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Effect of multiple reflow cycles and isothermal aging on shear strength in SAC305Sn58BiCu-OSP hybrid solder joint

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cris.virtual.department Universiti Malaysia Perlis
cris.virtualsource.department b818f9b7-a3ab-438f-bd2c-40cf513d8798
dc.contributor.author Muhammad Luqman Mokhtar
dc.contributor.author Flora Somidin
dc.contributor.author Mohd Arif Anuar Mohd Salleh
dc.date.accessioned 2025-02-21T02:28:59Z
dc.date.available 2025-02-21T02:28:59Z
dc.date.issued 2024-12
dc.description.abstract This study investigates the effects of multiple reflow cycles and isothermal aging on the shear strength and microstructure of SAC305/Sn58Bi/Cu-OSP hybrid solder joints. The joints combine SAC305 solder spheres and Sn58Bi solder paste reflowed on Cu-OSP substrates. Microstructural analysis revealed two distinct regions: a Bi-rich phase at the bottom and an Ag-rich phase at the top. Reflow cycles and isothermal aging at 85 °C, 125 °C, and 150 °C for up to 120 hours were evaluated for their impact on mechanical performance and reliability. Shear tests at 100 mm/s and 2000 mm/s showed that hybrid joints outperformed conventional SAC305/Cu-OSP joints, even after multiple reflow cycles. Aging at 85 °C and 125 °C had minimal impact on shear strength, indicating good stability under moderate conditions. However, aging at 150 °C, above the melting point of Sn58Bi (138 °C), caused a significant decrease in strength. These findings highlight the potential of hybrid solder joints for improved mechanical performance and thermal stability, offering advantages over conventional solder joints for advanced electronic packaging.
dc.identifier.uri https://ejournal.unimap.edu.my/index.php/ijneam/article/view/1640/1008
dc.identifier.uri https://hdl.handle.net/20.500.14170/13704
dc.language.iso en
dc.relation.ispartof International Journal of Nanoelectronics and Materials (IJNeaM)
dc.relation.issn 1985-5761
dc.subject SAC305/Sn58Bi
dc.subject Hybrid solder joint
dc.subject Cu-OSP
dc.subject Isothermal aging
dc.subject Thermal cycling
dc.subject Mechanical properties
dc.title Effect of multiple reflow cycles and isothermal aging on shear strength in SAC305Sn58BiCu-OSP hybrid solder joint
dc.type Resource Types::text::journal::journal article
dspace.entity.type Publication
oaire.citation.endPage 346
oaire.citation.issue Special Issue ICOSM 2023
oaire.citation.startPage 341
oaire.citation.volume 17
oairecerif.author.affiliation Universiti Malaysia Perlis
oairecerif.author.affiliation Universiti Malaysia Perlis
oairecerif.author.affiliation Universiti Malaysia Perlis
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International Journal of Nanoelectronics and Materials (IJNeaM)