Mohd Arif Anuar Mohd Salleh
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Preferred name
Mohd Arif Anuar Mohd Salleh
Official Name
Mohd Arif Anuar, Mohd Salleh
Alternative Name
Mohd Salleh, Mohd Arif Anuar
Salleh, Mohd A.A.
Salleh, M. A.A.Mohd
Mohd Salleh, M. A.A.
Salleh, M. A.A.M.
Mohd Salleh, M. M.A.
Main Affiliation
Scopus Author ID
55543476900
Researcher ID
C-3386-2018

Research Output
Now showing 1 - 6 of 6
  • Publication
    Performance of Sn-3.0Ag-0.5Cu composite solder with kaolin geopolymer ceramic reinforcement on microstructure and mechanical properties under isothermal ageing
    ( 2021)
    Nur Syahirah Mohamad Zaimi
    ;
    Mohd Arif Anuar Mohd Salleh
    ;
    Andrei Victor Sandu
    ;
    Mohd Mustafa Al Bakri Abdullah
    ;
    Norainiza Saud
    ;
    Shayfull Zamree Abd Rahim
    ;
    Petrica Vizureanu
    ;
    Rita Mohd Said
    ;
    Mohd Izrul Izwan Ramli
    This paper elucidates the effect of isothermal ageing at temperature of 85 °C, 125 °C and 150 °C for 100, 500 and 1000 h on Sn-3.0Ag-0.5Cu (SAC305) lead-free solder with the addition of 1 wt% kaolin geopolymer ceramic (KGC) reinforcement particles. SAC305-KGC composite solders were fabricated through powder metallurgy using a hybrid microwave sintering method and reflowed on copper substrate printed circuit board with an organic solderability preservative surface finish. The results revealed that, the addition of KGC was beneficial in improving the total thickness of interfacial intermetallic compound (IMC) layer. At higher isothermal ageing of 150 °C and 1000 h, the IMC layer in SAC305-KGC composite solder was towards a planar-type morphology. Moreover, the growth of total interfacial IMC layer and Cu3Sn layer during isothermal ageing was found to be controlled by bulk diffusion and grain-boundary process, respectively. The activation energy possessed by SAC305-KGC composite solder for total interfacial IMC layer and Cu3Sn IMC was 74 kJ/mol and 104 kJ/mol, respectively. Based on a lap shear test, the shear strength of SAC305-KGC composite solder exhibited higher shear strength than non-reinforced SAC305 solder. Meanwhile, the solder joints failure mode after shear testing was a combination of brittle and ductile modes at higher ageing temperature and time for SAC305-KGC composite solder.
  • Publication
    Performance of Sn-3.0Ag-0.5Cu composite solder with Kaolin geopolymer ceramic reinforcement on microstructure and mechanical properties under isothermal ageing
    ( 2021)
    Nur Syahirah Mohamad Zaimi
    ;
    Mohd Arif Anuar Mohd Salleh
    ;
    Andrei Victor Sandu
    ;
    Mohd. Mustafa Al Bakri Abdullah
    ;
    Norainiza Saud
    ;
    Shayfull Zamree Abd. Rahim
    ;
    Petrica Vizureanu
    ;
    Rita Mohd Said
    ;
    Mohd Izrul Izwan Ramli
    This paper elucidates the effect of isothermal ageing at temperature of 85 °C, 125 °C and 150 °C for 100, 500 and 1000 h on Sn-3.0Ag-0.5Cu (SAC305) lead-free solder with the addition of 1 wt% kaolin geopolymer ceramic (KGC) reinforcement particles. SAC305-KGC composite solders were fabricated through powder metallurgy using a hybrid microwave sintering method and reflowed on copper substrate printed circuit board with an organic solderability preservative surface finish. The results revealed that, the addition of KGC was beneficial in improving the total thickness of interfacial intermetallic compound (IMC) layer. At higher isothermal ageing of 150 °C and 1000 h, the IMC layer in SAC305-KGC composite solder was towards a planar-type morphology. Moreover, the growth of total interfacial IMC layer and Cu3Sn layer during isothermal ageing was found to be controlled by bulk diffusion and grain-boundary process, respectively. The activation energy possessed by SAC305-KGC composite solder for total interfacial IMC layer and Cu3Sn IMC was 74 kJ/mol and 104 kJ/mol, respectively. Based on a lap shear test, the shear strength of SAC305-KGC composite solder exhibited higher shear strength than non-reinforced SAC305 solder. Meanwhile, the solder joints failure mode after shear testing was a combination of brittle and ductile modes at higher ageing temperature and time for SAC305-KGC composite solder.
  • Publication
    Performance of Sn-3.0Ag-0.5Cu somposite solder with kaolin geopolymer ceramic reinforcement on microstructure and mechanical properties under isothermal ageing
    ( 2021)
    Nur Syahirah Mohamad Zaimi
    ;
    Mohd Arif Anuar Mohd Salleh
    ;
    Andrei Victor Sandu
    ;
    Mohd. Mustafa Al Bakri Abdullah
    ;
    Norainiza Saud
    ;
    Shayfull Zamree Abd. Rahim
    ;
    Petrica Vizureanu
    ;
    Mohd Izrul Izwan Ramli
    ;
    Rita Mohd Said
    This paper elucidates the effect of isothermal ageing at temperature of 85 °C, 125 °C and 150 °C for 100, 500 and 1000 h on Sn-3.0Ag-0.5Cu (SAC305) lead-free solder with the addition of 1 wt% kaolin geopolymer ceramic (KGC) reinforcement particles. SAC305-KGC composite solders were fabricated through powder metallurgy using a hybrid microwave sintering method and reflowed on copper substrate printed circuit board with an organic solderability preservative surface finish. The results revealed that, the addition of KGC was beneficial in improving the total thickness of interfacial intermetallic compound (IMC) layer. At higher isothermal ageing of 150 °C and 1000 h, the IMC layer in SAC305-KGC composite solder was towards a planar-type morphology. Moreover, the growth of total interfacial IMC layer and Cu3Sn layer during isothermal ageing was found to be controlled by bulk diffusion and grain-boundary process, respectively. The activation energy possessed by SAC305-KGC composite solder for total interfacial IMC layer and Cu3Sn IMC was 74 kJ/mol and 104 kJ/mol, respectively. Based on a lap shear test, the shear strength of SAC305-KGC composite solder exhibited higher shear strength than non-reinforced SAC305 solder. Meanwhile, the solder joints failure mode after shear testing was a combination of brittle and ductile modes at higher ageing temperature and time for SAC305-KGC composite solder.
  • Publication
    Microstructure evolution of Ag/TiO2 thin film
    ( 2021)
    Dewi Suriyani Che Halin
    ;
    Kamrosni Abdul Razak
    ;
    Mohd Arif Anuar Mohd Salleh
    ;
    Mohd Izrul Izwan Ramli
    ;
    Mohd. Mustafa Al Bakri Abdullah
    ;
    Ayu Wazira Azhari
    ;
    Kazuhiro Nogita
    ;
    Hideyuki Yasuda
    ;
    Marcin Nabiałek
    ;
    Jerzy J. Wysłocki
    Ag/TiO2 thin films were prepared using the sol-gel spin coating method. The microstructural growth behaviors of the prepared Ag/TiO2 thin films were elucidated using real-time synchrotron radiation imaging, its structure was determined using grazing incidence X-ray diffraction (GIXRD), its morphology was imaged using the field emission scanning electron microscopy (FESEM), and its surface topography was examined using the atomic force microscope (AFM) in contact mode. The cubical shape was detected and identified as Ag, while the anatase, TiO2 thin film resembled a porous ring-like structure. It was found that each ring that coalesced and formed channels occurred at a low annealing temperature of 280 °C. The energy dispersive X-ray (EDX) result revealed a small amount of Ag presence in the Ag/TiO2 thin films. From the in-situ synchrotron radiation imaging, it was observed that as the annealing time increased, the growth of Ag/TiO2 also increased in terms of area and the number of junctions. The growth rate of Ag/TiO2 at 600 s was 47.26 µm2/s, and after 1200 s it decreased to 11.50 µm2/s and 11.55 µm2/s at 1800 s. Prolonged annealing will further decrease the growth rate to 5.94 µm2/s, 4.12 µm2/s and 4.86 µm2/s at 2400 s, 3000 s and 3600 s, respectively.
  • Publication
    A short review on the influence of antimony addition to the microstructure and thermal properties of Lead-Free solder alloy
    ( 2023)
    Nur Syahirah Mohamad Zaimi
    ;
    Mohd Arif Anuar Mohd Salleh
    ;
    Mohd. Mustafa Al Bakri Abdullah
    ;
    Mohd Izrul Izwan Ramli
    for long time, Sn-Pb solder alloys have been used extensively as the main interconnection materials in the soldering. it is no doubt that Sn-Pb offers many advantages including good electrical conductivity, mechanical properties as well as low melting temperature. however, Pb is very toxic and Pb usage poses risk to human health and environments. owing to this, the usage of Pb in the electronic industry was banned and restricted by the legislation. these factors accelerate the efforts in finding suitable replacement for solder alloy and thus lead-free solder was introduced. the major problems associated with lead-free solder is the formation of large and brittle intermetallic compound which have given a rise to the reliability issues. Micro alloying with Sb seems to be advantageous in improving the properties of existing lead-free solder alloy. thus, this paper reviews the influence of Sb addition to the lead-free solder alloy in terms of microstructure formations and thermal properties.
  • Publication
    Microstructure evolution of Ag/TiOâ‚‚ thin film
    ( 2021)
    Dewi Suriyani Che Halin
    ;
    Kamrosni Abdul Razak
    ;
    Mohd Arif Anuar Mohd Salleh
    ;
    Mohd Izrul Izwan Ramli
    ;
    Mohd. Mustafa Al Bakri Abdullah
    ;
    Ayu Wazira Azhari
    ;
    Kazuhiro Nogita
    ;
    Hideyuki Yasuda
    ;
    Marcin Nabiałek
    ;
    Jerzy J. Wysłocki
    Ag/TiO₂ thin films were prepared using the sol-gel spin coating method. The microstructural growth behaviors of the prepared Ag/TiO₂ thin films were elucidated using real-time synchrotron radiation imaging, its structure was determined using grazing incidence X-ray diffraction (GIXRD), its morphology was imaged using the field emission scanning electron microscopy (FESEM), and its surface topography was examined using the atomic force microscope (AFM) in contact mode. The cubical shape was detected and identified as Ag, while the anatase, TiO₂ thin film resembled a porous ring-like structure. It was found that each ring that coalesced and formed channels occurred at a low annealing temperature of 280 °C. The energy dispersive X-ray (EDX) result revealed a small amount of Ag presence in the Ag/TiO₂ thin films. From the in-situ synchrotron radiation imaging, it was observed that as the annealing time increased, the growth of Ag/TiO₂ also increased in terms of area and the number of junctions. The growth rate of Ag/TiO₂ at 600 s was 47.26 µm2/s, and after 1200 s it decreased to 11.50 µm2/s and 11.55 µm2/s at 1800 s. Prolonged annealing will further decrease the growth rate to 5.94 µm2/s, 4.12 µm2/s and 4.86 µm2/s at 2400 s, 3000 s and 3600 s, respectively.