The focus of this study was to analyse the stress and thermal flow of thermal microactuator with different type of materials and parameter using COMSOL Multiphysics software. Simulations were conducted on the existing thermal actuator and integrated it to be more efficient, low cost and low power consumption. In this simulation, the U-shaped actuator was designed and five different materials of the microactuator were studied. The result showed that Si Polycrystalline was the most suitable material used to produce thermal actuator for commercialization.
