Conference Publications

Permanent URI for this collection

https://hdl.handle.net/20.500.14170/379

Browse

Browsing Conference Publications by Subject "Contact angle"
  • Publication
    The effect of the epoxy curing method on the encapsulation of led
    (Springer, 2023)
    Kaalidass Muniary
    ;
    Mohd Syakirin Rusdi
    ;
    Mohd Sharizal Abdul Aziz
    ;
    Roslan Kamaruddin
    ;
    Muhammad Hafifi Hafiz Ishak
    ;
    Md. Abdul Alim
    ;
    Mohd Arif Anuar Mohd Salleh
    The electronic sector is developing novel products that are smaller and faster, with better performance, lighter containers, and are more cost effective. An integrated circuit can be used to link several LEDs with different functions to electronic devices packaged. The space between the cover lens and the LED chip is filled with a non-conductive polymeric substance, like epoxy or transparent silicone encapsulant. The goal of encapsulation is to protect the device from physical forces that could weaken the connection between the chip and the substrate. The research is focusing on the experimental investigation of the effect of epoxy on the encapsulation process in LED. The different parameters that affect the encapsulation process, such as needle size, type of epoxy resin, and method of curing, have been studied. The contact angle and contact surface area of each type of epoxy were measured after the curing process. Using a syringe and five different needle sizes, the three types of epoxy resin and hardener are manually injected onto the wafer substrate. ImageJ was used to measure the contact angle and contact area. The results of the experiment demonstrated that the 1:1 self-curing epoxy resin is the most effective type of epoxy resin, as its contact angle and surface area of contact have optimal values. The 21G needle size produces acceptable results in the encapsulation procedure. The contact angle and surface area of contact measurements for this project will determine the appropriate epoxy to use.