Nasrul Amri Mohd Amin
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Preferred name
Nasrul Amri Mohd Amin
Official Name
Nasrul Amri Mohd, Amin
Alternative Name
Mohd Amin, Nasrul Amri
Amin, N. A.M.
Amin, N.
Amin, Nasrul Amri Mohd
Mohd. Amin, Nasrul Amri
Mohd Amin, N. A.
Mohd, N. A.
Main Affiliation
Scopus Author ID
57208572998
Researcher ID
ABD-8383-2020

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  • Publication
    Finite element modelling of thin intermetallic compound layer fractures
    ( 2017)
    Ooi Eang Pang
    ;
    Ruslizam Daud
    ;
    Nasrul Amri Mohd Amin
    ;
    Mohd Afendi Rojan
    ;
    Mohd Shukry Abdul Majid
    A thin intermetallic compound (IMC) of solder ball joint induces strong stress concentration between the pad and solder where a crack propagated near the IMC layer. The fracture mechanism of the IMC layer is complex due to the effect of IMC thickness, crack length, solder thickness and Young’s Modulus. At present, there is still an undefined exact geometrical model correlation for numerical simulations of IMC layer fracture. Thus, this paper aims to determine the accuracy of IMC layer models subjected to crack-to-width length ratio (a/W) in correlation with the ASTM E399-83 Srawley compact specimen model using finite element (FE) analysis. Several FE models with different geometrical configurations have been proposed under 10 MPa tensile loading. In this study, the two dimensional linear elastic displacement extrapolation method (DEM) is formulated to calculate the stress intensity factor (SIF) at the crack tip. The study showed that with an error of 0.58% to 0.59%, a width of 2.1 mm and a height of 1.47 mm can be recommended as the best geometrical model for IMC layer fracture modelling which provides a wider range for a/W from 0.45 to 0.85 instead of from 0.45 to 0.55. This result is significant as it presents a method for determining fracture parameters at thin IMC layers with a combination of singular elements with meshes at different densities which is tailored to the Srawley model.
  • Publication
    Finite element modelling of thin intermetallic compound layer fractures
    ( 2017)
    Ooi Eang Pang
    ;
    Ruslizam Daud
    ;
    Nasrul Amri Mohd Amin
    ;
    Mohd Afendi Rojan
    ;
    Mohd Shukry Abd Majid
    A thin intermetallic compound (IMC) of solder ball joint induces strong stress concentration between the pad and solder where a crack propagated near the IMC layer. The fracture mechanism of the IMC layer is complex due to the effect of IMC thickness, crack length, solder thickness and Young’s Modulus. At present, there is still an undefined exact geometrical model correlation for numerical simulations of IMC layer fracture. Thus, this paper aims to determine the accuracy of IMC layer models subjected to crack-to-width length ratio (a/W) in correlation with the ASTM E399-83 Srawley compact specimen model using finite element (FE) analysis. Several FE models with different geometrical configurations have been proposed under 10 MPa tensile loading. In this study, the two dimensional linear elastic displacement extrapolation method (DEM) is formulated to calculate the stress intensity factor (SIF) at the crack tip. The study showed that with an error of 0.58% to 0.59%, a width of 2.1 mm and a height of 1.47 mm can be recommended as the best geometrical model for IMC layer fracture modelling which provides a wider range for a/W from 0.45 to 0.85 instead of from 0.45 to 0.55. This result is significant as it presents a method for determining fracture parameters at thin IMC layers with a combination of singular elements with meshes at different densities which is tailored to the Srawley model.
  • Publication
    Fracture behavior of intermetallic compound (IMC) of solder joints based on finite elements’ simulation result
    ( 2017-01-01)
    Eang Pang Ooi
    ;
    Ruslizam Daud
    ;
    Nasrul Amri Mohd Amin
    ;
    Fauziah Che Mat
    ;
    Sulaiman M.H.
    ;
    Mohd Shukry Abdul Majid
    ;
    Mohd Afendi Rojan
    ;
    Ahmad Kamal Ariffin
    The development of microelectronic industry has made solder joints failure a major reliability issue. From literature, many researchers have identified that intermetallic compounds (IMC) layer contribute greatly to the fracture of solder joint. This paper presents a finite element modeling of solder butt joints IMC layer failure based on displacement extrapolation method (DEM). Conceptual study on single edge crack of IMC solder joints is presented. A FE analytical model is proposed to be used in difference range of crack length to understand the fracture behavior of solder joint of IMC layer. The simulation results show that soldering material become less tough if greater crack length is present in the joint. It also seen that the thicker IMC has slightly reduced the stress intensity factor on the crack tip but the change from solder to IMC layer decrease the solder joint fracture toughness.
  • Publication
    Investigation of vortex-induced vibration with different width of two bluff bodies in tandem arrangement for energy harvesting system
    ( 2021-05-24)
    Aziz N.A.
    ;
    Mohd Nor Fakhzan Mohd Kazim
    ;
    Nasrul Amri Mohd Amin
    ;
    Mohd Shukry Abdul Majid
    ;
    Mohd Afendi Rojan
    ;
    Nasir N.F.M.
    Due to imperative of enhancement on Vortex-induced vibration (VIV) energy harvesting as renewable energy sources, dual bluff bodies which are triangle and cylinder in tandem arrangement with different width from each other are studied in terms of total deformation, directional deformation and voltage generated in order to determine the better bluff bodies for the piezoelectric film. This is due to the unsymmetrical wakes pattern, low frequency vortices, and low energy output produced by the system. The length and height of the bluff bodies were fixed to 0.1m and airflow used for simulations was 1.46m/s. The spacing ratio was calculated from 1 to 6 to examine various width between two bluff bodies that will affect the formation of the vortex at the downstream area. From the results, it can be concluded that triangle bluff bodies in tandem arrangement 0.6m from each other have resulted in the highest total deformation and effective voltage generated of 0.47mm, and 3.05mV, respectively. These data indicated the highest ability of energy harnessing. Furthermore, this model results in a consistent flagging direction of the piezoelectric that implying a good energy harvesting system.
  • Publication
    Finite element modelling of thin intermetallic compound layer fractures
    ( 2017-03-01)
    Ooi Eang Pang
    ;
    Ruslizam Daud
    ;
    Nasrul Amri Mohd Amin
    ;
    Mohd Afendi Rojan
    ;
    Mohd Shukry Abdul Majid
    A thin intermetallic compound (IMC) of solder ball joint induces strong stress concentration between the pad and solder where a crack propagated near the IMC layer. The fracture mechanism of the IMC layer is complex due to the effect of IMC thickness, crack length, solder thickness and Young's Modulus. At present, there is still an undefined exact geometrical model correlation for numerical simulations of IMC layer fracture. Thus, this paper aims to determine the accuracy of IMC layer models subjected to crack-To-width length ratio (a/W) in correlation with the ASTM E399-83 Srawley compact specimen model using finite element (FE) analysis. Several FE models with different geometrical configurations have been proposed under 10 MPa tensile loading. In this study, the two dimensional linear elastic displacement extrapolation method (DEM) is formulated to calculate the stress intensity factor (SIF) at the crack tip. The study showed that with an error of 0.58% to 0.59%, a width of 2.1 mm and a height of 1.47 mm can be recommended as the best geometrical model for IMC layer fracture modelling which provides a wider range for a/W from 0.45 to 0.85 instead of from 0.45 to 0.55. This result is significant as it presents a method for determining fracture parameters at thin IMC layers with a combination of singular elements with meshes at different densities which is tailored to the Srawley model.
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