Now showing 1 - 6 of 6
  • Publication
    Abrasive wear performance of repair welds on R260 rail using different welding electrodes
    (Elsevier, 2025-06)
    Prapas Muangjunburee
    ;
    Hein Zaw Oo
    ;
    ;
    Buntoeng Srikarun
    This study compares the abrasion resistance of unrepaired base rail steel grade R260 to three different welds repaired using shielded metal arc welding (SMAW). Three different types of pearlitic covered electrodes were utilized in this study. Rail steel and repaired weld metals were examined for chemical composition, microstructure, hardness, wear test, and worn surface. The repaired weld metal using covered electrodes A, B, and C featured acicular ferrite and bainitic structure, while the original rail steel grade R260 possessed a pearlite matrix. The results showed that wear resistance did not correlate with hardness values. The wear resistance of the rail steel was highest, while its hardness was lowest. Covered electrode C, on the other hand, has the highest hardness but the lowest wear resistance. The worn surface of the repaired weld metal employing covered electrode A dominated micro-cutting mechanism. Micro ploughing and micro fracturing occurred in the weld metal of covered electrodes B and C during abrasion test. Therefore, covered electrode A performed best in this repair welding of R260 rail steel.
  • Publication
    Microstructural analysis of martensitic hard surfacing on low chromium alloy steel
    (Wiley, 2023)
    Hein Zaw Oo
    ;
    Prapas Muangjunburee
    ;
    ;
    Teerachod Treeparee
    ;
    Buntoeng Srikarun
    This study focuses on the metallurgical characterization of single and multi-layer martensitic hard surfacing onto non-standardized low-chromium alloy steel with a single buttering layer using an automatic submerged arc welding process as a standard reference. The metallurgical properties of hard surfaced samples are examined using an optical microscope, energy dispersive x-ray spectroscopy, and x-ray diffractometer. Micro-Vickers hardness testing is also conducted to analyze and confirm the metallographic results of hard surfacing. The current study finds that the microstructure of each region is influenced by three key factors: chemical composition, heat input, and dilution. The structural type is determined by the chemical composition of materials, heat input influences the structural characteristics in the heat-affected zone (needle-shape martensite and tempered martensite), and dilution affects the structural characteristics of the hard surfacing layers (martensite with retained austenite). Comparing multi-layer hard surfacing to single-hard surfacing, the hardness values of the heat-affected zone of the multi-layer hard surfacing are greatly reduced, while the hardness values of the hard surfacing layers are raised.
      11  3
  • Publication
    Performance of Sn-3.0Ag-0.5Cu composite solder with kaolin geopolymer ceramic reinforcement on microstructure and mechanical properties under isothermal ageing
    ( 2021)
    Nur Syahirah Mohamad Zaimi
    ;
    ;
    Andrei Victor Sandu
    ;
    ; ; ;
    Petrica Vizureanu
    ;
    ;
    Mohd Izrul Izwan Ramli
    This paper elucidates the effect of isothermal ageing at temperature of 85 °C, 125 °C and 150 °C for 100, 500 and 1000 h on Sn-3.0Ag-0.5Cu (SAC305) lead-free solder with the addition of 1 wt% kaolin geopolymer ceramic (KGC) reinforcement particles. SAC305-KGC composite solders were fabricated through powder metallurgy using a hybrid microwave sintering method and reflowed on copper substrate printed circuit board with an organic solderability preservative surface finish. The results revealed that, the addition of KGC was beneficial in improving the total thickness of interfacial intermetallic compound (IMC) layer. At higher isothermal ageing of 150 °C and 1000 h, the IMC layer in SAC305-KGC composite solder was towards a planar-type morphology. Moreover, the growth of total interfacial IMC layer and Cu3Sn layer during isothermal ageing was found to be controlled by bulk diffusion and grain-boundary process, respectively. The activation energy possessed by SAC305-KGC composite solder for total interfacial IMC layer and Cu3Sn IMC was 74 kJ/mol and 104 kJ/mol, respectively. Based on a lap shear test, the shear strength of SAC305-KGC composite solder exhibited higher shear strength than non-reinforced SAC305 solder. Meanwhile, the solder joints failure mode after shear testing was a combination of brittle and ductile modes at higher ageing temperature and time for SAC305-KGC composite solder.
      2  10
  • Publication
    Erosion wear characteristics of novel AMMC produced using powder metallurgy
    ( 2021)
    Rajesh Kumar Behera
    ;
    Birajendu Prasad Samal
    ;
    Sarat Chandra Panigrahi
    ;
    Pramod Kumar Parida
    ;
    Kamalakanta Muduli
    ;
    ;
    Nitaisundar Das
    ;
    Currently, the world of material requires intensive research to discover a new-class of materials those posses the properties like lower in weight, greater in strength and better in mechanical properties. This led to the study of light and strong alloys or composites. This study focuses to produce current novel aluminium composite with an appreciable density, good machinable characteristics, less corrosive, high strength, light weight and low manufacturing cost product. In this research, an aluminium metal matrix composites (AMMC) (Al-0.5Si-0.5Mg-2.5Cu-15SiC) was developed using the metallurgical powdered method and subjected to the investigation of erosion wear characteristics. Here the solid particle erosion test was conducted on AMMC samples. The article presents, the design of Taguchi experiments and statistical techniques of erosion wear characteristics and the behaviors of the composite. The rate of erosion wear found to decrease with increasing impact angle, regardless of the rate of impact. With higher impact velocity erosion rate increases but decreases with stand of distance.
      2  9
  • Publication
    Performance of Sn-3.0Ag-0.5Cu composite solder with Kaolin geopolymer ceramic reinforcement on microstructure and mechanical properties under isothermal ageing
    ( 2021)
    Nur Syahirah Mohamad Zaimi
    ;
    ;
    Andrei Victor Sandu
    ;
    ; ; ;
    Petrica Vizureanu
    ;
    ;
    Mohd Izrul Izwan Ramli
    This paper elucidates the effect of isothermal ageing at temperature of 85 °C, 125 °C and 150 °C for 100, 500 and 1000 h on Sn-3.0Ag-0.5Cu (SAC305) lead-free solder with the addition of 1 wt% kaolin geopolymer ceramic (KGC) reinforcement particles. SAC305-KGC composite solders were fabricated through powder metallurgy using a hybrid microwave sintering method and reflowed on copper substrate printed circuit board with an organic solderability preservative surface finish. The results revealed that, the addition of KGC was beneficial in improving the total thickness of interfacial intermetallic compound (IMC) layer. At higher isothermal ageing of 150 °C and 1000 h, the IMC layer in SAC305-KGC composite solder was towards a planar-type morphology. Moreover, the growth of total interfacial IMC layer and Cu3Sn layer during isothermal ageing was found to be controlled by bulk diffusion and grain-boundary process, respectively. The activation energy possessed by SAC305-KGC composite solder for total interfacial IMC layer and Cu3Sn IMC was 74 kJ/mol and 104 kJ/mol, respectively. Based on a lap shear test, the shear strength of SAC305-KGC composite solder exhibited higher shear strength than non-reinforced SAC305 solder. Meanwhile, the solder joints failure mode after shear testing was a combination of brittle and ductile modes at higher ageing temperature and time for SAC305-KGC composite solder.
      2  15
  • Publication
    Performance of Sn-3.0Ag-0.5Cu somposite solder with kaolin geopolymer ceramic reinforcement on microstructure and mechanical properties under isothermal ageing
    ( 2021)
    Nur Syahirah Mohamad Zaimi
    ;
    ;
    Andrei Victor Sandu
    ;
    ; ; ;
    Petrica Vizureanu
    ;
    Mohd Izrul Izwan Ramli
    ;
    This paper elucidates the effect of isothermal ageing at temperature of 85 °C, 125 °C and 150 °C for 100, 500 and 1000 h on Sn-3.0Ag-0.5Cu (SAC305) lead-free solder with the addition of 1 wt% kaolin geopolymer ceramic (KGC) reinforcement particles. SAC305-KGC composite solders were fabricated through powder metallurgy using a hybrid microwave sintering method and reflowed on copper substrate printed circuit board with an organic solderability preservative surface finish. The results revealed that, the addition of KGC was beneficial in improving the total thickness of interfacial intermetallic compound (IMC) layer. At higher isothermal ageing of 150 °C and 1000 h, the IMC layer in SAC305-KGC composite solder was towards a planar-type morphology. Moreover, the growth of total interfacial IMC layer and Cu3Sn layer during isothermal ageing was found to be controlled by bulk diffusion and grain-boundary process, respectively. The activation energy possessed by SAC305-KGC composite solder for total interfacial IMC layer and Cu3Sn IMC was 74 kJ/mol and 104 kJ/mol, respectively. Based on a lap shear test, the shear strength of SAC305-KGC composite solder exhibited higher shear strength than non-reinforced SAC305 solder. Meanwhile, the solder joints failure mode after shear testing was a combination of brittle and ductile modes at higher ageing temperature and time for SAC305-KGC composite solder.
      2  31