Conference Publications

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https://hdl.handle.net/20.500.14170/379

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Browsing Conference Publications by Author "Ahmad Azmin Mohammad"
  • Publication
    Effect of surface-treated filler on the wettability of composite solder: short review
    (Springer, 2023)
    Wan Hafizah Mohd Saufee
    ;
    Wai Keong Leong
    ;
    Ahmad Azmin Mohammad
    ;
    Muhammad Firdaus Mohd Nazeri
    This paper evaluates and analyzes the effect of surface-treated filler on the wettability of composite solder. The basic concepts, key variables, arrangement, and most recent advances on wettability effect of selected surface treatment of ceramic-reinforced composite lead-free solder will be covered. The wettability characteristics of solders serve as the connection between the ceramic support and were found to be significantly improved by the ceramic filler with surface treatment as it minimizes the agglomeration caused by density differences and the Van der Waals attraction force. After the surface modification procedure, it was also possible to see the good dispersion of ceramic reinforcement in the solder as it assists filler in overcoming the Van der Waals attraction on the particle. Based on ultrasonic, electroless plating, and pyrolysis treatment that have been reviewed, the wettability of the composite solder is observed to be better than the untreated or initial pure solder without filler as surface treatment helps filler molecules effectively confine the mobility of the grain boundaries due to excellent interfacial bonding with Zener pinning effect. In solder, where mechanical aspect is one of the most important properties, substantial advancements in mechanical qualities have partially resulted from surface treatment of the ceramic reinforcement. Study on filler surface treatment has beneficially influences the improvement of the ceramic reinforcement-solder interfacial response and opens prospects for more specific future research lines and composite solder application opportunities as the response from surface treatment greatly impact the solder’s wettability and its reliability as lead-free solder (LFS) product that can substitute the traditional lead-based solder.
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