Flora Somidin
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Preferred name
Flora Somidin
Official Name
Flora, Somidin
Alternative Name
Somidin, F.
Somidin, Flora
Main Affiliation
Scopus Author ID
54973802500
Researcher ID
GPF-4634-2022

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  • Publication
    In-situ observation of high-temperature Pb-free electric interconnections by synchrotron microradiography
    ( 2021-05-15)
    Abdul Razak N.R.
    ;
    Tan X.F.
    ;
    Flora Somidin
    ;
    Yasuda H.
    ;
    McDonald S.D.
    ;
    Nogita K.
    Despite a large amount of research on transient liquid phase (TLP) bonding methods for high operating temperature Pb-free solder electric interconnections using Cu6Sn5 intermetallics (IMCs), two fundamental difficulties remain, namely, slow TLP process kinetics and uncontrolled void formation. Here we observe the TLP processes for rapid Cu6Sn5 growth using a recently developed technique via real-time synchrotron X-ray imaging. The technique enables in-situ characterization of the growth kinetics and real-time observation of the IMC evolution at the molten solder/solid substrate interfaces and the formation of voids and cracking during TLP bonding, which will contribute to the development of products suitable for high reliability and high-temperature applications, e.g., electric vehicles.
      1
  • Publication
    Imaging the polymorphic transformation in a single Cu6Sn5 grain in a solder joint
    ( 2018)
    Flora Somidin
    ;
    Hiroshi Maeno
    ;
    Xuan Tran
    ;
    Stuart D. McDonald
    ;
    Syo Matsumura
    ;
    Kazuhiro Nogita
    ;
    Mohd Arif Anuar Mohd Salleh
    In-situ observations of the polymorphic transformation in a single targeted Cu6Sn5 grain constrained between Sn-0.7 wt % Cu solder and Cu-Cu3Sn phases and the associated structural evolution during a solid-state thermal cycle were achieved via a high-voltage transmission electron microscope (HV-TEM) technique. Here, we show that the monoclinic η′-Cu6Sn5 superlattice reflections appear in the hexagonal η-Cu6Sn5 diffraction pattern upon cooling to isothermal 140 °C from 210 °C. The in-situ real space imaging shows that the η′-Cu6Sn5 contrast pattern is initiated at the grain boundary. This method demonstrates a new approach for further understanding the polymorphic transformation behavior on a real solder joint.
      1  11
  • Publication
    Fabrication and characterization of hybrid microwave assisted sintering Sn-0.7Cu + 1.0wt.% Si₃N₄ composite solder
    ( 2015)
    Flora Somidin
    One of the leading choices in upgrading the properties of existing lead-free solder alloys is by composite technology approach, whereby high technical ceramic particles can be added into the solder alloy matrix. Accordingly, Sn-0.7Cu + 1.0wt.% Si₃N₄ composite solder was synthesized using powder metallurgy routes which consist of blending, compaction and sintering. This research introduced a hybrid microwave assisted sintering process which can sinter ceramic-reinforced composite solder at approximately 185˚C within 2 minutes without holding time and protective inert gas. In order to evaluate the compatibility of hybrid microwave assisted sintering approach in ceramic-reinforced composite solder development, a detailed comparison of the process and properties of conventionally sintered and microwave sintered samples of Sn-0.7Cu + 1.0wt.% Si₃N₄ composite solder was performed. Identical sintering temperature at 185 ˚C was used for both types of sintering, in which conventional sintering was performed using a tube furnace in an argon atmosphere for 2 hours. The monolithic Sn-0.7Cu solder sample was also synthesized as control sample in a similar way. Hybrid microwave assisted sintering method showed significant advantages in processing compared to conventional sintering method, such as rapid heating rate, shortened sintering time, less energy consumption and much less expensive equipment. The influence of different sintering methodologies on Sn-0.7Cu + 1.0wt.% Si₃N₄ bulk solder sample were investigated based on the density, porosity, microhardness, microstructures, wettability and intermetallic compound thickness on Cu-substrate. It was noted that microwave sintering method can densify the Sn-0.7Cu + 1.0wt.% Si₃N₄ composite bulk solder green compact in a short time, however, conventional sintered sample showed better density and porosity. Interestingly, finer and well-distributed precipitates were observed in microwave sintered samples. This has led to higher microhardness performance observed in microwave sintered sample (12.0 ± 0.2 HV) compared to the conventionally sintered sample (11.2 ± 0.1 HV). The wettability performance of Sn-0.7Cu + 1.0wt.% Si₃N₄ composite solder on Cu-substrate was slightly reduced with microwave sintering approach, however, insignificant difference of intermetallic compound thickness was observed in both microwave sintered and conventionally sintered samples. Overall, hybrid microwave assisted sintering showed better processing with promising properties on ceramic-reinforced Sn-0.7Cu + 1.0wt.% Si₃N₄ composite solder.
      4  10