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Effect of surface-treated filler on the wettability of composite solder: short review

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cris.virtual.department Universiti Malaysia Perlis
cris.virtualsource.department 22938211-1c5b-44cd-9e58-7a41bc2cc83b
dc.contributor.author Wan Hafizah Mohd Saufee
dc.contributor.author Wai Keong Leong
dc.contributor.author Ahmad Azmin Mohammad
dc.contributor.author Muhammad Firdaus Mohd Nazeri
dc.date.accessioned 2026-01-05T03:19:10Z
dc.date.available 2026-01-05T03:19:10Z
dc.date.issued 2023
dc.description.abstract This paper evaluates and analyzes the effect of surface-treated filler on the wettability of composite solder. The basic concepts, key variables, arrangement, and most recent advances on wettability effect of selected surface treatment of ceramic-reinforced composite lead-free solder will be covered. The wettability characteristics of solders serve as the connection between the ceramic support and were found to be significantly improved by the ceramic filler with surface treatment as it minimizes the agglomeration caused by density differences and the Van der Waals attraction force. After the surface modification procedure, it was also possible to see the good dispersion of ceramic reinforcement in the solder as it assists filler in overcoming the Van der Waals attraction on the particle. Based on ultrasonic, electroless plating, and pyrolysis treatment that have been reviewed, the wettability of the composite solder is observed to be better than the untreated or initial pure solder without filler as surface treatment helps filler molecules effectively confine the mobility of the grain boundaries due to excellent interfacial bonding with Zener pinning effect. In solder, where mechanical aspect is one of the most important properties, substantial advancements in mechanical qualities have partially resulted from surface treatment of the ceramic reinforcement. Study on filler surface treatment has beneficially influences the improvement of the ceramic reinforcement-solder interfacial response and opens prospects for more specific future research lines and composite solder application opportunities as the response from surface treatment greatly impact the solder’s wettability and its reliability as lead-free solder (LFS) product that can substitute the traditional lead-based solder.
dc.identifier.doi 10.1007/978-981-19-9267-4_86
dc.identifier.isbn 9789811992667
dc.identifier.isbn 9789811992674
dc.identifier.uri https://link.springer.com/chapter/10.1007/978-981-19-9267-4_86
dc.identifier.uri https://link.springer.com/
dc.identifier.uri https://hdl.handle.net/20.500.14170/15611
dc.language.iso en
dc.publisher Springer
dc.relation.conference Green Materials and Electronic Packaging Interconnect Technology Symposium (EPITS 2022), 14-15 September 2022, Langkawi, Malaysia.
dc.relation.ispartof Springer Proceedings in Physics
dc.relation.ispartof Proceedings of the Green Materials and Electronic Packaging Interconnect Technology Symposium
dc.relation.issn 0930-8989
dc.relation.issn 1867-4941
dc.subject Composite solder
dc.subject Filler
dc.subject Lead-free solder
dc.subject Surface treatment
dc.title Effect of surface-treated filler on the wettability of composite solder: short review
dc.type Resource Types::text::conference output::conference proceedings::conference paper
dspace.entity.type Publication
oaire.citation.endPage 875
oaire.citation.startPage 865
oaire.citation.volume 289
oairecerif.author.affiliation Universiti Malaysia Perlis
oairecerif.author.affiliation Universiti Malaysia Perlis
oairecerif.author.affiliation Universiti Sains Malaysia
oairecerif.author.affiliation Universiti Malaysia Perlis
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