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  1. Home
  2. Research Output and Publications
  3. Institute of Nano Electronic Engineering (INEE)
  4. Journal Articles
  5. Modular architecture of a non-contact pinch actuation micropump
 
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Modular architecture of a non-contact pinch actuation micropump

Journal
Sensors
ISSN
1424-8220
Date Issued
2012
Author(s)
Pei Song Chee
Universiti Teknologi Malaysia
Rashidah Arsat
Universiti Teknologi Malaysia
Tijjani Adam
Universiti Malaysia Perlis
Uda Hashim
Universiti Malaysia Perlis
Ruzairi Abdul Rahim
Universiti Teknologi Malaysia
Pei Ling Leow
Universiti Teknologi Malaysia
DOI
10.3390/s120912572
Abstract
This paper demonstrates a modular architecture of a non-contact actuation micropump setup. Rapid hot embossing prototyping was employed in micropump fabrication by using printed circuit board (PCB) as a mold material in polymer casting. Actuator-membrane gap separation was studied, with experimental investigation of three separation distances: 2.0 mm, 2.5 mm and 3.5 mm. To enhance the micropump performance, interaction surface area between plunger and membrane was modeled via finite element analysis (FEA). The micropump was evaluated against two frequency ranges, which comprised a low driving frequency range (0–5 Hz, with 0.5 Hz step increments) and a nominal frequency range (0–80 Hz, with 10 Hz per step increments). The low range frequency features a linear relationship of flow rate with the operating frequency function, while two magnitude peaks were captured in the flow rate and back pressure characteristic in the nominal frequency range. Repeatability and reliability tests conducted suggest the pump performed at a maximum flow rate of 5.78 mL/min at 65 Hz and a backpressure of 1.35 kPa at 60 Hz.
Subjects
  • Electromagnetic micro...

  • Diffuser

  • Lab on chip

  • Hot embossing

File(s)
Modular Architecture of a Non-Contact Pinch Actuation Micropump.pdf (1.22 MB)
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