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Effect of temperature on solder paste during surface mount technology printing

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cris.virtual.department Universiti Malaysia Perlis
cris.virtualsource.department b818f9b7-a3ab-438f-bd2c-40cf513d8798
dc.contributor.author Nur Hidayah Mansor
dc.contributor.author Mohd Sharizal Abdul Aziz
dc.contributor.author Nina Amanina Marji
dc.contributor.author Mohd Arif Anuar Mohd Salleh
dc.date.accessioned 2025-11-10T08:08:13Z
dc.date.available 2025-11-10T08:08:13Z
dc.date.issued 2020
dc.description.abstract There are lots of companies manufacturing electronic components that have commonly used the Surface Mount Technology printing process. However, the temperature of solder paste printing on the Printed Circuit Board can influence the presence of defects in Surface Mount Technology. In this paper, the experiment called Surface Mount Technology printing is built and tested to characterize the temperature of solder pastes in order to prevent the electronic waste and rejection rate of the malfunctioning electronics due to poor soldering. The microstructures of solder paste on printed circuit board and copper substrate are inspected under Scanning Electron Microscopy. It is focused on two parameters that affect the performance of a printed circuit board, which includes the filling areas of solder paste and the distance between ball grid arrays. From the experiment and analysis results, the filling area decreases as the temperature increases during the Surface Mount Technology printing process. In short, when the temperature of SAC305 increases, the viscosity and filling areas decreases. In fact, SAC305 gave the second rank of smallest area (18.86%) and distance (43.43%) after SAC307. The average area and distance are fair enough for the solder to hold the component placement, unlike SAC307 which likely causes tombstone.
dc.identifier.doi 10.37934/arfmts.75.3.99107
dc.identifier.uri https://www.akademiabaru.com/doc/ARFMTSV75_N3_P99_107.pdf
dc.identifier.uri https://semarakilmu.com.my/journals/index.php/fluid_mechanics_thermal_sciences/index
dc.identifier.uri https://hdl.handle.net/20.500.14170/15038
dc.language.iso en
dc.publisher Semarak Ilmu Publishing
dc.relation.ispartof Journal of Advanced Research in Fluid Mechanics and Thermal Sciences
dc.relation.issn 2289-7879
dc.subject E-waste
dc.subject SAC305 solder paste
dc.subject Scanning electron microscope
dc.subject Solder paste
dc.subject Surface mount technology printing
dc.title Effect of temperature on solder paste during surface mount technology printing
dc.type journal-article
dspace.entity.type Publication
oaire.citation.endPage 107
oaire.citation.issue 3
oaire.citation.startPage 99
oaire.citation.volume 75
oairecerif.author.affiliation Universiti Sains Malaysia
oairecerif.author.affiliation Universiti Sains Malaysia
oairecerif.author.affiliation Universiti Sains Malaysia
oairecerif.author.affiliation Universiti Malaysia Perlis
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