Muhammad Firdaus Mohd Nazeri
Thumbnail Image
Preferred name
Muhammad Firdaus Mohd Nazeri
Official Name
Muhammad Firdaus , Mohd Nazeri
Alternative Name
Nazeri, Muhammad Firdaus Mohd
Nazeri, M. F.M.
Nazeri, M. F.Mohd
Nazeri, Muhammad Firdaus
Main Affiliation
Scopus Author ID
55206645000
Researcher ID
C-8522-2019

Research Output

Filters

1
5
Reset filters

Settings
Now showing 1 - 5 of 5
  • Publication
    Comparative wetting study of Sn-0.7Cu solder on dimple and pillar micro-texture fabricated by the photolithography technique
    ( 2024-12)
    Juyana A. Wahab
    ;
    Mohd Arif Anuar Mohd Salleh
    ;
    Marliza Mostapha @ Zakaria
    ;
    Muhammad Firdaus Mohd Nazeri
    ;
    Nurul Aida Husna Mohd Mahayuddin
    ;
    Siti Faqihah Roduan
    The study focused on exploring the impact of micro-textured surfaces on the wetting behaviour of Sn-0.7Cu solder. Dimple and pillar micro-textures, each with a diameter of 100 μm, were fabricated on the copper substrate using a photolithography technique. The Sn-0.7Cu solder was melted onto the micro-textured copper substrate during the soldering process. The spreading time, spreading area, and spreading rate of the solder on the copper substrate were investigated. The copper substrates with dimple textures exhibited a prolonged spreading time of 51 seconds, a smaller spreading area of 60.54 mm², and a slower spreading rate of 1.44 mm²/s than the pillar-textured copper substrates. However, the presence of micro-textures resulted in a reduced spreading area, indicative of enhanced solderability. This improvement is attributed to the textured substrate promoting higher copper diffusion during the soldering process. The controlled application of micro-textures holds promise for optimising wetting behaviour and solderability in electronic assembly processes, presenting avenues for further exploration and application in the realm of materials science and electronic manufacturing.
  • Publication
    A study of two dimensional metal carbide MXene Ti3C2 synthesis, characterization conductivity and radiation properties
    ( 2019-01-01)
    Rasid Z.A.M.
    ;
    Omar M.F.
    ;
    Muhammad Firdaus Mohd Nazeri
    ;
    Saidi S.A.
    ;
    Sandu A.V.
    ;
    Mohd. Mustafa Al Bakri Abdullah
    Since the discovery of exceptional properties of graphene, a lot of researchers focused on the discovery of another nobel two-dimensional (2D) materials. Recently, an elegant exfoliation approaches was proposed as a method to synthesis a new family of transitional 2D metal carbide or nitrades of MXene from a layered MAX phase. A layered MAX phase of Ti3AlC2 was synthesized through pressureless sintering (PLS) the initial powder of 3TiH2/1.1Al/2C without preliminary dehydrogenation under argon atmosphere at 1350°C. An elegant exfoliation approach was used to eliminates Al from its precursor to form a layered-structure of Ti3C2. In this study, thermal conductivity of MAX phase and MXene were studied using absolute axial heat flow method to measure the abilities sample to conduct heat and the data was collected using Picolog 1216 Data Logger. Electrical conductivity of these two materials was also compared by using two-point probe, due to its simplicity. Radiation properties of 2D MXene Ti3C2 was studied by using an established radon monitor, placed in closed, fabricated container. Morphological and structural properties of this 2D material were also studied using an established FESEM and XRD apparatus. SEM images shows two types of morphology which is a layer of Ti3C2 and the agglomerates Al2O3 with graphite. XRD pattern reveals three phases in this material which is a rhombohedral Al2O3, rhombohedral graphite and rhombohedral Ti3C2 phases, respectively. Thermal and electrical conductivity of MXene were proven higher than MAX phase. Radon concentration for this material for five consecutive days explains the radiation level of this material which is under the suggestion value from US Environmental Protection Agency (EPA). From this finding, it is can conveniently say that the MXene material can be promising material for electronic application.
  • Publication
    Effect additions Zn on Sn-0.7Cu lead-free solder: a short brief
    (IOP Publishing, 2020)
    Fatin Sufina Mohd Tarmizi
    ;
    Mohamad Najmi Masri
    ;
    Muhammad Firdaus Mohd Nazeri
    ;
    Ahmad Azmin Mohamad
    Sn-0.7Cu lead-free solder is an alternative solder material that suitable to replace Sn-Pb solder in electronic manufacturing. However, it has a weakness of high melting temperature and lower mechanical strength. In this study, the change in microstructure, elements, the structural and melting point of Sn-0.7Cu after the addition of different compositions of Zn element was discussed. The result shows that after adding a small amount of Zn, a refinement microstructure of Sn-0.7Cu-xZn solder alloy was obtained, and the melting point of the solder decreased from 227.7 °C to 225.7 °C. Besides, the formation new phase of was investigated by scanning electron microscope (SEM) followed by energy-dispersive x-ray spectroscopy (EDX) and x-ray diffraction (XRD). Besides, the behaviour of Sn-0.7Cu-xZn solder alloy can be further studied via open circuit potential (OCP) to determine the corrosion potential.
  • Publication
    The effect of Bismuth addition on Sn-Ag-Cu lead-free solder properties: a short review
    (IOP Publishing, 2020)
    M Muhamad
    ;
    MN Masri
    ;
    Muhammad Firdaus Mohd Nazeri
    ;
    AA Mohamad
    Sn-0.7Ag-0.5Cu lead-free solder is an alternative solder material suitable to replace Sn-Pb solder in electronic manufacturing. In this review, the change in the microstructure, elements, the structural and melting point of Sn-0.7Ag-0.5Cu after the addition of different compositions of bismuth were discovered. Besides, the influence of bismuth in lead-free solder alloys attracts to be studied due to its capability to improve the wettability and solder spread.
      1  4
  • Publication
    Corrosion Investigation of Sn-0.7Cu Pb-Free solder in open-circuit and polarized conditions
    (IOP Publishing, 2020)
    Mohd Zohirul Haziq Aziz
    ;
    Nasihah Zainon
    ;
    Ahmad Azmin Mohamad
    ;
    Muhammad Firdaus Mohd Nazeri
    The corrosion performance of Sn-0.7Cu solder alloy was investigated in 1 M hydrochloride acid by means of open-circuit potential and potentiodynamic polarization techniques. In open-circuit potential measurement, the potential showed almost constant reading after achieving potential -550 mV, consistent with single dissolution peak observed in potentiodynamic polarization. This revealed single element dissolution process of Sn took place. Supporting morphological and phase analyses were done by using scanning electron microscope and X-ray diffraction. Phase analysis confirmed the corrosion product are SnO and SnO2. Morphological analysis showed two type of oxide layer formed as corrosion product, which are compact oxide layer and loose rod-like oxide layer after polarization, while rod-like corrosion product was diminished in open-circuit condition. This indicate that complete protection from further corrosion was impossible due to the incomplete passivation layer formation in potentiodynamic polarization.
      1  3