Publication:
The effect of thermal annealing on the microstructure and mechanical properties of Sn-0.7Cu-xZn solder joint
The effect of thermal annealing on the microstructure and mechanical properties of Sn-0.7Cu-xZn solder joint
Date
2021
Authors
Mohd Izrul Izwan Ramli
Mohd Arif Anuar Mohd Salleh
Rita Mohd Said
Mohd. Mustafa Al Bakri Abdullah
Dewi Suriyani Che Halin
Norainiza Saud
Marcin Nabiałek
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Research Projects
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Abstract
The microstructural properties of a Pb-free solder joint significantly affect its mechanical behaviours. This paper details a systematic study of the effect of the annealing process on the microstructure and shear strength of a Zn-added Sn-0.7Cu solder joint. The results indicated that the IMC layer’s thickness at the solder/Cu interface increases with annealing time. The interfacial IMC layer of the Sn-0.7Cu solder joint gradually thickened with increasing annealing time and annealing temperature, while the interfacial IMC layer’s morphology changed from scallop-type to layer-type after the annealing process. However, the addition of 1.0 wt.% and 1.5 wt.% Zn in the Sn-0.7Cu effectively altered the interfacial IMC phase to Cu-Zn and suppressed the growth of Cu3Sn during the annealing process. The single-lap shear tests results confirmed that the addition of Zn decreased the shear strength of Sn-0.7Cu. The interfacial IMC of the Cu6Sn5 phase in Sn-0.7Cu changed to Cu-Zn due to the addition of Zn. The shear fractures in the annealed solder joint were ductile within the bulk solder instead of the interfacial IMC layer. Increased annealing time resulted in the increased presence of the Cu-Zn phase, which decreased the hardness and shear strength of the Sn-0.7Cu solder joint.
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Keywords
Zinc,
Intermetallic compound,
IMC thickness,
Annealing process