Conference Publications

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https://hdl.handle.net/20.500.14170/379

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Browsing Conference Publications by Subject "Electromigration"
  • Publication
    A short review: reliability issues of lead-free Sn-based alloys for superconducting applications
    (Springer, 2023)
    Y. P. Tan
    ;
    Flora Somidin
    As the trends of electronic devices are moving to miniaturization which requires high-density electronic packaging and high-speed performance, superconducting solder alloy has attracted considerable interest to fulfill the requirements of advanced electronic packaging as it provides sufficient superconductivity which minimizing the loss of current densities carried by superconductors. In the past few decades, leaded superconducting solder alloy were widely used in the industry due to its satisfied performance. However, development of lead-free solder alloy for superconducting applications is initiated to replace leaded solder alloy due to its toxicity. Sn-based solder alloy is the most popular candidate for replacing leaded solder alloy in the industry, but the reliability of Sn-based solder alloy is concerned. This paper reviewed the reliability issues of lead-free Sn-based superconducting interconnects when subjected to high current stressing. Electromigration, thermo-migration, and the subsequence issues caused by high current stressing are covered. This article also summarized the studies done on minimizing the reliability issues of potential Sn-based superconducting solder alloy caused by high current stressing.
  • Publication
    Tin whiskers formation in Sn₀.₇Cu₀.₀₅Ni₁.₅Bi under electro-migration stressing
    (Institute of Physics, Polish Academy of Sciences (PAS), 2020)
    N.Z.M. Mokhtar
    ;
    Mohd Arif Anuar Mohd Salleh
    ;
    G.M. Zhang
    ;
    D.M. Harvey
    ;
    M. Nabialek
    ;
    Aimi Noorliyana Hashim
    ;
    S.F. Nazri
    Stress induced by electrical current testing indeed has caused the formation of many whiskers growth in soldering applications. The aim of this investigation is to investigate the electrical current testing to the formation of whiskers. Also the mitigation could be achieved with the additional element of Nickel-Bismuth (Ni–Bi). Characterization of whisker growths are evaluated using the Scanning Electron Microscopy (SEM) on the deposits near anode and cathode areas. Synchrotron micro-XRF were performed on Sn₀.₇Cu₀.₀₅Ni₁.₅Bi at anode and cathode to accurately observe the distributions of elements in the sample. The obtained results demonstrate that the whisker growths with the effect of current stressing is associated with the intermetallic compound (IMCs) thickness on the anode and cathode areas. Finding shows that by addition of Ni-Bi elements can help to reduce the amount of whiskers form by refining the IMCs formation.