Now showing 1 - 4 of 4
  • Publication
    Hydrothermal growth of titania nanowires for SAW device sensing area
    Synthesis of titania or titanium dioxide (TiO 2) is attracted to energy and environmental applications. Here, the growth of nanostructure TiO 2 nanowires on Si (100) substrates by using the two-step method. Different seed layers of TiO 2 were deposited by spin coating and annealing, followed by the growth of TiO 2 nanowires by using the hydrothermal method. The sol-gel technique was used in preparing the TiO 2 solution for the thin film deposition purpose. Acetic acid, hydrochloric acid and tris (2-aminoethyl) amine were used as a stabilizer to synthesize three different TiO 2 seed layers. The aim of this study was to understand the role of polycrystalline size on thin film towards the diameter of nanowires grown as a sensing area in Surface Acoustic Wave (SAW) Biosensor. The morphology and structure of the thin film and TiO 2 nanowires were characterized using X-Ray diffraction (XRD), scanning electron microscope (SEM), field emission scanning electron microscope (FESEM) and atomic force microscopy (AFM).
  • Publication
    Characterization of Zinc Oxide (ZnO) piezoelectric properties for Surface Acoustic Wave (SAW) device
    In fabricating Surface Acoustic Wave (SAW) biosensors device, the substrate is one of important factors that affected to performance device. there are many types of piezoelectric substrate in the markets and the cheapest is zinc Oxide substrate. Zinc Oxide (ZnO) with its unique properties can be used as piezoelectric substrate along with SAW devices for detection of DNA in this research. In this project, ZnO thin film is deposited onto silicon oxide substrate using electron beam evaporation (E-beam) and Sol-Gel technique. Different material structure is used to compare the roughness and best piezoelectric substrate of ZnO thin film. Two different structures of ZnO target which are pellet and granular are used for e-beam deposition and one sol-gel liquid were synthesize and compared. Parameter for thickness of ZnO e-beam deposition is fixed to a 0.1kÅ for both materials structure and sol-gel was coat using spin coat technique. After the process is done, samples are annealed at temperature of 500°C for 2 hours. The structural properties of effect of post annealing using different material structure of ZnO are studied using Atomic Force Microscopic (AFM) for surface morphology and X-ray Diffraction (XRD) for phase structure.
  • Publication
    Simulation and analysis of Piezoresistive microcantilever
    ( 2023-12) ;
    Catherine Lim Ee Chen
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    Siti Noorjannah Ibrahim
    Currently, most piezoresistive microcantilever sensors are configured with a dual-layer design that includes a piezoresistor integrated onto the upper surface of a microcantilever. The dual-layer design effectively enhances sensitivity and the piezoresistance effect. However, integrating the piezoresistor onto the microcantilever in the fabrication process necessitates additional steps, leading to extended manufacturing times and increased production costs. In this paper, the mechanical behavior of a single-layer piezoresistive microcantilever, namely displacement, stress, and strain, is investigated and analyzed using ANSYS Multiphysics. The contributing factors expected to affect the device's performance are its geometrical dimensions, and the materials used. Regarding the device dimensions, the length, thickness, and width of the cantilever were varied. It was found that the performance of the piezoresistive microcantilever can be improved by increasing the length and decreasing the thickness. The displacement of the microcantilevers increased by about 230%, from 75.76μm to 250.12μm, when the length was increased from 225μm to 350μm. The applied force ranged from 2uN to 12uN. Similarly, the stress and strain produced on the microcantilevers also increased by about 60.83% and 57.22%, respectively. From the material point of view, the microcantilever made with silicon always had the highest displacement value compared to silicon nitride, silicon dioxide, and polysilicon. This is due to the Young's modulus value, where materials with lower Young's modulus will have higher displacement and stress.
  • Publication
    Simulation of piezoelectric transducer microphone diaphragm based on different materials
    ( 2024-06) ;
    Wen Jie Koh
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    Siti Noorjannah Ibrahim
    Piezoelectric microphone which utilizes MEMS technology is a type of transducer that converts an input acoustic signal into an output electrical signal. The characteristics of the microphone diaphragm such as the diaphragm design features and the type of piezoelectric materials used will affect the performance of the microphone in terms of sensitivity. It is hard to control the stress of the diaphragm used in the MEMS transducer microphone. A modification of the diaphragm is done in this project to reduce the residual stress of the piezoelectric transducer. In addition, finite element analysis namely structural, modal and harmonic were carried out using Ansys 15.0 to simulate the mechanical and dynamic behaviour of the microphone diaphragm. Two types of diaphragm structure were designed, namely square and circular, while three types of piezoelectric material which are AlN, PZT and ZnO were used as the diaphragm material. The structural analysis findings of the diaphragm subjected to 1 Pa pressure revealed that the circular diaphragm made of AlN material exhibited the highest stress, reaching 43.05 GPa, surpassing the stresses observed in the other two materials. On the contrary, the square diaphragm composed of PZT material demonstrated the lowest stress, with only 1.55 GPa. In terms of resonance frequency, the circular AlN diaphragm achieved the highest resonant frequency, reaching 449.84 kHz, whereas the square PZT diaphragm exhibited the lowest frequency at 200.25 kHz. In general, the circular diaphragm design consistently yielded higher first resonant frequencies compared to the square design.The results show that the circular diaphragm with AlN piezoelectric materials is the ideal diaphragm in the microphone because of the highest stress generated and the first resonant frequency. The stress is related to the sensitivity of a microphone while the high resonant frequency can lead to the better optimization of signal to noise ratio control.