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  5. The study of interfacial reaction between SnAgCu (SAC) lead-free solder alloys and copper substrate: a short review
 
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The study of interfacial reaction between SnAgCu (SAC) lead-free solder alloys and copper substrate: a short review

Journal
IOP Conference Series: Materials Science and Engineering
ISSN
1757-8981
1757-899X
Date Issued
2020
Author(s)
Chi Ying Tan
Universiti Malaysia Perlis
Mohd Arif Anuar Mohd Salleh
Universiti Malaysia Perlis
Norainiza Saud
Universiti Malaysia Perlis
DOI
10.1088/1757-899X/864/1/012182
Handle (URI)
https://iopscience.iop.org/article/10.1088/1757-899X/864/1/012182/pdf
https://iopscience.iop.org/article/10.1088/1757-899X/864/1/012182
https://hdl.handle.net/20.500.14170/14316
Abstract
This paper is aimed to review and study the interfacial reaction between SnAgCu (SAC) lead-free solder alloys and common copper substrates. Among the lead-free solders, a ternary solder alloys, SnAgCu (SAC) based solder, is leading the lead-free solders as it has excellent thermal and electrical properties. The interfacial between solder alloy and substrate comprise an important characteristic in the reliability performance of a solder alloy. As the current industry has driven to miniaturization, high integration and multifunctionality, the reliability and durability of solder joints are gained attention for its long-term performance of electronic products. Therefore, in this short review, the interfacial reaction between SAC solder alloys and copper substrate will be focused. Besides, the effects of the addition of microalloying elements into SAC solder alloys will be discussed.
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The study of interfacial reaction between SnAgCu.pdf (1.84 MB)
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