Mohd. Mustafa Al Bakri Abdullah
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Preferred name
Mohd. Mustafa Al Bakri Abdullah
Official Name
Abdulah, Mohd. Mustafa Al Bakri
Alternative Name
Abdullah, M.M.A.
M.M.A. Abdullah
Mustafa Al Bakri, A. M.
Albakri Abdullah, M. M.
Main Affiliation
Universiti Malaysia Perlis
CeGeoGTech UniMAP
Scopus Author ID
53164519100

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Now showing 1 - 3 of 3
  • Publication
    Nonisothermal kinetic degradation of Hybrid CNT/Alumina Epoxy Nanocomposites
    ( 2021)
    Muhammad Helmi Abdul Kudus
    ;
    Muhammad Razlan Zakaria
    ;
    Mohd Firdaus Omar
    ;
    Muhammad Bisyrul Hafi Othman
    ;
    Hazizan Md. Akil
    ;
    Marcin Nabiałek
    ;
    Bartłomiej Jeż
    ;
    Mohd. Mustafa Al Bakri Abdullah
    Due to the synergistic effect that occurs between CNTs and alumina, CNT/alumina hybrid-filled epoxy nanocomposites show significant enhancements in tensile properties, flexural properties, and thermal conductivity. This study is an extension of previously reported investigations into CNT/alumina epoxy nanocomposites. A series of epoxy composites with different CNT/alumina loadings were investigated with regard to their thermal-degradation kinetics and lifetime prediction. The thermal-degradation parameters were acquired via thermogravimetric analysis (TGA) in a nitrogen atmosphere. The degradation activation energy was determined using the Flynn–Wall–Ozawa (F-W-O) method for the chosen apparent activation energy. The Ea showed significant differences at α > 0.6, which indicate the role played by the CNT/alumina hybrid filler loading in the degradation behavior. From the calculations, the lifetime prediction at 5% mass loss decreased with an increase in the temperature service of nitrogen. The increase in the CNT/alumina hybrid loading revealed its contribution towards thermal degradation and stability. On average, a higher Ea was attributed to greater loadings of the CNT/alumina hybrid in the composites.
      2  16
  • Publication
    Performance of Sn-3.0Ag-0.5Cu composite solder with Kaolin geopolymer ceramic reinforcement on microstructure and mechanical properties under isothermal ageing
    ( 2021)
    Nur Syahirah Mohamad Zaimi
    ;
    Mohd Arif Anuar Mohd Salleh
    ;
    Andrei Victor Sandu
    ;
    Mohd. Mustafa Al Bakri Abdullah
    ;
    Norainiza Saud
    ;
    Shayfull Zamree Abd. Rahim
    ;
    Petrica Vizureanu
    ;
    Rita Mohd Said
    ;
    Mohd Izrul Izwan Ramli
    This paper elucidates the effect of isothermal ageing at temperature of 85 °C, 125 °C and 150 °C for 100, 500 and 1000 h on Sn-3.0Ag-0.5Cu (SAC305) lead-free solder with the addition of 1 wt% kaolin geopolymer ceramic (KGC) reinforcement particles. SAC305-KGC composite solders were fabricated through powder metallurgy using a hybrid microwave sintering method and reflowed on copper substrate printed circuit board with an organic solderability preservative surface finish. The results revealed that, the addition of KGC was beneficial in improving the total thickness of interfacial intermetallic compound (IMC) layer. At higher isothermal ageing of 150 °C and 1000 h, the IMC layer in SAC305-KGC composite solder was towards a planar-type morphology. Moreover, the growth of total interfacial IMC layer and Cu3Sn layer during isothermal ageing was found to be controlled by bulk diffusion and grain-boundary process, respectively. The activation energy possessed by SAC305-KGC composite solder for total interfacial IMC layer and Cu3Sn IMC was 74 kJ/mol and 104 kJ/mol, respectively. Based on a lap shear test, the shear strength of SAC305-KGC composite solder exhibited higher shear strength than non-reinforced SAC305 solder. Meanwhile, the solder joints failure mode after shear testing was a combination of brittle and ductile modes at higher ageing temperature and time for SAC305-KGC composite solder.
      2  15
  • Publication
    Performance of Sn-3.0Ag-0.5Cu somposite solder with kaolin geopolymer ceramic reinforcement on microstructure and mechanical properties under isothermal ageing
    ( 2021)
    Nur Syahirah Mohamad Zaimi
    ;
    Mohd Arif Anuar Mohd Salleh
    ;
    Andrei Victor Sandu
    ;
    Mohd. Mustafa Al Bakri Abdullah
    ;
    Norainiza Saud
    ;
    Shayfull Zamree Abd. Rahim
    ;
    Petrica Vizureanu
    ;
    Mohd Izrul Izwan Ramli
    ;
    Rita Mohd Said
    This paper elucidates the effect of isothermal ageing at temperature of 85 °C, 125 °C and 150 °C for 100, 500 and 1000 h on Sn-3.0Ag-0.5Cu (SAC305) lead-free solder with the addition of 1 wt% kaolin geopolymer ceramic (KGC) reinforcement particles. SAC305-KGC composite solders were fabricated through powder metallurgy using a hybrid microwave sintering method and reflowed on copper substrate printed circuit board with an organic solderability preservative surface finish. The results revealed that, the addition of KGC was beneficial in improving the total thickness of interfacial intermetallic compound (IMC) layer. At higher isothermal ageing of 150 °C and 1000 h, the IMC layer in SAC305-KGC composite solder was towards a planar-type morphology. Moreover, the growth of total interfacial IMC layer and Cu3Sn layer during isothermal ageing was found to be controlled by bulk diffusion and grain-boundary process, respectively. The activation energy possessed by SAC305-KGC composite solder for total interfacial IMC layer and Cu3Sn IMC was 74 kJ/mol and 104 kJ/mol, respectively. Based on a lap shear test, the shear strength of SAC305-KGC composite solder exhibited higher shear strength than non-reinforced SAC305 solder. Meanwhile, the solder joints failure mode after shear testing was a combination of brittle and ductile modes at higher ageing temperature and time for SAC305-KGC composite solder.
      2  31