Flora Somidin
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Preferred name
Flora Somidin
Official Name
Flora, Somidin
Alternative Name
Somidin, F.
Somidin, Flora
Main Affiliation
Scopus Author ID
54973802500
Researcher ID
GPF-4634-2022

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  • Publication
    Mixed Assembly of Lead-free Solder Joint: A Short Review
    (IOP Publishing Ltd, 2022-01-24)
    Rita Mohd Said
    ;
    Mohd Arif Anuar Mohd Salleh
    ;
    Ramli M.I.I.
    ;
    Saud N.
    ;
    Flora Somidin
    ;
    Razak N.R.A.
    ;
    Ismail A.N.
    The transition from lead (Pb) to Pb-free solder has arisen the need for the development of the reliability of mixed assemblies solder joint research. Mixed assemblies are defined as solder joints that joint together with different compositions or solder forms for example Ball Grid Array (BGA) and solder paste. During the transition period of solder materials, mixed assemblies are still used in electronic packaging. In addition, Pb-free manufacturing has been forced to release some of the product categories since legislation banning the use of lead solder in electronic assemblies. This phenomenon causes health and environmental concern of the Pb solder used in electronic assembly. Hence, some electronic assemblies will continue to use traditional eutectic Sn-Pb solder paste while others will use Pb-free solder paste. This situation indicates that the use of mixed assemblies in electronics manufacturing is still inevitable. This paper presents a projection of the reliability of mixed assembly's Pb-free solder joint.
      2  4
  • Publication
    Microstructure study of mix assembly lead-free sn-ag-cu ball grid array and Sn-10Cu solder paste
    ( 2022-01-24)
    Rita Mohd Said
    ;
    Sulwarajan K.A.P.
    ;
    Razak N.R.A.
    ;
    Flora Somidin
    ;
    Zaimi N.S.M.
    In recent years, electronic technologies have been striving to minimize the use of lead in their manufacturing and production. As a result, the electronic packaging industry is slowly transitioning from lead solder to lead-free solder. Though environmentally lead-free solders are advantageous, there are still needs some work in meeting current technological demand and requirements. In this study, the microstructure analysis on lead-free Sn-Ag-Cu Ball Grid Array (BGA) and Sn10Cu solder paste was done. The main aim of this study is to investigate the effect of isothermal aging on the microstructure of the solder paste joint and evaluate the intermetallic compound (IMC) thickness on the solder joint reliability. Optical Microscope (OM) and ImageJ software have been utilized to study the bulk solder microstructure. The results show that the bulk microstructure consists of β-Sn and Cu6Sn5/β-Sn eutectic phases. The IMC layer has undergone rapid growth with increasing aging temperature and time. The two main IMC layers (Cu3Sn and Cu6Sn5) grew thicker due to high temperature. The growth kinetic of Sn10Cu resulted in 16.70 kJ/mol activation level. Therefore, the significance of the findings from this study might provide a potential answer for future development for highly reliable solder joint applications.
      2  3