This paper presents the process development and characterization towards microstructural realization using laser micromachining for MEMS. Laser micromachining technique is environmental friendly, fast patterning and able to avoid multi steps in conventional lithography based microfabrication techniques. This research focuses on understanding the dimensional properties of materials of the laser beam on the silicon wafers where microstructures were fabricated. Four main parameters like rectangular variable aperture (RVA-XY) size, number of pulse, stage/table feed rate and laser energy play important role in laser ablation process. The pattern of the microchannel or line with 1 cm length was drawn by AutoCAD software or any CAD software. The pattern in the CAD software is then transferred onto the silicon wafer by using laser micromachining. Finally, high power microscope (HPM) and Stylus Profiler will be used as measurement tools for observing and analysing the width and depth of the microchannel structures fabricated by laser micromachining. When using bigger size of RVA, it will lead to bigger microchannel width. There are a little effects or almost comparable in term of microchannel depth if varying all parameters’ value. Surface roughness test also needs to be considered before choosing the best setting for the laser ablation.
