Muhammad Firdaus Mohd Nazeri
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Preferred name
Muhammad Firdaus Mohd Nazeri
Official Name
Muhammad Firdaus , Mohd Nazeri
Alternative Name
Nazeri, Muhammad Firdaus Mohd
Nazeri, M. F.M.
Nazeri, M. F.Mohd
Nazeri, Muhammad Firdaus
Main Affiliation
Scopus Author ID
55206645000
Researcher ID
C-8522-2019

Research Output

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  • Publication
    The preliminary study of the addition Zinc in tin-copper lead free solder
    (Trans Tech Publications Ltd., 2020)
    Wei Yee Wong
    ;
    Rabiatul Adawiyah Shamsudin
    ;
    Muhammad Firdaus Mohd Nazeri
    ;
    Mohamad Najmi Masri
    Sn-0.7Cu lead free solder has become an alternative material to replace Sn-Pb solder. However, it has the weakness of high melting point and poor corrosion behavior. Through the study, Sn-0.7-xZn microstructure and phase changes were studied through scanning electron microscope (SEM) and X-ray diffraction (XRD). SEM result shows microstructure Cu6Sn5 is precipitated with rod like shape while CuZn is shown in bump oval shape whereas compounds that presented are Cu6Sn5 and Cu5Zn8 as shown in the XRD analysis result.
  • Publication
    Effect additions Zn on Sn-0.7Cu lead-free solder: a short brief
    (IOP Publishing, 2020)
    Fatin Sufina Mohd Tarmizi
    ;
    Mohamad Najmi Masri
    ;
    Muhammad Firdaus Mohd Nazeri
    ;
    Ahmad Azmin Mohamad
    Sn-0.7Cu lead-free solder is an alternative solder material that suitable to replace Sn-Pb solder in electronic manufacturing. However, it has a weakness of high melting temperature and lower mechanical strength. In this study, the change in microstructure, elements, the structural and melting point of Sn-0.7Cu after the addition of different compositions of Zn element was discussed. The result shows that after adding a small amount of Zn, a refinement microstructure of Sn-0.7Cu-xZn solder alloy was obtained, and the melting point of the solder decreased from 227.7 °C to 225.7 °C. Besides, the formation new phase of was investigated by scanning electron microscope (SEM) followed by energy-dispersive x-ray spectroscopy (EDX) and x-ray diffraction (XRD). Besides, the behaviour of Sn-0.7Cu-xZn solder alloy can be further studied via open circuit potential (OCP) to determine the corrosion potential.
      31  2
  • Publication
    The effect of Bismuth addition on Sn-Ag-Cu lead-free solder properties: a short review
    (IOP Publishing, 2020)
    M Muhamad
    ;
    MN Masri
    ;
    Muhammad Firdaus Mohd Nazeri
    ;
    AA Mohamad
    Sn-0.7Ag-0.5Cu lead-free solder is an alternative solder material suitable to replace Sn-Pb solder in electronic manufacturing. In this review, the change in the microstructure, elements, the structural and melting point of Sn-0.7Ag-0.5Cu after the addition of different compositions of bismuth were discovered. Besides, the influence of bismuth in lead-free solder alloys attracts to be studied due to its capability to improve the wettability and solder spread.
      2  21