Khairul Salleh Basaruddin
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Preferred name
Khairul Salleh Basaruddin
Official Name
Basaruddin, Khairul Salleh
Alternative Name
Basaruddin, Khairul S.
Basaruddin, K
Bin Basaruddin, Khairul Salleh
Basaruddin, K. S.
Khairul, Salleh B.
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Scopus Author ID
54683507500
Researcher ID
I-8478-2019

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  • Publication
    Energy release rate analysis on the interface cracks of enamel-cement-bracket fracture using virtual crack closure technique
    ( 2017-10-29)
    Syafiq Farhan Samshuri
    ;
    Ruslizam Daud
    ;
    Mohd Afendi Rojan
    ;
    Fauziah Che Mat
    ;
    Khairul Salleh Basaruddin
    ;
    Rozita Hassan
    This paper presents the energy method to evaluate fracture behavior of enamel-cement-bracket system based on cement thickness. Finite element (FE) model of enamel-cement-bracket was constructed by using ANSYS Parametric Design Language (APDL). Three different thickness were used in this study, 0.05, 0.2, and 0.271 mm which assigned as thin, medium and thick for both enamel-cement and cement bracket interface cracks. Virtual crack closure technique (VCCT) was implemented as a simulation method to calculated energy release rate (ERR). Simulation results were obtained for each thickness are discussed by using Griffith's energy balance approach. ERR for thin thickness are found to be the lowest compared to medium and thick. Peak value of ERR also showed a significant different between medium and thick thickness. Therefore, weakest bonding occurred at low cement thickness because less load required to produce enough energy to detach the bracket. For medium and thick thickness, both increased rapidly in energy value at about the mid-point of the enamel-cement interface. This behavior occurred because of the increasing in mechanical and surface energy when the cracks are increasing. However, result for thick thickness are higher at mid-point compared to thin thickness. In conclusion, fracture behavior of enamel cracking process for medium most likely the safest to avoid enamel fracture and withstand bracket debonding.