Zaliman Sauli
Thumbnail Image
Preferred name
Zaliman Sauli
Official Name
Zaliman, Sauli
Alternative Name
Sauli, Zaliman B.
Sauli, Zaliman
Sauli, Z.
Main Affiliation
Scopus Author ID
24554644300
Researcher ID
FWC-2779-2022

Research Output

Filters

1
1
1
Reset filters

Settings
Now showing 1 - 1 of 1
  • Publication
    High power LED heat dissipation analysis via copper diamond slug
    ( 2013)
    Rajendaran Vairavan
    ;
    Zaliman Sauli
    ;
    Vithyacharan Retnasamy
    ;
    Kamarudin Hussin
    The emergence of high power light emitting diode as a novel electronic based light source is due to its vast advantage in terms of optical efficacy, low power consumption and enhanced life time. However, the performances of the LEDs are dependent on the junction temperature as it is inherited high heat production. Hence, proper evaluation of the junction temperature is very significant. In this paper, the heat dissipation of single chip high power LED attached to copper diamond based cylindrical heat slug was scrutinized through simulation. The heat dissipation was characterized in terms of junction temperature. In addition, the stress of the LED chip is evaluated with varied input power. Ansys version 11 was used for the simulation. The simulated results reveal that at input power of 1 W, the max junction temperature of the LED is 114.69°C.
      1  13