Light Emitting Diode (LED) packaging is important for the protection and enhancement of light extraction efficiency in LED. The most commonly used encapsulant is epoxy resin, which is the annealing cured. Multilayer time delayed aging of the epoxy resin causes delamination during packaging process. Ultraviolet (UV) modification is introduced in the curing process of epoxy resin to enhance the curing process of the epoxy. In this paper, the samples tested are either modified with UV or vice versa. Differential Scanning Calorimeter (DSC) is used for the analysis of the sample. Six samples are tested. Data analysis is based on the heat of reactions between the mixed materials; either the process is exothermic or endothermic when the temperature changes. The reaction between the materials determines its ability to crosslink, viscosity and temperature control for the whole reaction.
