Juyana A. Wahab
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Preferred name
Juyana A. Wahab
Official Name
A. Wahab, Juyana
Alternative Name
A Wahab, Juyana
Wahab, Juyana A.
Wahab, J. A.
Main Affiliation
Scopus Author ID
36783614000
Researcher ID
AAY-8291-2021

Research Output
Now showing 1 - 3 of 3
  • Publication
    Effect of wetting characteristics of dimpled micro-textured substrate on the spreading area of Sn–0.7Cu solder alloy
    (Springer, 2023)
    Siti Faqihah Roduan
    ;
    Juyana A. Wahab
    ;
    Mohd Arif Anuar Mohd Salleh
    ;
    Nurul Aida Husna Mohd Mahayuddin
    ;
    Aiman Mohd Halil
    ;
    Amira Qistina Syamimi Zaifuddin
    ;
    Mahadzir Muhammad Ishak
    This study aimed to investigate the effect of wetting characteristics of a dimpled micro-textured copper substrate on the spreading area of the Sn–0.7Cu solder alloy. A laser surface texturing (LST) technique was used to fabricate dimpled micro-textured on the copper substrate. Three samples were fabricated by varying the dimple spacing on the copper substrate such as 100, 140, and 180 µm. A 3D measuring laser microscope was used to study the surface roughness. The copper substrates’ water contact angle measurement and surface roughness were studied for their wetting characteristics. In order to study the effect of wetting characteristics of the dimpled micro-textured copper substrate, spreading area measurement was conducted. The result showed that dimpled micro-textured introduces higher surface roughness and contact angle, increasing the hydrophobicity. Consequently, this reduces the spreading area of Sn–0.7Cu solder alloy.
  • Publication
    Effectiveness of dimple microtextured copper substrate on performance of Sn-0.7Cu solder alloy
    ( 2022)
    Siti Faqihah Roduan
    ;
    Juyana A. Wahab
    ;
    Mohd Arif Anuar Mohd Salleh
    ;
    Nurul Aida Husna Mohd Mahayuddin
    ;
    Mohd. Mustafa Al Bakri Abdullah
    ;
    Aiman Bin Mohd Halil
    ;
    Amira Qistina Syamimi Zaifuddin
    ;
    Mahadzir Ishak Muhammad
    ;
    Andrei Victor Sandu
    ;
    Mădălina Simona Baltatu
    ;
    Petrica Vizureanu
    This paper elucidates the influence of dimple-microtextured copper substrate on the performance of Sn-0.7Cu solder alloy. A dimple with a diameter of 50 µm was produced by varying the dimple depth using different laser scanning repetitions, while the dimple spacing was fixed for each sample at 100 µm. The dimple-microtextured copper substrate was joined with Sn-0.7Cu solder alloy using the reflow soldering process. The solder joints’ wettability, microstructure, and growth of its intermetallic compound (IMC) layer were analysed to determine the influence of the dimple-microtextured copper substrate on the performance of the Sn-0.7Cu solder alloy. It was observed that increasing laser scan repetitions increased the dimples’ depth, resulting in higher surface roughness. In terms of soldering performance, it was seen that the solder joints’ average contact angle decreased with increasing dimple depth, while the average IMC thickness increased as the dimple depth increased. The copper element was more evenly distributed for the dimple-micro-textured copper substrate than its non-textured counterpart.
      25  5
  • Publication
    Surface texturing method and roughness effect on the substrate performance: a short review
    (Malaysian Tribology Society, 2020)
    Mahayuddin, Nurul Aida Husna Mohd
    ;
    Juyana A. Wahab
    ;
    Mohd Arif Anuar Mohd Salleh
    ;
    Roduan Siti Faqihah
    ;
    Chen Heng Kheng
    Surface texture is one of interest to researchers as alterations surface roughness along with wettability are key factors towards properties enhancement of a material that would be beneficial for many industrial applications. This paper reviews published works on surfaces that had been roughened to various degrees, as well as techniques that had been utilised during the preparation of surface texture. The role of roughness in determining the static / dynamic wetting of the micro textural surface was discussed, how different shape and size parameters were used to fabricate the textural surface were examine, and how particular progress on some features on surface texture effect the wettability and roughness of the surface. Superhydrophobic surfaces have been considered for various industrial application due to the properties such as low adhesion and friction, as well as their extreme water-repellent properties. As interest in this field grow, there are a greater number of techniques and parameters used were reported for fabricating surface texture that result in surface roughness and wettability.
      3  9