Juyana A. Wahab
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Preferred name
Juyana A. Wahab
Official Name
A. Wahab, Juyana
Alternative Name
A Wahab, Juyana
Wahab, Juyana A.
Wahab, J. A.
Main Affiliation
Scopus Author ID
36783614000
Researcher ID
AAY-8291-2021

Research Output
Now showing 1 - 4 of 4
  • Publication
    Comparative wetting study of Sn-0.7Cu solder on dimple and pillar micro-texture fabricated by the photolithography technique
    ( 2024-12)
    Juyana A. Wahab
    ;
    Mohd Arif Anuar Mohd Salleh
    ;
    Marliza Mostapha @ Zakaria
    ;
    Muhammad Firdaus Mohd Nazeri
    ;
    Nurul Aida Husna Mohd Mahayuddin
    ;
    Siti Faqihah Roduan
    The study focused on exploring the impact of micro-textured surfaces on the wetting behaviour of Sn-0.7Cu solder. Dimple and pillar micro-textures, each with a diameter of 100 μm, were fabricated on the copper substrate using a photolithography technique. The Sn-0.7Cu solder was melted onto the micro-textured copper substrate during the soldering process. The spreading time, spreading area, and spreading rate of the solder on the copper substrate were investigated. The copper substrates with dimple textures exhibited a prolonged spreading time of 51 seconds, a smaller spreading area of 60.54 mm², and a slower spreading rate of 1.44 mm²/s than the pillar-textured copper substrates. However, the presence of micro-textures resulted in a reduced spreading area, indicative of enhanced solderability. This improvement is attributed to the textured substrate promoting higher copper diffusion during the soldering process. The controlled application of micro-textures holds promise for optimising wetting behaviour and solderability in electronic assembly processes, presenting avenues for further exploration and application in the realm of materials science and electronic manufacturing.
  • Publication
    Effect of surface-modified copper substrate by photolithography on the solderability of lead-free solder alloy
    (Springer, 2023-07)
    Nurul Aida Husna Mohd Mahayuddin
    ;
    Juyana A. Wahab
    ;
    Siti Faqihah Roduan
    ;
    Mohd Arif Anuar Mohd Salleh
    Various modifications of copper substrates have been developed for soldering applications due to their promising properties. The present study aimed to investigate the effect of dimple micro-texture on a copper substrate surface on soldering. Photolithography technique was used to fabricate a dimple micro-texture onto copper substrate. After surface texturing, the copper substrate was reflowed with Sn–0.7Cu solder. The surface microstructural was determined using optical microscopy (OM), the 3D surface profiler, and visual tests. The spreading area of the Sn–0.7Cu solder and the copper substrate was also examined. In comparison with Sn-0.7Cu solder on textured surface, TD500 has larger spreading area as the diameter was large nearly equivalent to non-textured surface. However, Sn–0.7Cu textured substrate exhibits low spreading area than non-textured surface that is beneficial for solderability properties.
  • Publication
    Effect of wetting characteristics of dimpled micro-textured substrate on the spreading area of Sn–0.7Cu solder alloy
    (Springer, 2023)
    Siti Faqihah Roduan
    ;
    Juyana A. Wahab
    ;
    Mohd Arif Anuar Mohd Salleh
    ;
    Nurul Aida Husna Mohd Mahayuddin
    ;
    Aiman Mohd Halil
    ;
    Amira Qistina Syamimi Zaifuddin
    ;
    Mahadzir Muhammad Ishak
    This study aimed to investigate the effect of wetting characteristics of a dimpled micro-textured copper substrate on the spreading area of the Sn–0.7Cu solder alloy. A laser surface texturing (LST) technique was used to fabricate dimpled micro-textured on the copper substrate. Three samples were fabricated by varying the dimple spacing on the copper substrate such as 100, 140, and 180 µm. A 3D measuring laser microscope was used to study the surface roughness. The copper substrates’ water contact angle measurement and surface roughness were studied for their wetting characteristics. In order to study the effect of wetting characteristics of the dimpled micro-textured copper substrate, spreading area measurement was conducted. The result showed that dimpled micro-textured introduces higher surface roughness and contact angle, increasing the hydrophobicity. Consequently, this reduces the spreading area of Sn–0.7Cu solder alloy.
  • Publication
    Effectiveness of dimple microtextured copper substrate on performance of Sn-0.7Cu solder alloy
    ( 2022)
    Siti Faqihah Roduan
    ;
    Juyana A. Wahab
    ;
    Mohd Arif Anuar Mohd Salleh
    ;
    Nurul Aida Husna Mohd Mahayuddin
    ;
    Mohd. Mustafa Al Bakri Abdullah
    ;
    Aiman Bin Mohd Halil
    ;
    Amira Qistina Syamimi Zaifuddin
    ;
    Mahadzir Ishak Muhammad
    ;
    Andrei Victor Sandu
    ;
    Mădălina Simona Baltatu
    ;
    Petrica Vizureanu
    This paper elucidates the influence of dimple-microtextured copper substrate on the performance of Sn-0.7Cu solder alloy. A dimple with a diameter of 50 µm was produced by varying the dimple depth using different laser scanning repetitions, while the dimple spacing was fixed for each sample at 100 µm. The dimple-microtextured copper substrate was joined with Sn-0.7Cu solder alloy using the reflow soldering process. The solder joints’ wettability, microstructure, and growth of its intermetallic compound (IMC) layer were analysed to determine the influence of the dimple-microtextured copper substrate on the performance of the Sn-0.7Cu solder alloy. It was observed that increasing laser scan repetitions increased the dimples’ depth, resulting in higher surface roughness. In terms of soldering performance, it was seen that the solder joints’ average contact angle decreased with increasing dimple depth, while the average IMC thickness increased as the dimple depth increased. The copper element was more evenly distributed for the dimple-micro-textured copper substrate than its non-textured counterpart.
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