various techniques such as electron microscopy, thermal studies, four-point probe, and tensile testing were employed in this study. Furthermore, selected samples were characterized and tested using synchrotron micro-x-ray fluorescence (XRF) technique and dynamic mechanical analysis (DMA). It was found that the electrical conductivity of the CPCs increased with increasing filler loadings. Addition of Cu filler had a marginal effect on the tensile strength of both LLDPE/Cu and LSR/Cu CPCs. Nevertheless, it was found that the elongation at break for LLDPE/Cu consistently increased with the addition of Cu whereas, for LSR/Cu samples, the elongation at break decreased with the addition of Cu at various loadings. The scanning electron microscopy (SEM) micrographs obtained show that the particles of Cu were closer to one another at higher filler loadings. The data obtained revealed the potential for utilizing CPCs as flexible interconnects suitable for advanced electronic applications.
      1
  • Publication
    The use of ground & ultrasonicated dolomite (GUD) for improving the tensile performance of Poly (ethylene-co-vinyl acetate) copolymer composite
    ( 2021-11-12)
    Fauzi A.A.A.
    ;
    Azlin Fazlina Osman
    ;
    Khairul Anwar Abdul Halim
    ;
    Mustafa Z.
    ;
    Alakrach A.M.
    ;
    Mohd Nazry Salleh
    The combination of the organic and inorganic materials to fabricate a new form of material called 'composite' has been performed since several decades ago. However, the strategy to improve the homogeneity of the resultant composite system is still being the main focus of current research. In this study, dolomite and poly (ethylene-co-vinyl acetate) (PEVAc) were employed as filler and matrix, respectively. Dolomite was ground and ultrasonicated before being used as filler. It can be observed that the size of dolomite particles has been reduced significantly upon the grinding and ultrasonication processes. The effect of ground and ultrasonicated dolomite (GUD) addition on the mechanical performance of the PEVAc copolymer was investigated. Results indicate that the GUD filler has successfully increased the tensile strength, elongation at break, modulus of elasticity and tensile toughness of the PEVAc copolymer when being employed in 1 wt%. However, the use of higher content of GUD resulted in the decreasing trend of those properties. This shows that the ground and ultrasonicated dolomite with smaller and higher surface area particles than its pristine form could bring improvement to the mechanical performance of the copolymer when being used in low loading as it can be more easily dispersed in the copolymer matrix.
      40  1
  • Publication
    The role of zinc chloride in enhancing mechanical, thermal and electrical performance of ethylene vinyl acetate/carbonized wood fiber conductive composite
    ( 2021-02-02)
    Mohd Hanif Mohd Pisal
    ;
    Azlin Fazlina Osman
    ;
    Tan Soo Jin
    ;
    Rozyanty Rahman
    ;
    Alrashdi A.A.
    ;
    Masa A.
    Carbonized natural filler can offer the production of low cost composites with an eco-friendliness value. The evolving field of electronics encourages the exploration of more functions and potential for carbonized natural filler, such as by modifying its surface chemistry. In this work, we have performed surface modification on carbonized wood fiber (CWF) prior to it being used as filler in the ethylene vinyl acetate (EVA) composite system. Zinc chloride (ZnCl2) with various contents (2 to 8 wt%) was used to surface modify the CWF and the effects of ZnCl2 composition on the surface morphology and chemistry of the CWF filler were investigated. Furthermore, the absorptive, mechanical, thermal, and electrical properties of the EVA composites containing CWF-ZnCl2 were also analyzed. SEM images indicated changes in the morphology of the CWF while FTIR analysis proved the presence of ZnCl2 functional groups in the CWF. EVA composites incorporating the CWF-ZnCl2 showed superior mechanical, thermal and electrical properties compared to the ones containing the CWF. The optimum content of ZnCl2 was found to be 6 wt%. Surface modification raised the electrical conductivity of the EVA/CWF composite through the development of conductive deposits in the porous structure of the CWF as a channel for ionic and electronic transfer between the CWF and EVA matrix.
      1  39
  • Publication
    MicroMechanical Modeling of PolyaMide 11 nanocoMPosites ProPerties using coMPosite theories
    ( 2023-01-01)
    Khairul Anwar Abdul Halim
    ;
    Kennedy J.E.
    ;
    Mohd Arif Anuar Mohd Salleh
    ;
    Azlin Fazlina Osman
    ;
    Mohd Firdaus Omar
    ;
    Sunar N.M.
    The use of organically modified clays as nano-reinforcement in polymer matrices is widely investigated owing to their remarkable reinforcement at low filler loading. In this body of work, the nanocomposites were prepared by melt blending nanoclay with polyamide 11 (PA 11) utilising a twin-screw extruder in order to maximise the dispersion of clay particles within the matrix during compounding. The main aim of the work was to study the reinforcing effect of nanoclay within PA 11 using two micromechanical model namely Halpin-Tsai and Mori-Tanaka composite theories. These theories were used to predict the effective tensile modulus of PA 11 nanocomposites and the results were compared to the experimental data. In addition, the Halpin-Tsai model was used to predict the storage modulus and heat distortion temperature (HDT) of PA 11 nanocomposites. It was found that the tensile modulus for nanocomposites with a high clay aspect ratio exhibits up to 10% higher when compared to the nanocomposites with lower clay aspect ratio. Thus, it is believed that the combination of clay aspect ratio and modulus contributes to the super reinforcing effect of nanoclay within the PA 11 matrix.
      1  27