UniMAP RIS :: Browsing by Department "Faculty of Chemical Engineering & Technology"

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A. Azliza

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Kamrosni Abdul Razak

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V. Chobpattana

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Juyana A. Wahab

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Mohd Mustafa Albakri Abdullah

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L. Kaczmarek

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M. Nabiałek

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B. Jeż

TiO₂ is one of the most widely used metal oxide semiconductors in the field of photocatalysis for the self-cleaning purpose to withdraw pollutants. Polyethylene glycol (PEG) is recommended as a stabilizer and booster during preparation of water-soluble TiO₂. Preparation of SnO₂/TiO₂ thin film deposition on the surface of ceramic tile was carried out by the sol-gel spin coating method by adding different amount of PEG (0g, 0.2g, 0.4g, 0.6g, 0.8g) during the preparation of the sol precursor. The effects of PEG content and the annealing temperature on the phase composition, crystallite size and the hydrophilic properties of SnO₂/TiO₂ films were studied. The X-ray diffraction (XRD) spectra revealed different phases existed when the films were annealed at different annealing temperatures of 350°C, 550°C and 750°C with 0.4 g of PEG addition. The crystallite sizes of the films were measured using Scherrer equation. It shows crystallite size was dependent on crystal structure existed in the films. The films with mixed phases of brookite and rutile shows the smallest crystallite size. In order to measure the hydrophilicity properties of films, the water contact angles for each film with different content of PEG were measured. It can be observed that the water contact angle decreased with the increasing of the content of PEG. It shows the superhydrophilicity properties for the films with the 0.8 g of PEG annealed at 750°C. This demonstrates that the annealed temperature and the addition of PEG affect the phase composition and the hydrophilicity properties of the films

Publication

Microstructure evolution of Ag/TiO2 thin film

( 2021)

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Kamrosni Abdul Razak

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Mohd Izrul Izwan Ramli

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Ayu Wazira Azhari

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Kazuhiro Nogita

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Hideyuki Yasuda

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Marcin Nabiałek

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Jerzy J. Wysłocki

Ag/TiO2 thin films were prepared using the sol-gel spin coating method. The microstructural growth behaviors of the prepared Ag/TiO2 thin films were elucidated using real-time synchrotron radiation imaging, its structure was determined using grazing incidence X-ray diffraction (GIXRD), its morphology was imaged using the field emission scanning electron microscopy (FESEM), and its surface topography was examined using the atomic force microscope (AFM) in contact mode. The cubical shape was detected and identified as Ag, while the anatase, TiO2 thin film resembled a porous ring-like structure. It was found that each ring that coalesced and formed channels occurred at a low annealing temperature of 280 °C. The energy dispersive X-ray (EDX) result revealed a small amount of Ag presence in the Ag/TiO2 thin films. From the in-situ synchrotron radiation imaging, it was observed that as the annealing time increased, the growth of Ag/TiO2 also increased in terms of area and the number of junctions. The growth rate of Ag/TiO2 at 600 s was 47.26 µm2/s, and after 1200 s it decreased to 11.50 µm2/s and 11.55 µm2/s at 1800 s. Prolonged annealing will further decrease the growth rate to 5.94 µm2/s, 4.12 µm2/s and 4.86 µm2/s at 2400 s, 3000 s and 3600 s, respectively.

Publication

Microstructure evolution of Ag/TiO₂ thin film

( 2021)

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Kamrosni Abdul Razak

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Mohd Izrul Izwan Ramli

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Ayu Wazira Azhari

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Kazuhiro Nogita

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Hideyuki Yasuda

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Marcin Nabiałek

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Jerzy J. Wysłocki

Ag/TiO₂ thin films were prepared using the sol-gel spin coating method. The microstructural growth behaviors of the prepared Ag/TiO₂ thin films were elucidated using real-time synchrotron radiation imaging, its structure was determined using grazing incidence X-ray diffraction (GIXRD), its morphology was imaged using the field emission scanning electron microscopy (FESEM), and its surface topography was examined using the atomic force microscope (AFM) in contact mode. The cubical shape was detected and identified as Ag, while the anatase, TiO₂ thin film resembled a porous ring-like structure. It was found that each ring that coalesced and formed channels occurred at a low annealing temperature of 280 °C. The energy dispersive X-ray (EDX) result revealed a small amount of Ag presence in the Ag/TiO₂ thin films. From the in-situ synchrotron radiation imaging, it was observed that as the annealing time increased, the growth of Ag/TiO₂ also increased in terms of area and the number of junctions. The growth rate of Ag/TiO₂ at 600 s was 47.26 µm2/s, and after 1200 s it decreased to 11.50 µm2/s and 11.55 µm2/s at 1800 s. Prolonged annealing will further decrease the growth rate to 5.94 µm2/s, 4.12 µm2/s and 4.86 µm2/s at 2400 s, 3000 s and 3600 s, respectively.

Publication

Pengenalan kepada ujian bahan tanpa musnah

( 2013)

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Khairel Rafezi Ahmad

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Siti Hawa Mohamed Salleh

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Muhammad Hafiz Zan @ Hazizi

Pengenalan Kepada Ujian Bahan Tanpa Musnah merupakan sebuah buku yang membincangkan beberapa perkara asas yang penting dalam ujian tanpa musnah. Ia meliputi kebanyakan kaedah ujian tanpa musnah yang sering digunakan di industri. Buku ini memberi penerangan dalam ujian bahan tanpa musnah yang sering digunakan dalam industri bagi memeriksa kecacatan atau ketidaksempurnaan sesuatu bahan tanpa merosakkan atau memusnahkan bahan yang diperiksa. Keseluruhan kandungan buku ini merangkumi perbincangan dari aspek teori serta konsep pengujian, kaedah pengujian, dan aplikasi ujian dalam industri.

Publication

The effect of thermal annealing on the microstructure and mechanical properties of Sn-0.7Cu-xZn Solder Joint

( 2021)

Mohd Izrul Izwan Ramli

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Rita Mohd Said

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Marcin Nabiałek

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Norainiza Saud

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The microstructural properties of a Pb-free solder joint significantly affect its mechanical behaviours. This paper details a systematic study of the effect of the annealing process on the microstructure and shear strength of a Zn-added Sn-0.7Cu solder joint. The results indicated that the IMC layer’s thickness at the solder/Cu interface increases with annealing time. The interfacial IMC layer of the Sn-0.7Cu solder joint gradually thickened with increasing annealing time and annealing temperature, while the interfacial IMC layer’s morphology changed from scallop-type to layer-type after the annealing process. However, the addition of 1.0 wt.% and 1.5 wt.% Zn in the Sn-0.7Cu effectively altered the interfacial IMC phase to Cu-Zn and suppressed the growth of Cu3Sn during the annealing process. The single-lap shear tests results confirmed that the addition of Zn decreased the shear strength of Sn-0.7Cu. The interfacial IMC of the Cu6Sn5 phase in Sn-0.7Cu changed to Cu-Zn due to the addition of Zn. The shear fractures in the annealed solder joint were ductile within the bulk solder instead of the interfacial IMC layer. Increased annealing time resulted in the increased presence of the Cu-Zn phase, which decreased the hardness and shear strength of the Sn-0.7Cu solder joint.

Publication

The effect of thermal annealing on the microstructure and mechanical properties of Sn-0.7Cu-xZn solder joint

( 2021)

Mohd Izrul Izwan Ramli

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Rita Mohd Said

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