Kamarudin Hussin
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Preferred name
Kamarudin Hussin
Official Name
Hussin, Kamarudin
Alternative Name
Hussin, K.
Hussin, Kamarudin
Kamarudin, Hussin
Kamaruddin, Hussin
Kamaruddin, H.
Husin, Kamarudin
Main Affiliation
Scopus Author ID
16642513600
Researcher ID
FZF-9851-2022

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  • Publication
    Heat dissipation analysis under natural convection condition on high power LED
    ( 2013)
    Rajendaran Vairavan
    ;
    Zaliman Sauli
    ;
    Vithyacharan Retnasamy,
    ;
    Kamarudin Hussin
    As the technology downscales with superior power and increased package density, the thermal effects of the high power LED are significant. Thus, the operating junction temperature of the high power light emitting diodes has to be reduced. In this paper, evaluation on single chip high power light emitting was done. The prime motive of this work was to assess the effect of heat slug size on the junction temperature and stress of LED chip under natural convection condition at ambient temperature of 25°C. Two sizes of rectangular heat slug were used. Simulation was carried out using Ansys version 11. Input power of 0.1W and 1W was applied to LED. Simulated results indicated that a larger slug size is favorable for a lower operating junction temperature and stress of the LED chip.
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