Microstructural evolution of Cu/Sn-58Bi/Sn-3.0Ag-0.5Cu composite solder joint during isothermal aging

Flora Somidin; Bakar M.F.A.; Razak N.R.A.

Microstructural evolution of Cu/Sn-58Bi/Sn-3.0Ag-0.5Cu composite solder joint during isothermal aging

Journal

Journal of Physics: Conference Series

ISSN

17426588

Date Issued

2022-01-24

Author(s)

Flora Somidin

Universiti Malaysia Perlis

Bakar M.F.A.

Razak N.R.A.

DOI

10.1088/1742-6596/2169/1/012024

Handle (URI)

https://hdl.handle.net/20.500.14170/4973

Abstract

A composite solder joints made of Cu/Sn-58Bi/Sn-3.0Ag-0.5Cu (in weight percent) was successfully fabricated. The composite solder was made from combining a Sn-3.0Ag-0.5Cu solder ball and Sn-58Bi solder paste. The composite solder was reflowed on Cu-OSP (copper-organic solderability preservatives) substrate to form a composite solder joint. The microstructure evolution of the composite solder joints under different reflow temperature and thermal aging conditions were investigated using an optical microscope. This study shows that a composite solder joint of SAC305/Sn-58Bi can be assembled at lower temperature (160 °C) and gradually mixed through isothermal aging.