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Browsing Conference Publications by Author "Ahmad Azmin Mohamad"
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PublicationEffect additions Zn on Sn-0.7Cu lead-free solder: a short brief(IOP Publishing, 2020)
;Fatin Sufina Mohd Tarmizi ;Mohamad Najmi Masri ;Ahmad Azmin MohamadSn-0.7Cu lead-free solder is an alternative solder material that suitable to replace Sn-Pb solder in electronic manufacturing. However, it has a weakness of high melting temperature and lower mechanical strength. In this study, the change in microstructure, elements, the structural and melting point of Sn-0.7Cu after the addition of different compositions of Zn element was discussed. The result shows that after adding a small amount of Zn, a refinement microstructure of Sn-0.7Cu-xZn solder alloy was obtained, and the melting point of the solder decreased from 227.7 °C to 225.7 °C. Besides, the formation new phase of was investigated by scanning electron microscope (SEM) followed by energy-dispersive x-ray spectroscopy (EDX) and x-ray diffraction (XRD). Besides, the behaviour of Sn-0.7Cu-xZn solder alloy can be further studied via open circuit potential (OCP) to determine the corrosion potential.31 2 -
PublicationThe effect of Al micro-alloying on corrosion and thermal properties of Sn-Zn alloy(Trans Tech Publications Ltd., 2020)
;Nordarina Jumali ;Nurwahida Mohd Zaini ;Nur Syamira Sa'don ;Ahmad Azmin MohamadElectrochemical corrosion behavior of Sn–Zn solder alloys in 6 M potassium hydroxide solution was investigated by potentiodynamic polarization technique, aiming to investigate the role of Al additions. The effect of micro-alloying Al on the thermal properties was also studied by using DSC. The results reveal that the presence of Al content leads to increasing in corrosion potential yet reducing the corrosion current density and passivation current density, simultaneously. XRD analysis reveals the failure to produce new compound with Zn, limits the effect of adding Al towards the corrosion performance. Yet, significant improvement on thermal properties were seen, especially on the melting temperature and pasty range without modifying the eutectic melting behavior.