Thermosonic vs thermocompression flip chip bonding for low cost system in package
Journal
AIP Conference Proceedings
ISSN
0094-243X
Date Issued
2018
Author(s)
M. R. Lim
Hanizah Aris
V. Retnasamy
Edward W.C.L.
K. Muniandy
N. Khan
C. S. Foong
DOI
10.1063/1.5080906
Handle (URI)
File(s)