Conference Publications

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https://hdl.handle.net/20.500.14170/379

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Browsing Conference Publications by Department "Faculty of Electronic Engineering & Technology"
  • Publication
    Graphitization of empty fruit bunch (EFB) waste at lower heating temperature
    (AIP Publishing, 2023)
    Norizah Abd Karim
    ;
    Che Mohd Ruzaidi Ghazali
    ;
    Muhammad Mahyiddin Ramli
    ;
    Marniati
    ;
    Desita Ria Yusian
    ;
    Muhammad Zulfadhly Mohd Fazil
    Previously, synthetic graphite was produced at higher heating temperature, which is above 2500°C in complex processing method and by using petroleum coke, anthracite, and coal tar pitch as the starting materials. These materials are known as non-waste sources. Therefore, in this study, Empty Fruit Bunch Waste (EFB) has been identified as a potential carbon source from waste to replace the non-waste sources of starting materials for synthetic graphite production. Hence, by implementing a controlled heating condition via pyrolysis process, with fixed heating rate and soaking time, Empty Fruit Bunch Waste (EFB), was heated at 3 different series of heating temperatures, which are, 300°C, 400°C and 500°C. The heating rate applied was maintained at 10°/min and the soaking time used 3 hours. After the heating treatment, the synthetic graphite obtained was characterized by various analytical tools, including, X-Ray Diffraction (XRD) analysis, Scanning Electron Microscope (SEM) analysis, and Fourier Transform Infra-Red (FTIR) Analysis. Based on the analysis, it was confirmed that synthetic graphite was successfully synthesized by heat treatment at 500 °C with 10°/min of heating rate and 3 hours soaking time. Synthetic graphite was observed in the form of amorphous carbon based on the XRD diffraction pattern that matches with the reference code of 00-041-1487.
      1  11
  • Publication
    Preliminary study on the effect of Ni addition on tin (Sn) whisker growth from lead-free solder coating
    (IOP Publishing, 2020)
    Aimi Noorliyana Hashim
    ;
    Mohd Arif Anuar Mohd Salleh
    ;
    Muhammad Mahyiddin Ramli
    ;
    Khor Chu Yee
    ;
    Noor Zaimah Mohd Mokhtar
    It has been widely confirmed that alloying significantly can mitigate the formation of tin (Sn) whiskers and consequently became a possible candidate as a lead-free alloys coating material in the microelectronics industry. In this study, the effect of 0.05 wt.% Ni addition on the formation and growth of Sn whisker in Sn-0.7Cu solder coatings have been investigated under continuous mechanically stress induced at room temperature. It is clearly found that Ni addition have significantly enhanced stress relaxation by reducing the growth rate of formation Sn whiskers in Sn-0.7Cu solder coatings. The morphology of (Cu,Ni)6Sn5 interfacial IMC was more refine and thinner with a fine scallop-shaped interfacial intermetallic layer purposely to lower the compressive stress of Sn coating and extend the nucleation period, thus mitigating the formation and growth of Sn whiskers.
      24  1