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  5. Warpage analysis of thick shell part (thickness above 2mm) by using response surface methodology (RSM) and genetic algorithm (GA)
 
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Warpage analysis of thick shell part (thickness above 2mm) by using response surface methodology (RSM) and genetic algorithm (GA)

Journal
AIP Conference Proceedings
ISSN
0094243X
Date Issued
2019-07-30
Author(s)
Sim Y.S.
Nasir S.M.
Fathullah M.
Irfan A.R.
Hazwan M.H.M.
DOI
10.1063/1.5118210
Handle (URI)
https://hdl.handle.net/20.500.14170/10592
Abstract
In this research, Response Surface Methodology (RSM) and Genetic Algorithm (GA) are applied in order to optimise the warpage value of an upper case of a wireless optical mouse with thickness above 2mm. The material of the part is Acrylonitrile Butadiene Styrene (ABS) with trade name Toyolac 700-314. The parameter used in this research are melt temperature, mould temperature, cooling time and packing time. Based on simulation result obtained from Autodesk Moldflow Insight (AMI) 2012, the warpage value based on recommended process parameter settings is 0.4295mm. From Response Surface Methodology (RSM), the warpage value optimized to 0.412728mm which is 3.91% optimized than AMI simulation. Besides, from RSM, it shows that the most significant parameter in this research is mould temperature. From Genetic Algorithm (GA), the warpage is optimized to 0.402675mm, which is 6.25% optimized than AMI simulation. Thus, this indicates that GA is a better optimization approach than RSM.
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