Home
  • English
  • Čeština
  • Deutsch
  • Español
  • Français
  • Gàidhlig
  • Latviešu
  • Magyar
  • Nederlands
  • Português
  • Português do Brasil
  • Suomi
  • Log In
    New user? Click here to register. Have you forgotten your password?
Home
  • Browse Our Collections
  • Publications
  • Researchers
  • Research Data
  • Institutions
  • Statistics
    • English
    • Čeština
    • Deutsch
    • Español
    • Français
    • Gàidhlig
    • Latviešu
    • Magyar
    • Nederlands
    • Português
    • Português do Brasil
    • Suomi
    • Log In
      New user? Click here to register. Have you forgotten your password?
  1. Home
  2. Research Output and Publications
  3. Faculty of Electronic Engineering & Technology (FKTEN)
  4. Journal Articles
  5. Heat dissipation analysis under natural convection condition on high power LED
 
Options

Heat dissipation analysis under natural convection condition on high power LED

Journal
Advances in Environmental Biology
ISSN
1995-0756
Date Issued
2013
Author(s)
Rajendaran Vairavan
Universiti Malaysia Perlis
Zaliman Sauli
Universiti Malaysia Perlis
Vithyacharan Retnasamy,
Universiti Malaysia Perlis
Kamarudin Hussin
Universiti Malaysia Perlis
Abstract
As the technology downscales with superior power and increased package density, the thermal effects of the high power LED are significant. Thus, the operating junction temperature of the high power light emitting diodes has to be reduced. In this paper, evaluation on single chip high power light emitting was done. The prime motive of this work was to assess the effect of heat slug size on the junction temperature and stress of LED chip under natural convection condition at ambient temperature of 25°C. Two sizes of rectangular heat slug were used. Simulation was carried out using Ansys version 11. Input power of 0.1W and 1W was applied to LED. Simulated results indicated that a larger slug size is favorable for a lower operating junction temperature and stress of the LED chip.
Subjects
  • Aluminum rectangular ...

  • Ansys

  • Heat slug size variat...

  • Junction temperature

  • Single chip LED

File(s)
Heat dissipation analysis under natural convection condition on high power LED.pdf (101.09 KB)
Views
1
Acquisition Date
Nov 19, 2024
View Details
Downloads
14
Acquisition Date
Nov 19, 2024
View Details
google-scholar
  • About Us
  • Contact Us
  • Policies