Publication:
The effect of thermal annealing on the microstructure and mechanical properties of Sn-0.7Cu-xZn solder joint
The effect of thermal annealing on the microstructure and mechanical properties of Sn-0.7Cu-xZn solder joint
| cris.virtual.department | Universiti Malaysia Perlis | |
| cris.virtual.department | Universiti Malaysia Perlis | |
| cris.virtual.department | Universiti Malaysia Perlis | |
| cris.virtual.department | Faculty of Chemical Engineering & Technology | |
| cris.virtual.department | Universiti Malaysia Perlis | |
| cris.virtualsource.department | b818f9b7-a3ab-438f-bd2c-40cf513d8798 | |
| cris.virtualsource.department | 6034b1e2-0d49-408a-9a79-e3993e98ac17 | |
| cris.virtualsource.department | 1fb76e68-0c75-4529-ac9f-cf51941493f8 | |
| cris.virtualsource.department | bc69570b-09ff-4c40-988f-caedcf80415f | |
| cris.virtualsource.department | 83097a39-5b65-4b53-a363-08e3c06b25df | |
| dc.contributor.author | Mohd Izrul Izwan Ramli | |
| dc.contributor.author | Mohd Arif Anuar Mohd Salleh | |
| dc.contributor.author | Rita Mohd Said | |
| dc.contributor.author | Mohd. Mustafa Al Bakri Abdullah | |
| dc.contributor.author | Dewi Suriyani Che Halin | |
| dc.contributor.author | Norainiza Saud | |
| dc.contributor.author | Marcin Nabiałek | |
| dc.date.accessioned | 2024-06-19T02:53:52Z | |
| dc.date.available | 2024-06-19T02:53:52Z | |
| dc.date.issued | 2021 | |
| dc.description.abstract | The microstructural properties of a Pb-free solder joint significantly affect its mechanical behaviours. This paper details a systematic study of the effect of the annealing process on the microstructure and shear strength of a Zn-added Sn-0.7Cu solder joint. The results indicated that the IMC layer’s thickness at the solder/Cu interface increases with annealing time. The interfacial IMC layer of the Sn-0.7Cu solder joint gradually thickened with increasing annealing time and annealing temperature, while the interfacial IMC layer’s morphology changed from scallop-type to layer-type after the annealing process. However, the addition of 1.0 wt.% and 1.5 wt.% Zn in the Sn-0.7Cu effectively altered the interfacial IMC phase to Cu-Zn and suppressed the growth of Cu3Sn during the annealing process. The single-lap shear tests results confirmed that the addition of Zn decreased the shear strength of Sn-0.7Cu. The interfacial IMC of the Cu6Sn5 phase in Sn-0.7Cu changed to Cu-Zn due to the addition of Zn. The shear fractures in the annealed solder joint were ductile within the bulk solder instead of the interfacial IMC layer. Increased annealing time resulted in the increased presence of the Cu-Zn phase, which decreased the hardness and shear strength of the Sn-0.7Cu solder joint. | |
| dc.identifier.doi | 10.3390/met11030380 | |
| dc.identifier.uri | https://www.mdpi.com/2075-4701/11/3/380/pdf | |
| dc.identifier.uri | https://www.mdpi.com/journal/metals | |
| dc.identifier.uri | https://hdl.handle.net/20.500.14170/3011 | |
| dc.language.iso | en | |
| dc.relation.ispartof | Metals | |
| dc.relation.issn | 2075-4701 | |
| dc.subject | Zinc | |
| dc.subject | Intermetallic compound | |
| dc.subject | IMC thickness | |
| dc.subject | Annealing process | |
| dc.title | The effect of thermal annealing on the microstructure and mechanical properties of Sn-0.7Cu-xZn solder joint | |
| dc.type | journal-article | |
| dspace.entity.type | Publication | |
| oaire.citation.endPage | 17 | |
| oaire.citation.issue | 3 | |
| oaire.citation.startPage | 1 | |
| oaire.citation.volume | 11 | |
| oairecerif.author.affiliation | Universiti Malaysia Perlis | |
| oairecerif.author.affiliation | Universiti Malaysia Perlis | |
| oairecerif.author.affiliation | Universiti Malaysia Perlis | |
| oairecerif.author.affiliation | Universiti Malaysia Perlis | |
| oairecerif.author.affiliation | Faculty of Chemical Engineering & Technology | |
| oairecerif.author.affiliation | Universiti Malaysia Perlis | |
| oairecerif.author.affiliation | Czestochowa University of Technology |
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