Mohd. Mustafa Al Bakri Abdullah
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Preferred name
Mohd. Mustafa Al Bakri Abdullah
Official Name
Abdulah, Mohd. Mustafa Al Bakri
Alternative Name
Abdullah, M.M.A.
M.M.A. Abdullah
Mustafa Al Bakri, A. M.
Albakri Abdullah, M. M.
Main Affiliation
CeGeoGTech UniMAP
Scopus Author ID
53164519100

Research Output
Now showing 1 - 8 of 8
  • Publication
    Hydration and microstructural development of cement pastes incorporating diatomaceous earth, expanded perlite, and Shape-Stabilized Phase Change Materials (SSPCMs)
    (Elsevier Ltd, 2025)
    Shafiq Ishak
    ;
    Marcus Yio
    ;
    Juhyuk Moon
    ;
    Soumen Mandal
    ;
    Sasui Sasui
    ;
    Nor Hasanah Abdul Shukor Lim
    ;
    Xiao-Yong Wang
    ;
    Sheng Wang, Phd Wang
    ;
    Mohd. Mustafa Al Bakri Abdullah
    ;
    Poi Ngian Shek
    The integration of phase change materials (PCMs) into building structures offers a promising solution to enhance energy efficiency and improve thermal comfort. In this study, shape-stabilized PCMs (SSPCMs) consisting of capric acid (CA) as the PCMs were incorporated into cementitious binders using porous minerals of diatomaceous earth (DE) and expanded perlite (EP). Various analyses including isothermal calorimetry, XRD, TGA, SEM, and compressive strength tests were conducted to investigate the effects of DE, EP, and DE/EP PCMs on the hydration kinetics and microstructure of the cementitious system. Isothermal calorimetry results showed that the presence of PCMs has reduced the available space for the nucleation and growth of C-S-H gel. Furthermore, the presence of PCMs triggered the formation of a new phase of sodium acetate, which does not have notieacable impact on concrete properties. Rietveld refinement analysis of XRD data indicated that the presence of PCMs delayed the hydration of main clinker phases over an extended period. It was observed that the hydrophobic nature of CA, which repels water during the mixing process, resulted in an excess of water available for cement hydration. Despite these findings, this study demonstrated that with appropriate choice of supporting material and optimal SSPCMs content, the pozzolanic nature of SSPCMs can mitigate the reduction in strength observed in concrete samples containing PCMs. Overall, this research highlights the potential of integrating SSPCMs into cementitious binders for efficient energy storage, providing insights into optimizing their content and addressing associated challenges in concrete performance.
  • Publication
    Microstructure evolution of Ag/TiOâ‚‚ thin film
    ( 2021)
    Dewi Suriyani Che Halin
    ;
    Kamrosni Abdul Razak
    ;
    Mohd Arif Anuar Mohd Salleh
    ;
    Mohd Izrul Izwan Ramli
    ;
    Mohd. Mustafa Al Bakri Abdullah
    ;
    Ayu Wazira Azhari
    ;
    Kazuhiro Nogita
    ;
    Hideyuki Yasuda
    ;
    Marcin Nabiałek
    ;
    Jerzy J. Wysłocki
    Ag/TiO₂ thin films were prepared using the sol-gel spin coating method. The microstructural growth behaviors of the prepared Ag/TiO₂ thin films were elucidated using real-time synchrotron radiation imaging, its structure was determined using grazing incidence X-ray diffraction (GIXRD), its morphology was imaged using the field emission scanning electron microscopy (FESEM), and its surface topography was examined using the atomic force microscope (AFM) in contact mode. The cubical shape was detected and identified as Ag, while the anatase, TiO₂ thin film resembled a porous ring-like structure. It was found that each ring that coalesced and formed channels occurred at a low annealing temperature of 280 °C. The energy dispersive X-ray (EDX) result revealed a small amount of Ag presence in the Ag/TiO₂ thin films. From the in-situ synchrotron radiation imaging, it was observed that as the annealing time increased, the growth of Ag/TiO₂ also increased in terms of area and the number of junctions. The growth rate of Ag/TiO₂ at 600 s was 47.26 µm2/s, and after 1200 s it decreased to 11.50 µm2/s and 11.55 µm2/s at 1800 s. Prolonged annealing will further decrease the growth rate to 5.94 µm2/s, 4.12 µm2/s and 4.86 µm2/s at 2400 s, 3000 s and 3600 s, respectively.
      3  17
  • Publication
    A short review on the influence of antimony addition to the microstructure and thermal properties of Lead-Free solder alloy
    ( 2023)
    Nur Syahirah Mohamad Zaimi
    ;
    Mohd Arif Anuar Mohd Salleh
    ;
    Mohd. Mustafa Al Bakri Abdullah
    ;
    Mohd Izrul Izwan Ramli
    for long time, Sn-Pb solder alloys have been used extensively as the main interconnection materials in the soldering. it is no doubt that Sn-Pb offers many advantages including good electrical conductivity, mechanical properties as well as low melting temperature. however, Pb is very toxic and Pb usage poses risk to human health and environments. owing to this, the usage of Pb in the electronic industry was banned and restricted by the legislation. these factors accelerate the efforts in finding suitable replacement for solder alloy and thus lead-free solder was introduced. the major problems associated with lead-free solder is the formation of large and brittle intermetallic compound which have given a rise to the reliability issues. Micro alloying with Sb seems to be advantageous in improving the properties of existing lead-free solder alloy. thus, this paper reviews the influence of Sb addition to the lead-free solder alloy in terms of microstructure formations and thermal properties.
      6  24
  • Publication
    Characterisation at the bonding zone between fly ash based Geopolymer Repair Materials (GRM) and Ordinary Portland Cement Concrete (OPCC)
    ( 2020)
    Warid Wazien Ahmad Zailani
    ;
    Mohd. Mustafa Al Bakri Abdullah
    ;
    Mohd Fadzil Arshad
    ;
    Rafiza Abd Razak
    ;
    Muhammad Faheem Mohd. Tahir
    ;
    Remy Rozainy Mohd Arif Zainol
    ;
    Marcin Nabialek
    ;
    Andrei Victor Sandu
    ;
    Jerzy J. Wysłocki
    ;
    Katarzyna BÅ‚och
    In recent years, research and development of geopolymers has gained significant interest in the fields of repairs and restoration. This paper investigates the application of a geopolymer as a repair material by implementation of high-calcium fly ash (FA) as a main precursor, activated by a sodium hydroxide and sodium silicate solution. Three methods of concrete substrate surface preparation were cast and patched: as-cast against ordinary Portland cement concrete (OPCC), with drilled holes, wire-brushed, and left as-cast against the OPCC grade 30. This study indicated that FA-based geopolymer repair materials (GRMs) possessed very high bonding strength at early stages and that the behavior was not affected significantly by high surface treatment roughness. In addition, the investigations using scanning electron microscopy (SEM) and energy-dispersive X-ray (EDX) spectroscopy have revealed that the geopolymer repair material became chemically bonded to the OPC concrete substrate, due to the formation of a C–A–S–H gel. Fundamentally, the geopolymer network is composed of tetrahedral anions (SiO4)4− and (AlO4)5− sharing the oxygen, which requires positive ions such as Na+, K+, Li+, Ca2+, Na+, Ba2+, NH4+, and H3O+. The availability of calcium hydroxide (Ca(OH)2) at the surface of the OPCC substrate, which was rich in calcium ions (Ca2+), reacted with the geopolymer; this compensated the electron vacancies of the framework cavities at the bonding zone between the GRM and the OPCC substrate.
      1  18
  • Publication
    Performance of Sn-3.0Ag-0.5Cu composite solder with kaolin geopolymer ceramic reinforcement on microstructure and mechanical properties under isothermal ageing
    ( 2021)
    Nur Syahirah Mohamad Zaimi
    ;
    Mohd Arif Anuar Mohd Salleh
    ;
    Andrei Victor Sandu
    ;
    Mohd Mustafa Al Bakri Abdullah
    ;
    Norainiza Saud
    ;
    Shayfull Zamree Abd Rahim
    ;
    Petrica Vizureanu
    ;
    Rita Mohd Said
    ;
    Mohd Izrul Izwan Ramli
    This paper elucidates the effect of isothermal ageing at temperature of 85 °C, 125 °C and 150 °C for 100, 500 and 1000 h on Sn-3.0Ag-0.5Cu (SAC305) lead-free solder with the addition of 1 wt% kaolin geopolymer ceramic (KGC) reinforcement particles. SAC305-KGC composite solders were fabricated through powder metallurgy using a hybrid microwave sintering method and reflowed on copper substrate printed circuit board with an organic solderability preservative surface finish. The results revealed that, the addition of KGC was beneficial in improving the total thickness of interfacial intermetallic compound (IMC) layer. At higher isothermal ageing of 150 °C and 1000 h, the IMC layer in SAC305-KGC composite solder was towards a planar-type morphology. Moreover, the growth of total interfacial IMC layer and Cu3Sn layer during isothermal ageing was found to be controlled by bulk diffusion and grain-boundary process, respectively. The activation energy possessed by SAC305-KGC composite solder for total interfacial IMC layer and Cu3Sn IMC was 74 kJ/mol and 104 kJ/mol, respectively. Based on a lap shear test, the shear strength of SAC305-KGC composite solder exhibited higher shear strength than non-reinforced SAC305 solder. Meanwhile, the solder joints failure mode after shear testing was a combination of brittle and ductile modes at higher ageing temperature and time for SAC305-KGC composite solder.
      2  10
  • Publication
    Performance of Sn-3.0Ag-0.5Cu composite solder with Kaolin geopolymer ceramic reinforcement on microstructure and mechanical properties under isothermal ageing
    ( 2021)
    Nur Syahirah Mohamad Zaimi
    ;
    Mohd Arif Anuar Mohd Salleh
    ;
    Andrei Victor Sandu
    ;
    Mohd. Mustafa Al Bakri Abdullah
    ;
    Norainiza Saud
    ;
    Shayfull Zamree Abd. Rahim
    ;
    Petrica Vizureanu
    ;
    Rita Mohd Said
    ;
    Mohd Izrul Izwan Ramli
    This paper elucidates the effect of isothermal ageing at temperature of 85 °C, 125 °C and 150 °C for 100, 500 and 1000 h on Sn-3.0Ag-0.5Cu (SAC305) lead-free solder with the addition of 1 wt% kaolin geopolymer ceramic (KGC) reinforcement particles. SAC305-KGC composite solders were fabricated through powder metallurgy using a hybrid microwave sintering method and reflowed on copper substrate printed circuit board with an organic solderability preservative surface finish. The results revealed that, the addition of KGC was beneficial in improving the total thickness of interfacial intermetallic compound (IMC) layer. At higher isothermal ageing of 150 °C and 1000 h, the IMC layer in SAC305-KGC composite solder was towards a planar-type morphology. Moreover, the growth of total interfacial IMC layer and Cu3Sn layer during isothermal ageing was found to be controlled by bulk diffusion and grain-boundary process, respectively. The activation energy possessed by SAC305-KGC composite solder for total interfacial IMC layer and Cu3Sn IMC was 74 kJ/mol and 104 kJ/mol, respectively. Based on a lap shear test, the shear strength of SAC305-KGC composite solder exhibited higher shear strength than non-reinforced SAC305 solder. Meanwhile, the solder joints failure mode after shear testing was a combination of brittle and ductile modes at higher ageing temperature and time for SAC305-KGC composite solder.
      2  15
  • Publication
    Performance of Sn-3.0Ag-0.5Cu somposite solder with kaolin geopolymer ceramic reinforcement on microstructure and mechanical properties under isothermal ageing
    ( 2021)
    Nur Syahirah Mohamad Zaimi
    ;
    Mohd Arif Anuar Mohd Salleh
    ;
    Andrei Victor Sandu
    ;
    Mohd. Mustafa Al Bakri Abdullah
    ;
    Norainiza Saud
    ;
    Shayfull Zamree Abd. Rahim
    ;
    Petrica Vizureanu
    ;
    Mohd Izrul Izwan Ramli
    ;
    Rita Mohd Said
    This paper elucidates the effect of isothermal ageing at temperature of 85 °C, 125 °C and 150 °C for 100, 500 and 1000 h on Sn-3.0Ag-0.5Cu (SAC305) lead-free solder with the addition of 1 wt% kaolin geopolymer ceramic (KGC) reinforcement particles. SAC305-KGC composite solders were fabricated through powder metallurgy using a hybrid microwave sintering method and reflowed on copper substrate printed circuit board with an organic solderability preservative surface finish. The results revealed that, the addition of KGC was beneficial in improving the total thickness of interfacial intermetallic compound (IMC) layer. At higher isothermal ageing of 150 °C and 1000 h, the IMC layer in SAC305-KGC composite solder was towards a planar-type morphology. Moreover, the growth of total interfacial IMC layer and Cu3Sn layer during isothermal ageing was found to be controlled by bulk diffusion and grain-boundary process, respectively. The activation energy possessed by SAC305-KGC composite solder for total interfacial IMC layer and Cu3Sn IMC was 74 kJ/mol and 104 kJ/mol, respectively. Based on a lap shear test, the shear strength of SAC305-KGC composite solder exhibited higher shear strength than non-reinforced SAC305 solder. Meanwhile, the solder joints failure mode after shear testing was a combination of brittle and ductile modes at higher ageing temperature and time for SAC305-KGC composite solder.
      2  31
  • Publication
    Microstructure evolution of Ag/TiO2 thin film
    ( 2021)
    Dewi Suriyani Che Halin
    ;
    Kamrosni Abdul Razak
    ;
    Mohd Arif Anuar Mohd Salleh
    ;
    Mohd Izrul Izwan Ramli
    ;
    Mohd. Mustafa Al Bakri Abdullah
    ;
    Ayu Wazira Azhari
    ;
    Kazuhiro Nogita
    ;
    Hideyuki Yasuda
    ;
    Marcin Nabiałek
    ;
    Jerzy J. Wysłocki
    Ag/TiO2 thin films were prepared using the sol-gel spin coating method. The microstructural growth behaviors of the prepared Ag/TiO2 thin films were elucidated using real-time synchrotron radiation imaging, its structure was determined using grazing incidence X-ray diffraction (GIXRD), its morphology was imaged using the field emission scanning electron microscopy (FESEM), and its surface topography was examined using the atomic force microscope (AFM) in contact mode. The cubical shape was detected and identified as Ag, while the anatase, TiO2 thin film resembled a porous ring-like structure. It was found that each ring that coalesced and formed channels occurred at a low annealing temperature of 280 °C. The energy dispersive X-ray (EDX) result revealed a small amount of Ag presence in the Ag/TiO2 thin films. From the in-situ synchrotron radiation imaging, it was observed that as the annealing time increased, the growth of Ag/TiO2 also increased in terms of area and the number of junctions. The growth rate of Ag/TiO2 at 600 s was 47.26 µm2/s, and after 1200 s it decreased to 11.50 µm2/s and 11.55 µm2/s at 1800 s. Prolonged annealing will further decrease the growth rate to 5.94 µm2/s, 4.12 µm2/s and 4.86 µm2/s at 2400 s, 3000 s and 3600 s, respectively.
      20  1