Flora Somidin
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Preferred name
Flora Somidin
Official Name
Flora, Somidin
Alternative Name
Somidin, F.
Somidin, Flora
Main Affiliation
Scopus Author ID
54973802500
Researcher ID
GPF-4634-2022

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  • Publication
    Microstructural evolution of Cu/Sn-58Bi/Sn-3.0Ag-0.5Cu composite solder joint during isothermal aging
    (IOP Publishing Ltd, 2022-01-24)
    Flora Somidin
    ;
    Bakar M.F.A.
    ;
    Razak N.R.A.
    A composite solder joints made of Cu/Sn-58Bi/Sn-3.0Ag-0.5Cu (in weight percent) was successfully fabricated. The composite solder was made from combining a Sn-3.0Ag-0.5Cu solder ball and Sn-58Bi solder paste. The composite solder was reflowed on Cu-OSP (copper-organic solderability preservatives) substrate to form a composite solder joint. The microstructure evolution of the composite solder joints under different reflow temperature and thermal aging conditions were investigated using an optical microscope. This study shows that a composite solder joint of SAC305/Sn-58Bi can be assembled at lower temperature (160 °C) and gradually mixed through isothermal aging.
      3  5
  • Publication
    Microstructure study of mix assembly lead-free sn-ag-cu ball grid array and Sn-10Cu solder paste
    ( 2022-01-24)
    Rita Mohd Said
    ;
    Sulwarajan K.A.P.
    ;
    Razak N.R.A.
    ;
    Flora Somidin
    ;
    Zaimi N.S.M.
    In recent years, electronic technologies have been striving to minimize the use of lead in their manufacturing and production. As a result, the electronic packaging industry is slowly transitioning from lead solder to lead-free solder. Though environmentally lead-free solders are advantageous, there are still needs some work in meeting current technological demand and requirements. In this study, the microstructure analysis on lead-free Sn-Ag-Cu Ball Grid Array (BGA) and Sn10Cu solder paste was done. The main aim of this study is to investigate the effect of isothermal aging on the microstructure of the solder paste joint and evaluate the intermetallic compound (IMC) thickness on the solder joint reliability. Optical Microscope (OM) and ImageJ software have been utilized to study the bulk solder microstructure. The results show that the bulk microstructure consists of β-Sn and Cu6Sn5/β-Sn eutectic phases. The IMC layer has undergone rapid growth with increasing aging temperature and time. The two main IMC layers (Cu3Sn and Cu6Sn5) grew thicker due to high temperature. The growth kinetic of Sn10Cu resulted in 16.70 kJ/mol activation level. Therefore, the significance of the findings from this study might provide a potential answer for future development for highly reliable solder joint applications.
      2  3