Publication:
Thermal Properties of the Graphene Oxide (GO) Reinforced Epoxy Composites (Thermal Adhesive Liquid Type): Application of Thermal Interface Materials

cris.author.scopus-author-id 56494026700
cris.author.scopus-author-id 57210546407
cris.author.scopus-author-id 57214125417
cris.author.scopus-author-id 35300412500
cris.author.scopus-author-id 57190065259
cris.author.scopus-author-id 57191289590
cris.author.scopus-author-id 57189231658
cris.virtual.department Universiti Malaysia Perlis
cris.virtual.department Universiti Malaysia Perlis
cris.virtualsource.department da3e7907-a60a-4754-b368-88319bd30764
cris.virtualsource.department 6c4c2dbc-3687-4b16-9d87-44e5034d361a
dc.contributor.author Mohamed M.
dc.contributor.author Mohd Nazri Omar
dc.contributor.author Mohamad Shaiful Ashrul Ishak
dc.contributor.author Rahman R.
dc.contributor.author Hamid M.F.
dc.contributor.author Kataraki P.S.
dc.contributor.author Azhar A.B.M.
dc.date.accessioned 2024-09-29T06:36:33Z
dc.date.available 2024-09-29T06:36:33Z
dc.date.issued 2021-01-01
dc.description.abstract Epoxy mixed with others filler for thermal interface material (TIM) has been well researched. There are some issues occurs when epoxy is used as matrix material likes non-uniform thickness of thermal interface material produce, time taken for solidification and others. New high-performance phase change material (PCM) using graphene as main material to overcome the existing problem and at the same time to increase thermal conductivity. Three types of composite graphene were used for thermal interface material in this research. The sample that contain 10, 20 and 30 wt. % of graphene was used with different contain of graphene oxide (GO). The thermal conductivity of thermal interface material is both measured and it was found that the increase of amount of graphene used will increase the thermal conductivity of thermal interface material. The highest thermal conductivity is 12.8 W/(mK) with 30 w.% graphene. The comparison between the present thermal interface material and other thermal interface material show that this present graphene composite is a commendable thermal interface material in increasing thermal conductivity and reducing thermal contact resistance.
dc.identifier.doi 10.1007/978-981-16-0866-7_81
dc.identifier.isbn [9789811608650]
dc.identifier.scopus 2-s2.0-85111872479
dc.identifier.uri https://hdl.handle.net/20.500.14170/6129
dc.language.iso en
dc.relation.grantno undefined
dc.relation.ispartof Lecture Notes in Mechanical Engineering
dc.relation.ispartofseries Lecture Notes in Mechanical Engineering
dc.relation.issn 21954356
dc.subject Graphene | Graphene Oxide (GO) | Thermal conductivity | Thermal Interface Material (TIM)
dc.title Thermal Properties of the Graphene Oxide (GO) Reinforced Epoxy Composites (Thermal Adhesive Liquid Type): Application of Thermal Interface Materials
dc.type Book Series
dspace.entity.type Publication
oaire.citation.endPage 940
oaire.citation.startPage 933
oairecerif.affiliation.orgunit Universiti Malaysia Kelantan
oairecerif.affiliation.orgunit Universiti Malaysia Perlis
oairecerif.affiliation.orgunit Universiti Malaysia Perlis
oairecerif.affiliation.orgunit Universiti Malaysia Perlis
oairecerif.affiliation.orgunit Universiti Sains Malaysia
oairecerif.affiliation.orgunit REVA University
oairecerif.affiliation.orgunit Metal Work Pneumatic(M) Sdn Bhd
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oairecerif.author.affiliation Universiti Malaysia Perlis
oairecerif.author.affiliation Universiti Malaysia Perlis
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person.identifier.scopus-author-id 56494026700
person.identifier.scopus-author-id 57210546407
person.identifier.scopus-author-id 57214125417
person.identifier.scopus-author-id 35300412500
person.identifier.scopus-author-id 57190065259
person.identifier.scopus-author-id 57191289590
person.identifier.scopus-author-id 57189231658
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