Muhammad Salihin Zakaria
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Preferred name
Muhammad Salihin Zakaria
Official Name
Muhammad Salihin , Zakaria
Alternative Name
Zakaria, Muhammad Salihin
Zakaria, M. S.B.
Zakaria, M. S.
Salihin, M. Z.
Main Affiliation
Scopus Author ID
56479320900
Researcher ID
HTN-7486-2023

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  • Publication
    Network Structure and Mechanical Properties of Flexible Electronic Interconnects based on Linear Low-Density Polyethylene (LLDPE) and Liquid Silicone Rubber (LSR) Conductive Polymer Composites
    ( 2024-03-01)
    Khairul Anwar Abdul Halim
    ;
    Mohd Arif Anuar Mohd Salleh
    ;
    Badrul F.
    ;
    Azlin Fazlina Osman
    ;
    Mohd Firdaus Omar
    ;
    Suhaimi A.S.
    ;
    Muhammad Salihin Zakaria
    Conductive polymer composites (CPCs) with the ability to maintain high conductivity whilst remaining flexible at various operating temperatures and conditions have gained interest as potential materials for electronic interconnect applications. The ability of a polymer matrix to conduct electricity is mainly dependent on the conductive filler loadings as well as the formation of network paths within the CPCs. The main aim of this research work was to establish and understand the correlation between the network structure formation and mechanical properties of linear low-density polyethylene/copper (LLDPE/Cu) and liquid silicone rubber/copper (LSR/Cu) CPCs. Various techniques such as electron microscopy, thermal studies, four-point probe, and tensile testing were employed in this study. Furthermore, selected samples were characterized and tested using synchrotron micro-x-ray fluorescence (XRF) technique and dynamic mechanical analysis (DMA). It was found that the electrical conductivity of the CPCs increased with increasing filler loadings. Addition of Cu filler had a marginal effect on the tensile strength of both LLDPE/Cu and LSR/Cu CPCs. Nevertheless, it was found that the elongation at break for LLDPE/Cu consistently increased with the addition of Cu whereas, for LSR/Cu samples, the elongation at break decreased with the addition of Cu at various loadings. The scanning electron microscopy (SEM) micrographs obtained show that the particles of Cu were closer to one another at higher filler loadings. The data obtained revealed the potential for utilizing CPCs as flexible interconnects suitable for advanced electronic applications.
      1
  • Publication
    The effect of various nanoclay surface modifications on the thermal and mechanical properties of amorphous polyamide nanocomposites
    ( 2020-01-01)
    Khairul Anwar Abdul Halim
    ;
    Kennedy J.E.
    ;
    Farrell J.B.
    ;
    Muhammad Salihin Zakaria
    The addition of nanoclay within polymer matrix is anticipate to enhance the properties of the polymer system. Nonetheless, one of the key elements in property enhancements of a polymer nanocomposites is the surface modifications of the nanoclay. This is due to the affinity between polymer matrix and nanoclay is of important factors should be considered. In this study, amorphous polyamide was melt blended with different nanoclay grades with different surface modifications in order to evaluate the best clay grade for the polymer system. The thermal analysis carried out on the amorphous polyamide nanocomposites were carried out by means of differential scanning calorimetry (DSC) and dynamic mechanical analysis (DMA) whereas the mechanical properties were investigated using tensile testing. It was observed that there were changes in the glass transition temperature (Tg) of the nanocomposites due to clay additions. Further, the storage modulus was found to increase as a result of nanoclay incorporation. The type of clay grades significantly affects the mechanical properties of the amorphous polyamide nanocomposites.
      4  21