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Simulation and analysis of Piezoresistive microcantilever

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cris.virtual.department Universiti Malaysia Perlis
cris.virtual.department Universiti Malaysia Perlis
cris.virtual.department Universiti Malaysia Perlis
cris.virtualsource.department 2130c795-2a13-4003-a5a5-72cfd791cf8a
cris.virtualsource.department f1aef82c-112c-498c-83b6-a52e0a173352
cris.virtualsource.department 914e7f62-9f3a-4942-8289-aa77b587fee3
dc.contributor.author Shazlina Johari
dc.contributor.author Catherine Lim Ee Chen
dc.contributor.author Bibi Nadia Taib
dc.contributor.author Mohd Hafiz Ismail
dc.contributor.author Siti Noorjannah Ibrahim
dc.date.accessioned 2024-10-14T02:30:26Z
dc.date.available 2024-10-14T02:30:26Z
dc.date.issued 2023-12
dc.description.abstract Currently, most piezoresistive microcantilever sensors are configured with a dual-layer design that includes a piezoresistor integrated onto the upper surface of a microcantilever. The dual-layer design effectively enhances sensitivity and the piezoresistance effect. However, integrating the piezoresistor onto the microcantilever in the fabrication process necessitates additional steps, leading to extended manufacturing times and increased production costs. In this paper, the mechanical behavior of a single-layer piezoresistive microcantilever, namely displacement, stress, and strain, is investigated and analyzed using ANSYS Multiphysics. The contributing factors expected to affect the device's performance are its geometrical dimensions, and the materials used. Regarding the device dimensions, the length, thickness, and width of the cantilever were varied. It was found that the performance of the piezoresistive microcantilever can be improved by increasing the length and decreasing the thickness. The displacement of the microcantilevers increased by about 230%, from 75.76μm to 250.12μm, when the length was increased from 225μm to 350μm. The applied force ranged from 2uN to 12uN. Similarly, the stress and strain produced on the microcantilevers also increased by about 60.83% and 57.22%, respectively. From the material point of view, the microcantilever made with silicon always had the highest displacement value compared to silicon nitride, silicon dioxide, and polysilicon. This is due to the Young's modulus value, where materials with lower Young's modulus will have higher displacement and stress.
dc.identifier.uri https://ejournal.unimap.edu.my/index.php/ijneam/issue/view/43
dc.identifier.uri https://hdl.handle.net/20.500.14170/9474
dc.language.iso en
dc.relation.ispartof International Journal of Nanoelectronics and Materials (IJNeaM)
dc.relation.issn 1985-5761
dc.subject Piezoresistive
dc.subject Microcantilever
dc.subject ANSYS
dc.title Simulation and analysis of Piezoresistive microcantilever
dc.type Resource Types::text::journal::journal article
dspace.entity.type Publication
oaire.citation.endPage 93
oaire.citation.issue Special Issue InCAPE 2023
oaire.citation.startPage 87
oaire.citation.volume 16
oairecerif.author.affiliation Universiti Malaysia Perlis
oairecerif.author.affiliation Universiti Malaysia Perlis
oairecerif.author.affiliation Universiti Malaysia Perlis
oairecerif.author.affiliation Universiti Malaysia Perlis
oairecerif.author.affiliation International Islamic University Malaysia
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