Juyana A. Wahab
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Preferred name
Juyana A. Wahab
Official Name
A. Wahab, Juyana
Alternative Name
A Wahab, Juyana
Wahab, Juyana A.
Wahab, J. A.
Main Affiliation
Scopus Author ID
36783614000
Researcher ID
AAY-8291-2021

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  • Publication
    Comparative wetting study of Sn-0.7Cu solder on dimple and pillar micro-texture fabricated by the photolithography technique
    ( 2024-12)
    Juyana A. Wahab
    ;
    Mohd Arif Anuar Mohd Salleh
    ;
    Marliza Mostapha @ Zakaria
    ;
    Muhammad Firdaus Mohd Nazeri
    ;
    Nurul Aida Husna Mohd Mahayuddin
    ;
    Siti Faqihah Roduan
    The study focused on exploring the impact of micro-textured surfaces on the wetting behaviour of Sn-0.7Cu solder. Dimple and pillar micro-textures, each with a diameter of 100 μm, were fabricated on the copper substrate using a photolithography technique. The Sn-0.7Cu solder was melted onto the micro-textured copper substrate during the soldering process. The spreading time, spreading area, and spreading rate of the solder on the copper substrate were investigated. The copper substrates with dimple textures exhibited a prolonged spreading time of 51 seconds, a smaller spreading area of 60.54 mm², and a slower spreading rate of 1.44 mm²/s than the pillar-textured copper substrates. However, the presence of micro-textures resulted in a reduced spreading area, indicative of enhanced solderability. This improvement is attributed to the textured substrate promoting higher copper diffusion during the soldering process. The controlled application of micro-textures holds promise for optimising wetting behaviour and solderability in electronic assembly processes, presenting avenues for further exploration and application in the realm of materials science and electronic manufacturing.
  • Publication
    Effect of LST parameter on surface morphology of modified copper substrates
    (Malaysian Tribology Society, 2020-09-02)
    Roduan, Siti Faqihah
    ;
    Juyana A. Wahab
    ;
    Mohd Arif Anuar Mohd Salleh
    ;
    Mohd Mahayuddin, Nurul Aida Husna
    ;
    Halil, Aiman Mohd
    ;
    Ishak, Mahadzir
    This study aimed to investigate the effect of laser surface texturing (LST) parameter on the surface morphology of copper substrate. The results of different loop number (L1 to L5) on the resolidified material of micro-dimpled surface modified copper substrate were examined. The micro-dimple with a diameter of 100 µm was produced via LST process by varying the dimple distance at 100 µm and 180 µm. The resolidified material that was formed after the surface texturing process was analysed using 3D measuring laser microscope. Based on the data collected, the dimple was successfully engraved on the copper substrate. The increasing number of loop increase the quantity of the melted material which lead to higher amount of resolidified material and surface roughness.
  • Publication
    Effect of surface-modified copper substrate by photolithography on the solderability of lead-free solder alloy
    (Springer, 2023-07)
    Nurul Aida Husna Mohd Mahayuddin
    ;
    Juyana A. Wahab
    ;
    Siti Faqihah Roduan
    ;
    Mohd Arif Anuar Mohd Salleh
    Various modifications of copper substrates have been developed for soldering applications due to their promising properties. The present study aimed to investigate the effect of dimple micro-texture on a copper substrate surface on soldering. Photolithography technique was used to fabricate a dimple micro-texture onto copper substrate. After surface texturing, the copper substrate was reflowed with Sn–0.7Cu solder. The surface microstructural was determined using optical microscopy (OM), the 3D surface profiler, and visual tests. The spreading area of the Sn–0.7Cu solder and the copper substrate was also examined. In comparison with Sn-0.7Cu solder on textured surface, TD500 has larger spreading area as the diameter was large nearly equivalent to non-textured surface. However, Sn–0.7Cu textured substrate exhibits low spreading area than non-textured surface that is beneficial for solderability properties.
  • Publication
    Effect of wetting characteristics of dimpled micro-textured substrate on the spreading area of Sn–0.7Cu solder alloy
    (Springer, 2023)
    Siti Faqihah Roduan
    ;
    Juyana A. Wahab
    ;
    Mohd Arif Anuar Mohd Salleh
    ;
    Nurul Aida Husna Mohd Mahayuddin
    ;
    Aiman Mohd Halil
    ;
    Amira Qistina Syamimi Zaifuddin
    ;
    Mahadzir Muhammad Ishak
    This study aimed to investigate the effect of wetting characteristics of a dimpled micro-textured copper substrate on the spreading area of the Sn–0.7Cu solder alloy. A laser surface texturing (LST) technique was used to fabricate dimpled micro-textured on the copper substrate. Three samples were fabricated by varying the dimple spacing on the copper substrate such as 100, 140, and 180 µm. A 3D measuring laser microscope was used to study the surface roughness. The copper substrates’ water contact angle measurement and surface roughness were studied for their wetting characteristics. In order to study the effect of wetting characteristics of the dimpled micro-textured copper substrate, spreading area measurement was conducted. The result showed that dimpled micro-textured introduces higher surface roughness and contact angle, increasing the hydrophobicity. Consequently, this reduces the spreading area of Sn–0.7Cu solder alloy.
  • Publication
    Characterization of porous anodic aluminium oxide film on aluminium templates formed in anodizing process
    (Universiti Malaysia Perlis (UniMAP), 2010-09-06)
    Juyana A. Wahab
    ;
    Mohd Nazree Derman
    A porous anodic aluminium oxide (AAO) films were successfully fabricated on aluminium templates by using anodizing technique. The anodizing process was done in the mixed acid solution of phosphoric acid and acetic acid. The growth, morphology and chemical composition of AAO film were investigated. During the anodizing process, the growth of the oxide pores was strictly influenced by the anodizing parameters. The anodizing was done by varying the voltage at 70V to 130V and temperature from 5°C to 25°C. The electrolyte concentration was remaining constant. In this study, all the samples were characterized using scanning electron microscope (SEM) and X-ray diffraction (XRD) techniques. From this study, the optimum parameters to obtain porous AAO film with the mixture of phosphoric acid and acetic acid solution can be known.
  • Publication
    Effect of temperature and amount of Ag on TiO₂ thin film synthesised via sol–gel method
    (Springer, 2025-02)
    Dewi Suriyani Che Halin
    ;
    Kamrosni Abdul Razak
    ;
    Dharshini Karikalan
    ;
    Lukasz Kaczmarek
    ;
    Sebastian Miszczak
    ;
    Ayu Wazira Azhari
    ;
    Mohd Arif Anuar Mohd Salleh
    ;
    Nur Izzati Muhammad Nadzri
    ;
    Juyana A. Wahab
    ;
    Mohd. Mustafa Al Bakri Abdullah
    TiO₂ sol was produced via the sol–gel method with different amounts of AgNO₃ as the source of Ag. The Ag/TiO₂ thin film was obtained by spin coating and was annealed at various annealing temperatures (300°C, 400°C and 500°C) for 1 h. The effect of different amounts of AgNO₃ and different annealing temperatures on the TiO₂ thin films was studied by characterising the phase composition, surface morphology and water contact angle. Results from the x-ray diffraction (XRD) pattern show that with the addition of AgNO₃, Ag/TiO₂ can be formed at low annealing temperatures (300°C). At increased annealing temperatures (400°C and 500°C) and amounts of AgNO₃ (1.0 ml and 1.5 ml), Ag₂O and Ag₃O4 phases were observed. Flakes or flaky islands were formed on the thin film due to thermal expansion mismatch between the film and substrate, residual stress within the film or the release of volatile species when annealed at a low temperature of ⁓300°C. Increasing the temperature to 500°C resulted in the growth and coalescence of the flaky islands by the surface diffusion of adsorbed atoms (adatoms) and their annexation to the surface of existing nuclei. The water contact angle provides valuable insight into the surface interactions between water droplets and the surface of Ag/TiO₂ thin films. It was found that at 1.5 ml AgNO₃, the increased annealing temperature from 300°C to 500°C decreased the water contact angle of Ag/TiO₂ thin films from 83.86° to 34.62°, forming superhydrophilic properties, which indicated its excellent potential as a photocatalyst.
  • Publication
    Effectiveness of dimple microtextured copper substrate on performance of Sn-0.7Cu solder alloy
    ( 2022)
    Siti Faqihah Roduan
    ;
    Juyana A. Wahab
    ;
    Mohd Arif Anuar Mohd Salleh
    ;
    Nurul Aida Husna Mohd Mahayuddin
    ;
    Mohd. Mustafa Al Bakri Abdullah
    ;
    Aiman Bin Mohd Halil
    ;
    Amira Qistina Syamimi Zaifuddin
    ;
    Mahadzir Ishak Muhammad
    ;
    Andrei Victor Sandu
    ;
    Mădălina Simona Baltatu
    ;
    Petrica Vizureanu
    This paper elucidates the influence of dimple-microtextured copper substrate on the performance of Sn-0.7Cu solder alloy. A dimple with a diameter of 50 µm was produced by varying the dimple depth using different laser scanning repetitions, while the dimple spacing was fixed for each sample at 100 µm. The dimple-microtextured copper substrate was joined with Sn-0.7Cu solder alloy using the reflow soldering process. The solder joints’ wettability, microstructure, and growth of its intermetallic compound (IMC) layer were analysed to determine the influence of the dimple-microtextured copper substrate on the performance of the Sn-0.7Cu solder alloy. It was observed that increasing laser scan repetitions increased the dimples’ depth, resulting in higher surface roughness. In terms of soldering performance, it was seen that the solder joints’ average contact angle decreased with increasing dimple depth, while the average IMC thickness increased as the dimple depth increased. The copper element was more evenly distributed for the dimple-micro-textured copper substrate than its non-textured counterpart.
      25  5
  • Publication
    Characterization of SnO₂/TiO₂ with the addition of Polyethylene Glycol via sol-gel method for self-cleaning application
    ( 2023)
    Dewi Suriyani Che Halin
    ;
    A. Azliza
    ;
    Kamrosni Abdul Razak
    ;
    V. Chobpattana
    ;
    Mohd Arif Anuar Mohd Salleh
    ;
    Juyana A. Wahab
    ;
    Mohd Mustafa Albakri Abdullah
    ;
    L. Kaczmarek
    ;
    M. Nabiałek
    ;
    B. Jeż
    TiO₂ is one of the most widely used metal oxide semiconductors in the field of photocatalysis for the self-cleaning purpose to withdraw pollutants. Polyethylene glycol (PEG) is recommended as a stabilizer and booster during preparation of water-soluble TiO₂. Preparation of SnO₂/TiO₂ thin film deposition on the surface of ceramic tile was carried out by the sol-gel spin coating method by adding different amount of PEG (0g, 0.2g, 0.4g, 0.6g, 0.8g) during the preparation of the sol precursor. The effects of PEG content and the annealing temperature on the phase composition, crystallite size and the hydrophilic properties of SnO₂/TiO₂ films were studied. The X-ray diffraction (XRD) spectra revealed different phases existed when the films were annealed at different annealing temperatures of 350°C, 550°C and 750°C with 0.4 g of PEG addition. The crystallite sizes of the films were measured using Scherrer equation. It shows crystallite size was dependent on crystal structure existed in the films. The films with mixed phases of brookite and rutile shows the smallest crystallite size. In order to measure the hydrophilicity properties of films, the water contact angles for each film with different content of PEG were measured. It can be observed that the water contact angle decreased with the increasing of the content of PEG. It shows the superhydrophilicity properties for the films with the 0.8 g of PEG annealed at 750°C. This demonstrates that the annealed temperature and the addition of PEG affect the phase composition and the hydrophilicity properties of the films
      3  20
  • Publication
    Surface texturing method and roughness effect on the substrate performance: a short review
    (Malaysian Tribology Society, 2020)
    Mahayuddin, Nurul Aida Husna Mohd
    ;
    Juyana A. Wahab
    ;
    Mohd Arif Anuar Mohd Salleh
    ;
    Roduan Siti Faqihah
    ;
    Chen Heng Kheng
    Surface texture is one of interest to researchers as alterations surface roughness along with wettability are key factors towards properties enhancement of a material that would be beneficial for many industrial applications. This paper reviews published works on surfaces that had been roughened to various degrees, as well as techniques that had been utilised during the preparation of surface texture. The role of roughness in determining the static / dynamic wetting of the micro textural surface was discussed, how different shape and size parameters were used to fabricate the textural surface were examine, and how particular progress on some features on surface texture effect the wettability and roughness of the surface. Superhydrophobic surfaces have been considered for various industrial application due to the properties such as low adhesion and friction, as well as their extreme water-repellent properties. As interest in this field grow, there are a greater number of techniques and parameters used were reported for fabricating surface texture that result in surface roughness and wettability.
      3  9
  • Publication
    A study on nanostructured of anodised aluminium template synthesised by the mixture of phosphoric acid and acetic acid (Restricted)
    (Universiti Malaysia Perlis (UniMAP), 2010)
    Juyana A. Wahab
    The formation of anodic aluminium oxide (AAO) film in anodising process has been studied. The anodising process was done in a mixture of phosphoric acid and acetic acid. The purpose of mixed acid solution as electrolyte is to increase the efficiency of AAO film formation. This study was performed to determine optimum parameter of anodising process in order to develop AAO film with diverse application in electronic field. The studies were focused on the influence of anodising parameters which are anodising temperature and anodising voltage on the growth of AAO film. The anodising temperature was controlled in the range of 5°C to 25°C and the anodising voltage was controlled from 70V to 130V respectively. The electrical properties of AAO film also studied via impedance measurement. The growth, morphology and composition analysis of AAO film were investigated by scanning electron microscope (SEM) and X-ray diffraction (XRD) techniques. The results showed that the formation of AAO film was strictly influenced by the anodising parameter. The average pore diameter of AAO film was larger at temperature 15°C which is 87nm and the pores have more ordered arrangement. Meanwhile, the AAO film was shown have large pore diameter around 92nm at higher anodising voltage at 130V. The pore diameter of AAO film was gradually increased as the anodising voltage increase. The AAO film was shown to have highly ordered arrangement of pores at 130V of anodising voltage. The kinetic reaction of AAO film formation was expressed as percentage of mass change and AAO film thickness. At 15°C, the percentage of mass change showed a greater change which is 0.21% compared to the other anodising temperature. However, by increasing the anodising voltage, the percentage of mass change increased. Besides, the AAO film also showed greater thickness at 15°C which is 2.82μm. The thickness of AAO film decreased as the anodising temperature increased to 20°C and 25°C. At lower temperature, the thickness of AAO film is decreased. Meanwhile, the thickness of AAO film is strongly influenced by anodising voltage. Higher anodising voltage showed higher thickness of AAO film which is 2.8μm. The impedance measurement of AAO film revealed that the resistance of AAO film increased and the capacitance decreased as the thickness of AAO film increased. According to the results of this study, the optimum parameter of anodising should be in the range of 130V and the anodising temperature is about 15°C in order to obtain best characteristic of AAO film that can be related to the requirement of electronic applications.