The effect of Bismuth addition on Sn-Ag-Cu lead-free solder properties: a short review
Journal
IOP Conference Series: Earth and Environmental Science
ISSN
1755-1307
1755-1315
Date Issued
2020
Author(s)
M Muhamad
MN Masri
AA Mohamad
DOI
10.1088/1755-1315/596/1/012007
Handle (URI)
Abstract
Sn-0.7Ag-0.5Cu lead-free solder is an alternative solder material suitable to replace Sn-Pb solder in electronic manufacturing. In this review, the change in the microstructure, elements, the structural and melting point of Sn-0.7Ag-0.5Cu after the addition of different compositions of bismuth were discovered. Besides, the influence of bismuth in lead-free solder alloys attracts to be studied due to its capability to improve the wettability and solder spread.
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