Juyana A. Wahab
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Preferred name
Juyana A. Wahab
Official Name
A. Wahab, Juyana
Alternative Name
A Wahab, Juyana
Wahab, Juyana A.
Wahab, J. A.
Main Affiliation
Scopus Author ID
36783614000
Researcher ID
AAY-8291-2021

Research Output
Now showing 1 - 4 of 4
  • Publication
    Comparative wetting study of Sn-0.7Cu solder on dimple and pillar micro-texture fabricated by the photolithography technique
    ( 2024-12)
    Juyana A. Wahab
    ;
    Mohd Arif Anuar Mohd Salleh
    ;
    Marliza Mostapha @ Zakaria
    ;
    Muhammad Firdaus Mohd Nazeri
    ;
    Nurul Aida Husna Mohd Mahayuddin
    ;
    Siti Faqihah Roduan
    The study focused on exploring the impact of micro-textured surfaces on the wetting behaviour of Sn-0.7Cu solder. Dimple and pillar micro-textures, each with a diameter of 100 μm, were fabricated on the copper substrate using a photolithography technique. The Sn-0.7Cu solder was melted onto the micro-textured copper substrate during the soldering process. The spreading time, spreading area, and spreading rate of the solder on the copper substrate were investigated. The copper substrates with dimple textures exhibited a prolonged spreading time of 51 seconds, a smaller spreading area of 60.54 mm², and a slower spreading rate of 1.44 mm²/s than the pillar-textured copper substrates. However, the presence of micro-textures resulted in a reduced spreading area, indicative of enhanced solderability. This improvement is attributed to the textured substrate promoting higher copper diffusion during the soldering process. The controlled application of micro-textures holds promise for optimising wetting behaviour and solderability in electronic assembly processes, presenting avenues for further exploration and application in the realm of materials science and electronic manufacturing.
  • Publication
    Surface texturing method and roughness effect on the substrate performance: a short review
    (Malaysian Tribology Society, 2020)
    Mahayuddin, Nurul Aida Husna Mohd
    ;
    Juyana A. Wahab
    ;
    Mohd Arif Anuar Mohd Salleh
    ;
    Roduan Siti Faqihah
    ;
    Chen Heng Kheng
    Surface texture is one of interest to researchers as alterations surface roughness along with wettability are key factors towards properties enhancement of a material that would be beneficial for many industrial applications. This paper reviews published works on surfaces that had been roughened to various degrees, as well as techniques that had been utilised during the preparation of surface texture. The role of roughness in determining the static / dynamic wetting of the micro textural surface was discussed, how different shape and size parameters were used to fabricate the textural surface were examine, and how particular progress on some features on surface texture effect the wettability and roughness of the surface. Superhydrophobic surfaces have been considered for various industrial application due to the properties such as low adhesion and friction, as well as their extreme water-repellent properties. As interest in this field grow, there are a greater number of techniques and parameters used were reported for fabricating surface texture that result in surface roughness and wettability.
      3  5
  • Publication
    Effectiveness of dimple microtextured copper substrate on performance of Sn-0.7Cu solder alloy
    ( 2022)
    Siti Faqihah Roduan
    ;
    Juyana A. Wahab
    ;
    Mohd Arif Anuar Mohd Salleh
    ;
    Nurul Aida Husna Mohd Mahayuddin
    ;
    Mohd. Mustafa Al Bakri Abdullah
    ;
    Aiman Bin Mohd Halil
    ;
    Amira Qistina Syamimi Zaifuddin
    ;
    Mahadzir Ishak Muhammad
    ;
    Andrei Victor Sandu
    ;
    Mădălina Simona Baltatu
    ;
    Petrica Vizureanu
    This paper elucidates the influence of dimple-microtextured copper substrate on the performance of Sn-0.7Cu solder alloy. A dimple with a diameter of 50 µm was produced by varying the dimple depth using different laser scanning repetitions, while the dimple spacing was fixed for each sample at 100 µm. The dimple-microtextured copper substrate was joined with Sn-0.7Cu solder alloy using the reflow soldering process. The solder joints’ wettability, microstructure, and growth of its intermetallic compound (IMC) layer were analysed to determine the influence of the dimple-microtextured copper substrate on the performance of the Sn-0.7Cu solder alloy. It was observed that increasing laser scan repetitions increased the dimples’ depth, resulting in higher surface roughness. In terms of soldering performance, it was seen that the solder joints’ average contact angle decreased with increasing dimple depth, while the average IMC thickness increased as the dimple depth increased. The copper element was more evenly distributed for the dimple-micro-textured copper substrate than its non-textured counterpart.
      15  2
  • Publication
    Characterization of SnOâ‚‚/TiOâ‚‚ with the addition of Polyethylene Glycol via sol-gel method for self-cleaning application
    ( 2022)
    Dewi Suriyani Che Halin
    ;
    A. Azliza
    ;
    Kamrosni Abdul Razak
    ;
    V. Chobpattana
    ;
    Mohd Arif Anuar Mohd Salleh
    ;
    Juyana A. Wahab
    ;
    Mohd Mustafa Albakri Abdullah
    ;
    L. Kaczmarek
    ;
    M. Nabiałek
    ;
    B. Jeż
    TiO₂ is one of the most widely used metal oxide semiconductors in the field of photocatalysis for the self-cleaning purpose to withdraw pollutants. Polyethylene glycol (PEG) is recommended as a stabilizer and booster during preparation of water-soluble TiO₂. Preparation of SnO₂/TiO₂ thin film deposition on the surface of ceramic tile was carried out by the sol-gel spin coating method by adding different amount of PEG (0g, 0.2g, 0.4g, 0.6g, 0.8g) during the preparation of the sol precursor. The effects of PEG content and the annealing temperature on the phase composition, crystallite size and the hydrophilic properties of SnO₂/TiO₂ films were studied. The X-ray diffraction (XRD) spectra revealed different phases existed when the films were annealed at different annealing temperatures of 350°C, 550°C and 750°C with 0.4 g of PEG addition. The crystallite sizes of the films were measured using Scherrer equation. It shows crystallite size was dependent on crystal structure existed in the films. The films with mixed phases of brookite and rutile shows the smallest crystallite size. In order to measure the hydrophilicity properties of films, the water contact angles for each film with different content of PEG were measured. It can be observed that the water contact angle decreased with the increasing of the content of PEG. It shows the superhydrophilicity properties for the films with the 0.8 g of PEG annealed at 750°C. This demonstrates that the annealed temperature and the addition of PEG affect the phase composition and the hydrophilicity properties of the films
      3  20