Conference Publications

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https://hdl.handle.net/20.500.14170/208

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Thermosonic vs thermocompression flip chip bonding for low cost system in package

( 2018)
M. R. Lim
;
Zaliman Sauli
;
Hanizah Aris
;
V. Retnasamy
;
Edward W.C.L.
;
K. Muniandy
;
N. Khan
;
C. S. Foong
First level interconnection based on optimization of Cu stud bump for chip to chip package

( 2018)
Mary Rose Lim
;
Zaliman Sauli
;
Hanizah Aris
;
Vithyacharan Retnasamy
;
Edward W.C.L.
;
Kesvakumar Muniandy
;
Najeeba Khan
;
C. S. Foong
Development of copper busbar by silver plating under non-linear load operation using finite element method (FEM)

( 2023)
M. H. A. Aziz
;
M. M. Azizan
;
Zaliman Sauli
;
M. W. Yahya
A review on harmonic mitigation method for non-linear load in electrical power system

( 2021)
Muhamad Hafiz Ab Aziz
;
Muhammad Mokhzaini Azizan
;
Zaliman Sauli
;
Mohd Wafiuddin Yahya
Breast surface variation phase map analysis with digital fringe projection

( 2019)
Wan Mokhzani Wan Norhaimi
;
Zaliman Sauli
;
Hasnizah Aris
;
Mukhzeer Mohamad Shahimin
;
MAM Azmi
;
K Wong
;
Vithyacharan Retnasamy
;
Rajendaran Vairavan
;
Christopher R. Valenta
;
Masafumi Kimata