Optimizing electroplating process parameter and Sn-Plating thickness uniformity using modified shielding

Uneven plating thickness distribution across plated surface has become a major challenge in electroplating industry mainly due to the complexity of package design. In most cases, controlling the plating thickness uniformity to the specific area according to the required package design specification can be a challenging task for the manufacturer which can result in high losses. The plating thickness uniformity are closely related with the electroplating process parameter and the passage of current between anodes to cathode. To deal with the current passage, a shielding technique that control the disposed area between the anode and cathode can be an effective way. Therefore, the aim of this paper is to study the electroplating process parameters (current and speed) for improving the Sn-plating thickness uniformity using modified mechanical shielding. Taguchi method is adopted to reduce the size of experiment and optimize the process parameters simultaneously. As a result, new parameter has been established which offer ideal plating thickness with less variation and stable Cpk. From the conducted experimental work, it shows that by employing the right physical resistance shielding aperture able to selectively alter or modulate the electric fields between the anode and the plating surface on the embodiment and thereby control the electro deposition rate across the area of the plating surface.